Abstract: A method of fabricating a semiconductor device is disclosed, which can prevent disconnection failures due to corrosion of aluminum-base alloy lines in the semiconductor device. First, an aluminum-base alloy film containing at least one kind of alloying element other than aluminum is formed on an insulating film which covers a semiconductor substrate. Before the surface of the aluminum-base alloy film is cleaned with fuming nitric acid, the surface treatment of the aluminum-base alloy film is performed using a plasma of an oxygen-base gas, to cover fully the surface of the aluminum-base alloy film with passivation film. Next, the given portions of the aluminum-base alloy film are selectively etched to form a line pattern. The surface treatment of the line pattern is performed using a plasma of an oxygen-base gas to cover fully the sides of the line pattern with passive film, before the surface of the line pattern is cleaned with fuming nitric acid.

Abstract: A carrier tape and a method of manufacturing a semiconductor device employing the same. The carrier tape has an insulating film and a plurality of leads. The film has an opening for receiving a semiconductor chip therein, a plurality of outer lead holes formed at the periphery of the opening, a lead supporting portion positioned between the opening and the outer lead holes, and at least one tie bar separating a pair of mutually opposing outer lead holes. The tie bar divides the associated outer lead hole and is connected to the lead supporting portion to prevent the lead supporting portion from sagging. The plurality of leads of the carrier tape are supported on the lead supporting portion of the film, projecting into the opening of the film. During manufacture, a semiconductor chip having a plurality of electrodes is positioned within the opening, and the one end portion of each lead is electrically connected to one of the electrodes of the semiconductor chip.

Abstract: A microwave plasma film deposition system comprises a waveguide for feeding microwaves through a microwave feeding window provided at one end of the waveguide, and a plasma cavity in communication with the other end of the waveguide and having a discharge gas inlet which is not in communication with the waveguide. The system further includes a specimen chamber which is in communication with the plasma cavity and which has a substrate setting rest therein and a material gas inlet, and a magnetic field applying device provided near the plasma cavity. Stable film deposition occurs because the plasma cavity is at the end of the waveguide which is remote from the microwave feeding window, whereby deposition on the microwave feeding window is prevented. Deposition on the microwave feeding window is further prevented by a ferromagnetic material which is placed around the waveguide and which reduces the strength of the magnetic field in the waveguide.

Abstract: The semiconductor device has leads projecting from at least two sides of all of a package which are bent in a zigzag manner so that ends of the leads lie on at least two planes. The semiconductor device may be mounted across a plurality of printed circuit boards by fixing a part of the leads from one side to a first board and fixing a remaining part of the leads from the other side to a second board, or by fixing a part of the leads on one plane to a first board and fixing a remaining part of the leads on the other plane to a second board.

Abstract: A semiconductor device includes an insulating film having an opening and first and second surfaces, a semiconductor chip positioned inside the opening and having first and second surfaces and a plurality of electrodes formed on its first surface, a plurality of leads supported on the first surface of the insulation film and connected to the electrodes of the semiconductor chip, first and second protective films facing the first and second surfaces of the insulating film, respectively, and a bonding agent disposed between the first and second protective films sealing the semiconductor chip and bonding the films together.

Abstract: An apparatus for dry etching, which comprises a stage for supporting a substrate, a rotor having a center shaft, the stage and an arm connecting the stage to the center shaft, and a driving means for turning the rotor at the center shaft as a turning center in the direction tangential to the circumference of a circle established by turning of the surface of the substrate at the center shaft as a turning center, the rotor being housed in a chamber, can make uniform perpendicular submicron etching with radicals or a reactive gas without using ions and without damages on the substrate.

Abstract: A semiconductor device has a semiconductor chip, leads each having one end thereof connected to respective electrodes disposed on one surface of the semiconductor chip, heat radiation body disposed in contact with the other surface of the semiconductor chip, and a resin molding the semiconductor chip with the other ends of the leads and the heat radiation body exposed.

Abstract: A carrier tape includes a film having an opening for receiving a semiconductor chip to be resin-molded by a pair of mold halves and outer lead holes formed around the periphery of the opening, a plurality of leads for mounting the semiconductor chip on the film, and a resin running portion cooperating, when the mold halves are closed with the film held between the mold halves, with a gate formed on a parting surface of one of the mold halves to define a resin running path which extends from a portion of the film outside the outer lead holes to the opening for guiding a molten resin into the mold halves while preventing the resin from entering the outer lead holes.

Abstract: The reliability of a thin semiconductor card, such as an IC card, is enhanced by stress absorbing part such as deformable part for absorbing externally applied stress, thereby preventing the stress from damaging the card main body, the semiconductor module, or the semiconductor elements. Alternatively, protection is provided by a weaker section, located away from the semiconductor module, that breaks under external stress before the stress can destroy the semiconductor module.

Abstract: A modular semiconductor device includes a pair of generally parallel electronic circuit boards and a plurality of IC packages mounted between the electronic circuit boards. Two or more modular semiconductor devices may be stacked on each other so that memory capacity can be readily enlarged and the function level can be readily improved. A heating, radiating fin of planar or honeycomb structure may be provided in near contact with an IC package.

Abstract: A thin semiconductor card, such as an IC card, includes a card main body, and a semiconductor module mounted therein. A foldable part or member is provided permitting the card main body to be folded.

Abstract: A semiconductor device provided with a film having an opening and first and second surfaces; a semiconductor chip having first and second surfaces corresponding to the first and second surfaces of the film and positioned inside the opening along the film; a plurality of first leads fixed to the first surface of the film, a tip of each first lead being electrically connected to a first electrode provided on the first surface of the semiconductor chip; at least one second lead fixed to the first surface of the film; an electroconductive member in the form of, e.g., a film, fixed to the second surface of the film and electrically connected to a second electrode provided on the second surface of the semiconductor chip; and a connection member passing through the film and electrically connecting the second lead and the electroconductive member to each other.

Abstract: A connector provided in an external device for an IC card having a card shutter provided with slide members, the shutter being capable of advancing and retreating and adapted to cover and protect external terminals of the IC card when the card is not used. This connector is provided with electroconductive pins adapted to move the shutter in the direction opposite to that of the insertion of the IC card so as to open the shutter of the IC card by contacting the slide member of the card shutter when the IC card is inserted into the connector, and an earth line for grounding the pin.

Abstract: A tape carrier utilized in the tape automated bonding of semiconductor chips is disclosed which comprises a polyimide tape-shaped film having apertures therein, and patterns of leads and reinforcing members formed on a surface of the film. The reinforcing members may be made of the same material as the leads, such as copper, and formed by a single photoetching process on the film. The reinforcing members are disposed on those areas of the film which lie outside of the leads and which are subjected to stress during the sealing of the semiconductor chips into a resinous mold subsequent to the inner lead bonding thereof. For example, the reinforcing members may be disposed in the lead supporting zones of the film, or around the corners of the outer-lead apertures. The reinforcing members reduces the stresses exerted on the leads during the molding of the chips, so that the deformations thereof during the same process are minimized.

Abstract: A mechanism for connecting an IC card and an external device to each other, having: a plurality of electrode terminals formed on a package of the IC card incorporating a semiconductor device and used to connect the semiconductor device to the external device; at least one engagement recess and/or engagement projection formed on the package of the IC card; and a connector provided in the external device. This connector is provided with an insertion hole, a plurality of electrode-contacting pieces disposed in the insertion hole and capable of contacting the plurality of electrode terminals of the IC card when the IC card is inserted into the connector, and at least one engagement projection and/or engagement recess formed inside the insertion hole and capable of engaging the engagement recess and/or engagement projection formed on the package to enable a particular type of the IC card to be inserted into the connector.

Abstract: A thin semiconductor card, such as an IC card, includes a card main body, and a semiconductor module mounted therein. A foldable part or member is provided permitting the card main body to be folded.

Abstract: A connection mechanism for connecting an IC card and an external device to each other, having: a plurality of electrode terminals formed on the IC card package in which a semiconductor device is incorporated, the electrode terminals being adapted to connect the semiconductor device to the external device; a pair of engagement recesses formed on the package of the IC card; and a connector provided in the external device, the connector having a card receiving portion into which the IC card is inserted, a plurality of electrode-contacting pieces disposed inside the card receiving portion and capable of contacting the plurality of electrode terminals of the IC card when the IC card is inserted into the card receiving portion to a predetermined position, and a pair of retaining members disposed on the card receiving portion and capable of advancing toward or retreating from the engagement recesses of the IC card and resiliently engaging the engagement recesses so as to retain the IC card at the predetermined posit

Abstract: A package structure comprising a metallic cap having a bottom wall to which the bottom surface of the semiconductor chip is electrically and mechanically connected, a side wall extending from said bottom wall and surrounding the semiconductor chip, and a flange extending outwardly from said side wall substantially parallel to said bottom wall, said flange supporting the lead conductors thereon through an electrically insulating material. The electrical connection means is disposed between the metallic cap flange and the lead conductor for establishing an electrical connection therebetween. The electrical connection means may comprise an electrically conductive projection formed on the flange of the metal cap, extending through a notch in the insulating material and electrically connected to the lead conductor.

Abstract: The reliability of a thin semiconductor card, such as an IC card, is enhanced by stress absorbing part such as deformable part for absorbing externally applied stress, thereby preventing the stress from damaging the card main body, the semiconductor module, or the semiconductor elements. Alternatively, protection is provided by a weaker section, located away from the semiconductor module, that breaks under external stress before the stress can destroy the semiconductor module.