Abstract: A computer readable medium storing a program causing a computer to execute a function for displaying information on an image log, the function includes: generating an image log from an image which is used in processing a job, the job performed by an image processing apparatus; transferring the generated image log to a device that is connected to the image processing apparatus; generating information which includes status of at least one of the generating the image log or the transferring the image log; and displaying the generated information.

Abstract: The porous substrate, comprises: three-dimensional-network skeletal solid phase inside the substrate, and a skin layer same in quality as the skeletal solid phase formed on at least one surface of the substrate, and a production method thereof, comprising: forming a wet gel having a three-dimensional-network skeletal solid phase and a fluid phase rich in solvent that are separated from each other in a space between a pair of flat plates by sol-gel reaction, removing the solvent in the wet gel by drying, and removing at least one flat plate of the pair of flat plates.

Abstract: A remover contains an alkaline component, a bivalent zinc ion, a ferric ion, a chelating agent, and a nitrate ion. By using this remover, an anodized film can be selectively removed from an aluminum or aluminum-alloy member.

Abstract: The polishing slurry contains monoclinic zirconium oxide particles having a crystallite size of 10 to 1,000 nm and an average particle diameter of 30 to 2,000 nm in an amount of 1 to 20 weight %, a carboxylic acid having three or more carboxyl groups in the molecule, and a quaternary alkylammonium hydroxide, and has a pH of 9 to 12. The method of reclaiming wafers comprises a step of polishing used test wafers by using the polishing slurry above and removing the films formed on the wafers and the degenerated layers formed on the wafer surfaces, a step of mirror-polishing at least one side of the wafers, and a step of cleaning the wafers.

Abstract: A process for producing cumene by subjecting cumyl alcohol to hydrogenolysis or hydrogenation subsequent to dehydration, which comprises using a palladium-based catalyst as a catalyst for the hydrogenolysis or the hydrogenation, and using hydrogen having a carbon monoxide concentration of 0.1 to 10% by volume as hydrogen.

Abstract: A body having a thin region in substantially a half lower portion and a head joined to the body by a neck. When the element is blanked out of a metal sheet, an excess amount of metal produced by pressing the substantially half lower portion of the body flows from the body into the metal sheet positioned on an opposite side of the neck and a metal flow is produced into laterally spaced ends of the neck. The head has relatively thick laterally spaced ends and the head neck and the body have respective thicknesses equal to or smaller than the thickness of the head. The laterally spaced side end regions of the body have a thickness smaller than a thickness of the lower region of the neck in the substantially half upper portion of the body.

Abstract: A method of reclaiming silicon wafers including a film removal process, a polishing process, and a cleaning process, wherein a heating/removal process for removing a silicon wafer surface part by heating at 150-300° C. for 20 minutes to 5 hours is further included between the film removal process and the polishing process is provided. The present invention provides a useful method of reclaiming silicon wafers that removes Cu not only deposited on a surface but also penetrated inside of a silicon wafer, and does not give Cu contamination inside of the silicon wafer.

Abstract: A method of specifying a Cu-contamination-causative step or steps in a Si wafer reclamation process including plural steps in combination, comprising: using p-type Si wafers, or p-type Si wafers and n-type Si wafers as monitor wafers, and performing a measuring operation for measuring the electrical resistance of the monitor wafers at least once before and after a single step or a series of successive steps during the Si wafer reclamation process. The present invention is capable of nondestructively, simply, and accurately detecting Cu that can contaminate Si wafers during a Si wafer reclamation process and is capable of specifying a Cu-contamination-causative process.

Abstract: A method of and an apparatus for compressing the grinding sludge, which is effective to compress the grinding sludge to provide an intended rigid briquette even though the grinding sludge contains ground chips of hardened iron and/or steel materials and an oil-based coolant and also to facilitate reuse of the briquette (B1) as material for production of steel. The grinding sludge containing the oil-based coolant and hardened component parts such as steel component parts that are used in bearings is compressed. To this end, the grinding sludge produced from a grinding line (1) is filtered by a filtering unit (4) to provide a concentrated sludge which is subsequently compressed by squeezing by a briquetting machine (5) to provide the briquette (B1). The briquette B1 so obtained can be reused as steel material. The coolant separated from the grinding sludge during filtering and squeezing is returned to the grinding line (1) through recovery passages (7, 8).

Abstract: A method sorts out defect-free elements blanked out of a metal sheet for a belt for use in a continuously variable transmission. Each of the elements has a body and a head joined to the body with a pair of recesses defined therebetween. The elements are stacked in a transverse direction thereof into an annular form and bundled together by an assembly of stacked endless metal rings inserted in the recesses into a belt for use in a continuously variable transmission. The elements are inserted into a passage having a predetermined width to sort out and deliver those elements which have passed through the passage to a feed path. Respective images of the elements which have been delivered to the feed path are analyzed while in the feed path to compare the images with a reference element image. Elements which have entrapped foreign matter, outer profile deformations, and defects are rejected from the feed path, and other elements are fed through the feed path.

Abstract: Provided are connection methods and a heat treatment apparatus to be used in the method capable of readily applying heat treatment to a fusion-spliced portion of a connection line which is formed by fusion-splicing optical fibers of different kinds and capable of finishing the heat treatment with no excess or insufficiency. In the connection methods, after fusion-splicing the optical fibers of different kinds having different MFDs, the heat treatment is carried out to match the MFDs. At the same time, a dummy connection line of dummy optical fibers of different kinds is prepared, which is the same combination as the connection line of the optical fibers of different kinds to which the heat treatment is applied. While measuring connection loss in the dummy connection line directly or indirectly, the heat treatment is applied to the dummy connection line as well as the connection line.

Abstract: An optical fiber splicing method is provided for largely reducing an optical loss in a splice and eliminating a varying outer diameter and bending deformation. This splicing method splices opposing end faces of two optical fibers by fusion, and heats a formed fusion splice to match mode field diameters of the two optical fibers in the fusion splice, wherein the two optical fibers are fixed with an axial tension applied or not applied to the fusion splice, after the formation of the fusion splice, before the fusion splice is heated.

Abstract: A process for removing residues from the microstructure of an object is provided, which comprises steps of preparing a remover including CO2, an additive for removing the residues and a co-solvent dissolving the additive in said CO2 at a pressurized fluid condition; and bringing the object into contact with the remover so as to remove the residues from the object. An apparatus for implementing the process is also provided.

Abstract: The connecting method of different kind optical fibers of the present invention is a connecting method able to improve the strength of connecting portions of the different kind optical fibers of different mode field diameters. In this connecting method, connecting ends of the different kind optical fibers removing their coating therefrom are mutually butted and fusion-spliced by gripping the coating in a step (S4). Next, the mode field diameters of different kind optical fiber connecting portions are conformed to each other by the heat treatment of a step (S5). This heat treatment is taken within a low dust space having a clean degree of 1000 or less in class. Thus, the heat treatment is taken under an environment in which foreign matters floated around the connecting portions of the different kind optical fibers are very small. Therefore, it is possible to restrain a crack from being caused by burning the foreign matters into the connecting portions.

Abstract: A method of specifying a Cu-contamination-causative step or steps in a Si wafer reclamation process including plural steps in combination, comprising: using p-type Si wafers, or p-type Si wafers and n-type Si wafers as monitor wafers, and performing a measuring operation for measuring the electrical resistance of the monitor wafers at least once before and after a single step or a series of successive steps during the Si wafer reclamation process. The present invention is capable of nondestructively, simply, accurately detecting Cu that can contaminate Si wafers during a Si wafer reclamation process and of specifying a Cu-contamination-causative process.

Abstract: An element includes a body having a thin region in its substantially half lower portion and a head joined to the body by a neck. When the element is blanked out of a metal sheet, an excess amount of metal produced by pressing the substantially half lower portion of the body under a pressing load applied by a forming punch and a counter load applied by a counterpunch flows from the body into the metal sheet positioned on opposite side of the neck, and a metal flow is produced into laterally spaced ends of the neck. After the metal flows have occurred, the element is fully blanked out of the metal sheet by the forming punch. In the element, the head has relatively thick laterally spaced ends, and the head and the body have respective thicknesses equal to or smaller than the thickness of the head. The body includes a substantially half upper portion exclusive of the thin region, and has laterally spaced side end regions positioned on opposite side of a lower region of the neck.

Abstract: Light directional diffusing elements such as hologram elements are formed on the upper surface or lower surface of a light guide plate near the light source, and dots are formed of multiple small protrusions or small depressions on the light guide plate upper or lower surface to change the direction the light transmits from the input surface of the upper surface of light guide plate to a specified angle to irradiate towards a display element, to obtain a liquid crystal display technology for an easy to assemble backlit lighting device with greater brightness and fewer dark spots.

Abstract: A belt for use in a continuously variable transmission comprises an annular hoop of laminated metal elements each having a body and a head joined thereto with a pair of recesses defined therebetween, and a pair of rings inserted respectively in the recesses and each comprising a plurality of laminated metal web-shaped rings. The belt is manufactured by an element production line for producing the elements through a plurality of processes, a ring production line for producing the laminated rings through a plurality of processes parallel to the element production line, and a belt assembly line joined to the element production line and the ring production line, for bundling the elements with the laminated rings thereby to assemble the belt. The elements are inspected for a produced state thereof at a terminal end of the element production line and those elements which are judged as acceptable are sent to the belt assembly line.

Abstract: An apparatus for assembling a stator core having a plurality of radially disposed and radially movably jigs for holding the segmented cores. Vertically movable cams are provided vertically downwards on an upper vertically movable plate. By lowering the movably plate, the jigs are pushed radially inwards, thereby causing the plurality of segmented cores circumferentially to approach each other. The projection of each segmented core is fit by press fitting into the groove of the adjoining segmented core in the circumferential direction, thereby connecting the segmented cores together.

Abstract: Three current supply lines 44, 45, 41 and connection terminals 32, 34, 30 thereof for respectively driving the light emitting diodes on the probe side are arranged in a light emitting diode driving circuit on the measurement apparatus body side, a pair of driving switches Sw1A, Sw1B and Sw2A, Sw2B for constant current having contact points to be switched to the electric power source side or the ground side are respectively connected with the two current supply lines 44, 45 among the three current supply lines, and switching operation signal supply lines 41A, 42A and 41B, 42B are arranged for successively and continuously driving the light emitting diodes by supplying a switching operation signal for switching the contact points on the electric power source side or on the ground side to the pair of driving switches for constant current.