Patents by Inventor Teruyuki Ishihara

Teruyuki Ishihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9756735
    Abstract: A method for manufacturing a printed wiring board includes forming on carrier a laminate including a second metal foil, a resin layer laminated on the second foil and a first metal foil laminated on the resin layer, irradiating laser upon the first foil such that opening is formed through the first foil and resin layer and exposes surface of the second foil at bottom, plating the first foil such that a via conductor is formed in the opening and a first conductor layer including the first foil and an electroplating film is formed on surface of the resin layer, removing the carrier from the laminate, patterning the first conductor layer on the resin layer, and patterning the second foil such that a second conductor layer including the second foil is formed on opposite surface of the resin layer. The second foil has thickness greater than thickness of the first foil.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: September 5, 2017
    Assignee: IBIDEN CO., LTD.
    Inventor: Teruyuki Ishihara
  • Publication number: 20170245365
    Abstract: A printed wiring board includes a laminate, a wiring layer formed on first main surface of the laminate and including conductor pads, via conductors including first and second via conductors and formed in the laminate such that each via conductor has diameter gradually reducing from the first main surface toward second main surface of the laminate, and conductor post formed on the first via conductors such that each conductor post includes a metal foil and a plating layer formed on the metal foil. The via conductors are formed such that the first via conductors are positioned in an outer edge portion of the laminate and have minimum-diameter-side surfaces positioned to form a same plane with the second main surface of the laminate and that the second via conductors are positioned in a central portion of the laminate and have minimum-diameter-side surfaces recessed from the second main surface of the laminate.
    Type: Application
    Filed: February 24, 2017
    Publication date: August 24, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Haiying MEI
  • Publication number: 20170215282
    Abstract: A printed wiring board includes a conductor layer including a conductor circuit, a resin insulating layer formed on the conductor layer and having a via opening reaching to the conductor circuit of the conductor layer, and a via conductor formed in the via opening of the resin insulating layer such that the via conductor is connecting to the conductor circuit of the conductor layer. The conductor circuit of the conductor layer has a first conductor portion and a second conductor portion integrally formed such that the first conductor portion is connected to the via opening of the resin insulating layer, that the second conductor portion is surrounding the first conductor portion and that the first conductor portion has a thickness which is greater than a thickness of the second conductor portion.
    Type: Application
    Filed: January 25, 2017
    Publication date: July 27, 2017
    Applicant: IBIDEN CO., LTD.
    Inventor: Teruyuki ISHIHARA
  • Publication number: 20170196096
    Abstract: A printed wiring board includes a resin insulating layer, a projecting conductor layer formed on a surface of the resin insulating layer such that the projecting conductor layer is projecting from the surface of the resin insulating layer, and an integral conductor structure formed in the resin insulating layer and including a via conductor portion and an embedded conductor layer portion such that the embedded conductor layer portion is embedded in the resin insulating layer on the opposite side of the resin insulating layer with respect to the projecting conductor layer and has an exposed surface exposed from the resin insulating layer and the via conductor portion is formed through the resin insulating layer and is connecting the embedded conductor layer portion and projecting conductor layer. The projecting conductor layer and integral conductor structure are formed such that the projecting conductor layer and integral conductor structure are individual conductor structures.
    Type: Application
    Filed: January 5, 2017
    Publication date: July 6, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Ayumi SHIBATA, Kosuke IKEDA
  • Publication number: 20170196084
    Abstract: A printed wiring board includes a first insulating layer, a second conductor layer including first and second circuits, a second insulating layer covering the second conductor layer on the first insulating layer, a third conductor layer including first and second circuits, a third insulating layer covering the third conductor layer on the second insulating layer, a fourth conductor layer including first circuit, a second via conductor connecting the first circuits in the second and third conductor layers through the second insulating layer, and a first skip via conductor penetrating through the second circuit in the third conductor layer and connecting the second circuit in the second conductor layer and the first circuit in the fourth conductor layer through the second and third insulating layers. The second and third conductor layers are formed such that the second conductor layer has thickness t2 larger than thickness t3 of the third conductor layer.
    Type: Application
    Filed: January 5, 2017
    Publication date: July 6, 2017
    Applicant: IBIDEN CO., LTD.
    Inventor: Teruyuki ISHIHARA
  • Publication number: 20170127517
    Abstract: A printed wiring board includes a multilayer body, a first wiring layer formed on first surface of the body and including first pads, a second wiring layer embedded into second surface of the body and including second and third pads, conductor posts formed on the third pads, and via conductors formed in the body and having diameter reducing toward the second surface of the body. Each third pad has metal foil formed thereon such that each post is formed on the foil, the second wiring layer is formed such that the second pads are positioned to connect an electronic component in central portion of the second surface of the body and the third pads are positioned to connect another board in outer edge portion of the second surface of the body, and the second pads are formed such that each second pad has exposed surface recessed from the second surface.
    Type: Application
    Filed: October 31, 2016
    Publication date: May 4, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Haiying MEI
  • Patent number: 9635765
    Abstract: A method for manufacturing a combined wiring board includes preparing wiring boards, preparing a metal frame having opening portions formed to accommodate the wiring boards, respectively, positioning the wiring boards in the opening portions in the metal frame, and forming crimped portions in the metal frame by plastic deformation such that sidewalls of the metal frame in the opening portions bond sidewalls of each of the wiring boards. The crimped portions are formed such that the crimped portions in the metal frame have amounts of the plastic deformation which are set different for positions of the crimped portions in the metal frame.
    Type: Grant
    Filed: August 21, 2014
    Date of Patent: April 25, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Patent number: 9603238
    Abstract: A combined wiring board has multiple piece components each including a wiring board, and a frame component having an accommodation opening portion and holding the multiple piece components in the accommodation opening portion such that each of the piece components is fixed to the frame component at an outer rim of each of the piece components. The frame component has a thermal expansion coefficient in a planar direction which is set higher than a thermal expansion coefficient of the multiple piece components in the planar direction.
    Type: Grant
    Filed: November 11, 2013
    Date of Patent: March 21, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Michimasa Takahashi, Teruyuki Ishihara
  • Publication number: 20170064825
    Abstract: A printed wiring board includes a first circuit substrate having first and second surfaces, and a second circuit substrate having third and fourth surfaces such that the first substrate is laminated on the third surface and that the first and third surfaces are opposing each other. The second substrate includes a conductor layer, a first insulating layer including reinforcing material and formed on the conductor layer, and mounting via conductors formed in the first insulating layer and connected to the conductor layer such that the second substrate has a mounting area on the third surface and that the mounting via conductors have via bottoms forming pads positioned to mount an electronic component in the mounting area, and the first substrate includes an insulating layer which does not contain reinforcing material and has an opening through the insulating layer and exposing the via bottoms forming the pads in the mounting area.
    Type: Application
    Filed: August 31, 2016
    Publication date: March 2, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Haiying MEI, Hiroyuki BAN
  • Publication number: 20170064835
    Abstract: A printed wiring board includes a first circuit substrate having a first surface and a second surface on the opposite side, and a second circuit substrate having a third surface and a fourth surface on the opposite side such that the first circuit substrate is laminated on the third surface and that the first surface and the third surface are opposing each other. The second circuit substrate has a mounting area on the third surface and includes pads positioned to mount an electronic component in the mounting area and a connection wire structure connected to the pads, and the first circuit substrate includes through-hole conductors extending from the first surface to the second surface and connected to the pads through the connection wire structure and has an opening portion formed through the first circuit substrate such that the opening portion is exposing the pads formed in the mounting area.
    Type: Application
    Filed: August 31, 2016
    Publication date: March 2, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Haiying MEI, Hiroyuki BAN
  • Publication number: 20170053878
    Abstract: A printed wiring board includes a build-up layer including insulating and conductor layers, pads formed on surface of the build-up layer and including first pads to connect an electronic component and second pads to connect an external wiring board onto the surface of the build-up layer, a mold resin layer formed on the surface of the build-up layer such that the mold layer is covering the surface of the build-up layer and has a cavity exposing the first pads and openings exposing the second pads, and conductor posts formed in the openings and including plating material such that the posts are connected to the second pads. The plating material of the posts includes electroless plating layer and electrolytic plating layer, and the posts are formed such that each post has an end surface exposed from surface of the mold layer on the opposite side with respect to the second pads.
    Type: Application
    Filed: August 18, 2016
    Publication date: February 23, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: Kazuki KAJIHARA, Takema ADACHI, Teruyuki ISHIHARA, Kosuke IKEDA
  • Publication number: 20170033036
    Abstract: A printed wiring board includes a buildup wiring layer including resin insulation layers and conductive layers such that the conductive layers are laminated on the resin insulation layers, respectively, first pads formed in a center portion of a first surface of the buildup wiring layer and positioned to connect an electronic component, second pads formed on a periphery portion of the first surface of the buildup wiring layer and positioned to connect an external wiring board, a solder layer including a plating material and formed on the first pads such that the solder layer is formed on each of the first pads, conductive posts including a plating material and formed on the second pads, respectively, and a seed layer including first seed layer portions formed between the first pads and the solder layer and second seed layer portions formed between the second pads and the conductive posts.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 2, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: Kazuki KAJIHARA, Takema ADACHI, Teruyuki ISHIHARA
  • Patent number: 9538663
    Abstract: A method for manufacturing a combined wiring board includes providing a metal frame having an accommodation opening portion, positioning a wiring board in the accommodation opening portion of the metal frame, and subjecting the metal frame to plastic deformation such that a sidewall of the wiring board is connected to a sidewall of the metal frame inside the accommodation opening portion of the metal frame.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: January 3, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Patent number: 9480173
    Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer formed on first surfaces of the flexible and non-flexible substrates, a second wiring layer embedded in second surfaces of the flexible and non-flexible substrates, a first insulating layer covering the first surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the first surface of the flexible substrate, and a second insulating layer covering the second surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the second surface of the flexible substrate. The first wiring layer includes non-embedded wirings on the first surfaces of the flexible and non-flexible substrates, and the second wiring layer includes embedded wirings in the second surfaces of the flexible and non-flexible substrates.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: October 25, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi, Takashi Kariya
  • Patent number: 9370101
    Abstract: A plug-in board replacement method includes preparing a board having a piece board, forming first conductive pattern on first surface of the board, forming second conductive pattern on second surface on the opposite side such that the second pattern is on the opposite side of the first pattern, irradiating laser upon the first and second surfaces along the first and second patterns such that the piece is cut out from the board, and fitting the piece into another board. The irradiating includes irradiating laser upon the first surface along the first pattern such that laser is irradiated along the border between edge portion of the first pattern and the first surface and laser upon the second surface along the second pattern such that laser is irradiated along the border between edge portion of the second pattern and the second surface such that the piece is cut out through the board.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: June 14, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Publication number: 20160113120
    Abstract: A method for manufacturing a printed wiring board includes forming on carrier a laminate including a second metal foil, a resin layer laminated on the second foil and a first metal foil laminated on the resin layer, irradiating laser upon the first foil such that opening is formed through the first foil and resin layer and exposes surface of the second foil at bottom, plating the first foil such that a via conductor is formed in the opening and a first conductor layer including the first foil and an electroplating film is formed on surface of the resin layer, removing the carrier from the laminate, patterning the first conductor layer on the resin layer, and patterning the second foil such that a second conductor layer including the second foil is formed on opposite surface of the resin layer. The second foil has thickness greater than thickness of the first foil.
    Type: Application
    Filed: October 19, 2015
    Publication date: April 21, 2016
    Applicant: IBIDEN CO., LTD.
    Inventor: Teruyuki ISHIHARA
  • Patent number: 9277655
    Abstract: A combined wiring board includes a wiring board set having multiple wiring boards and one or more adhesive agent portions such that the wiring boards are connected each other by the adhesive agent portion or adhesive agent portions, and a metal frame having an accommodation opening portion formed to accommodate the wiring board set such that the wiring board set is positioned in the accommodation opening portion of the metal frame.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: March 1, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Patent number: 9277650
    Abstract: A combined wiring board includes multiple wiring boards, and a connected metal frame having multiple metal frames and one or more connecting portions such that the metal frames are connected each other by the connecting portion or connecting portions and have accommodation opening portions formed to accommodate the wiring boards, respectively.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: March 1, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Patent number: 9258897
    Abstract: A wiring board has a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer on a second-surface side of the laminated structure on the opposite side of the first-surface side. The laminated structure has a first-surface side pad formed in the bottom of the recessed portion and a second-surface side pad formed on the second-surface side of the laminated structure, the solder resist layer has a first opening portion and a second opening portion formed in the solder resist layer, the first opening portion is exposing the second-surface side pad, the second opening portion is formed on a back face of the recessed portion, and the back face of the recessed portion does not include the second-surface side pad.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: February 9, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hidetoshi Noguchi, Hirofumi Futamura
  • Publication number: 20150366102
    Abstract: An electronic circuit apparatus includes a circuit substrate, a heat generating component positioned on the circuit substrate, a metal plate forming a portion of an inner layer of the circuit substrate and protruding from a side surface of the circuit substrate such that the metal plate has an exposed portion exposed to outside the circuit substrate, and an external component connected to the exposed portion of the metal plate and including one of an external heat dissipation component and an external cooling component.
    Type: Application
    Filed: June 12, 2015
    Publication date: December 17, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Haruhiko MORITA, Takashi KARIYA