Abstract: A semiconductor device and method are disclosed. The semiconductor device includes a substrate having a first region and a second region and an insulating layer arranged on the substrate. A first conductive layer is arranged in or on insulating layer in the first region and a second conductive layer is arranged in or on the insulating layer in the second region. The first conductive layer comprises a first conductive material and the second conductive layer comprises a second conductive material wherein the first conductive material is different than the second conductive material. A metal layer is arranged on the first conductive layer.

Abstract: An illumination optical unit for EUV projection lithography has a first and second facet mirrors, each with a plurality of reflecting facets on a support. The facets of the first facet mirror can be switched between various tilt positions. In each tilt position, the tiltable first facet is assigned to a second facet of the second facet mirror for deflecting EUV radiation in the direction of this second facet. Each of the first facets is assigned to a set of second facets by its tilt positions. The two facet mirrors are arranged so that an arrangement distribution of second facets, impinged upon via the first facets, results in an illumination-angle distribution of an illumination of an illumination field.

Abstract: An occupant detection system and method that uses an isolation assembly to isolate electrically a power supply providing power to a heater element for heating a vehicle seat from a sensing circuit that uses the heater element as an electrode for electric field or capacitance type occupant detection. The isolation assembly includes a common mode choke that by itself provides sufficient isolation when the sensing circuit excitation signal frequency is high enough, and provides switches that infrequently interrupt electrical power to the heater element so a humidity level can be determined using a relatively low excitation signal frequency. Knowing the humidity level is desirable to adjust a threshold use to determine if the sensing circuit indicates that the seat is empty, or is occupied.

Abstract: The invention relates to a coil former (110) for a coil (100) of an electric machine (400). The coil former has a coil core (112) and a terminating wall (115) having a first edge (118) and a second edge (119). The first edge is arranged opposite the second edge, and the terminating wall is designed to retain a coil wire (120), which can be wound around the coil core, in a wound position. The terminating wall has a first retaining projection (130) and a second retaining projection (140), wherein the first retaining projection extends in an extension plane (117) of the terminating wall from the first edge in a first projection direction (131) along a first center axis (132) of the first retaining projection and the second retaining projection extends in the extension plane (117) of the terminating wall from the second edge in a second projection direction (141) along a second center axis (142) of the second retaining projection.

Abstract: In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a contact layer over a first major surface of a substrate. The substrate includes device regions separated by kerf regions. The contact layer is disposed in the kerf region and the device regions. A structured solder layer is formed over the device regions. The contact layer is exposed at the kerf region after forming the structured solder layer. The contact layer and the substrate in the kerf regions are diced.

Abstract: A semiconductor device and method are disclosed. The semiconductor device includes a substrate having a first region and a second region and an insulating layer arranged on the substrate. A first conductive layer is arranged in or on insulating layer in the first region and a second conductive layer is arranged in or on the insulating layer in the second region. The first conductive layer comprises a first conductive material and the second conductive layer comprises a second conductive material wherein the first conductive material is different than the second conductive material. A metal layer is arranged on the first conductive layer.

Abstract: An arrangement is provided. The arrangement may include: a die including at least one electronic component and a first terminal on a first side of the die and a second terminal on a second side of the die opposite the first side, wherein the first side being the main processing side of the die, and the die further including at least a third terminal on the second side; a first electrically conductive structure providing current flow from the third terminal on second side of the die to the first side through the die; a second electrically conductive structure on the first side of the die laterally coupling the second terminal with the first electrically conductive structure; and an encapsulation material disposed at least over the first side of the die covering the first terminal and the second electrically conductive structure.

Abstract: The invention relates to a connecting box (1) for glass fiber cables, comprising a housing which is formed from at least two parts and has a lower part and a cover (2), with at least one holder (20) for a coupling (30) for holding glass fiber plugs being arranged within the housing, wherein the holder (20) is in the form of a double frame which comprises two first vertical struts (21) and two second vertical struts (22), with the second struts (22) being arranged closely to a front face (5, 40) of the cover (2) and of the lower part (3), and with the coupling (30) optionally being latchable to the first or the second struts (21, 22).

Abstract: According to various embodiments, a method for manufacturing a semiconductor device may include providing a semiconductor workpiece including a device region at a first side of the semiconductor workpiece, wherein a mechanical stability of the semiconductor workpiece is insufficient to resist at least one back end process without damage, and depositing at least one conductive layer over a second side of the semiconductor workpiece opposite the first side of the semiconductor workpiece, wherein the at least one conductive layer increases the mechanical stability of the semiconductor workpiece to be sufficient to resist the at least one back end process without damage.

Abstract: A valve diffuser (3) for a valve (1), wherein the valve diffuser (3) has a valve seat (8) to make contact with a valve body. The valve seat (8) has a bushing (10) for making contact with a valve body. The bushing is formed from a different reinforced material wherein the valve diffuser (3) and preferably stellite.

Abstract: The present invention relates to means and methods of determining whether a tumor cell or a cancer cell is responsive to an anti-CD44 antibody or to an antigen binding fragment thereof. The method comprises the determination of the major CD44 isoform in a sample, wherein if the major CD44 isoform is CD44s, the tumor cell or cancer cell is responsive to said anti-CD44 antibody. Also means and methods of treating a cancer patient that has been determined to respond to an anti-CD44 antibody are subject of the present invention.

Abstract: A method for the homogeneous distribution of cell components suspended in a liquid on a surface and a device for the implementation thereof.

Abstract: The invention relates to a holder (1) for at least one cassette, with the holder (1) having at least one shaft holder (100), at least one shaft element (200, 250) and at least one cassette, with the at least one cassette being attached to the shaft element (200, 250) such that it can pivot about a pivoting axis, with the at least one shaft element (200, 250) being attached to the shaft holder (100), with the at least one shaft element (200, 250) having a guidance channel (212, 212a; 253, 253a; 254, 254a), with the guidance channel (212, 212a; 253, 253a; 254, 254a) running at least partially parallel to the pivoting axis, with the cassette having at least one element (515, 515a) for rotatable mounting, wherein at least one element (515, 515a) is mounted, for rotatable mounting, such that it can rotate on the at least one shaft element (200, 250).

Abstract: A box (1) for accommodating and laying optical waveguides and/or copper conductors includes at least one housing (10) and at least one cover (20). The cover (20) is attached to the housing (10) such that it can pivot and can be detached. The cover (20) has at least one receptacle for a pin element (90). The housing (10) has at least one pin element (90). The at least one pin element (90) can be displaced parallel to a pivot axis relative to the holding element (80) to move into and out of the receptacle.

Abstract: The input device has a printed circuit board (5) to which a plurality of coils (L1-L8) has been fitted which, together with a capacitor (C2), each form a frequency-determining element of an oscillator (1). The coils (L1-L8) are arranged so as to be distributed along a path (K), which may also be a circular path. A movable magnet portion (M) can be displaced relative to the printed circuit board (5). At least one further stationary magnet portion (M1-M8) is mounted on the printed circuit board (5), which is opposite the movable magnet portion (M).

Abstract: A method for processing a semiconductor workpiece is provided, which may include: providing a semiconductor workpiece including a metallization layer stack disposed at a side of the semiconductor workpiece, the metallization layer stack including at least a first layer and a second layer disposed over the first layer, wherein the first layer contains a first material and the second layer contains a second material that is different from the first material; patterning the metallization layer stack, wherein patterning the metallization layer stack includes wet etching the first layer and the second layer by means of an etching solution that has at least substantially the same etching rate for the first material and the second material.

Abstract: An apparatus and a method for determining at least one parameter relating to the shape of the sausage, which is transported on a transport device, in particular between two circulating means of transport. A measuring device has at least one distance sensor, which is disposed in such a way that said sensor can detect a distance c to a sausage that is being transported. Furthermore, an evaluation device is provided, which determines at least one parameter relating to the sausage as a function of the distance.

Abstract: In one embodiment, a method of forming a semiconductor package comprises providing a first die having contact regions on a top surface but not on an opposite bottom surface. A dielectric liner layer is deposited under the bottom surface of the first die. The first die is attached with the deposited dielectric liner layer to a die paddle of a substrate. A bond layer is disposed between the substrate and the dielectric liner layer.

Abstract: A computer system determines a first criticality relating to frequency of execution of computer programs, a second criticality relating to frequency of execution of transactions, a third criticality relating to a number of users who execute the transactions, a fourth criticality relating to programs that modify the database tables having a large change in data, and a fifth criticality relating to the amount to time that each computer program is executed and the amount of time that each transaction is executed. The system determines intersections among the criticalities, and assigns a weighted value to each of the intersections. The system determines an overall criticality for a particular computer program or a particular transaction. The overall criticality is a function of the number of intersections in which the particular computer program or the particular transaction appears and the weighted values assigned to the intersections.

Abstract: The present invention relates to the use of a compound of formula (I) wherein R1 is H, C1-C6-alkyl, phenyl-C1-C4-alkyl or phenyl, R2 is a phenyl group which is substituted with 2 or 3 C1-C6-alkoxy groups and R3 is indolyl or azaindolyl which may carry one or two substituents independently selected from C1-C6-alkyl, C1-C6-alkoxy, phenyl, OH, halogen, NH2, C1-C6-alkylamino, di-C1-C6-alkylamino, heteroaryl with 5 or 6 ring atoms containing 1 or 2 heteroatoms which are independently selected from O, N, and S, or heterocyclyl with 5 or 6 ring atoms containing 1 or 2 heteroatoms which are independently selected from O, N, and S, a physiologically acceptable salt thereof, or a solvate of the compound of formula (I) or of the salt thereof, for the prevention or treatment of leukemia.