Abstract: A chalcogenide layer includes a composition of compounds having the formula MmX1-m, where M denotes one or more elements selected from the group consisting of group IVb elements of the periodic system, group Vb elements of the periodic system and transition metals, X denotes one or more elements selected from the group consisting of S, Se and Te, and m has a value of between 0 and 1. The chalcogenide layer further includes an oxygen or nitrogen content in the range from 0.001 atomic % to 75 atomic %.

Abstract: A memory device is described an active material configured to be placed in amore or less conductive state by means of appropriate switching processes. The active material is positioned between a material having low thermal conductivity or material layers having low thermal conductivity.

Abstract: A nonvolatile, resistively switching memory cell has a layer of a porous dielectric between a first electrode. The dielectric is not a chalcogenide.

Abstract: A programmable metallization memory cell with a storage region (3) formed from a chalcogenide glass and an electrode (4) which is preferably silver is located at the crossing point of a respective bit line (1) and a respective word line (2). There is a pn junction between the bit lines (1) and the chalcogenide glass.

Abstract: A switching device to be reversibly switched between an electrically isolating off-state and an electrically conducting on-state for use in, e.g., a reconfigurable interconnect. The device includes two separate electrodes, one of which being a reactive metal electrode and the other one being an inert electrode, and a solid state electrolyte arranged between the electrodes and being capable of electrically isolating the electrodes to define the off-state. The reactive metal electrode and the solid state electrolyte also being capable of forming a redox-system having a minimum voltage (turn-on voltage) to start a redox-reaction, which results in generating metal ions that are released into the solid state electrolyte. The metal ions are reduced to increase a metal concentration within the solid state electrolyte, wherein an increase of the metal concentration results in a conductive metallic connection bridging the electrodes to define the on-state.

Abstract: The invention relates to a system, a memory component and a process for operating a memory cell, which includes an active material, which can be changed into a more or less conductive state by means of an appropriate switching process, whereby the process including (a) bringing the memory cell into the more or less conductive state and evaluating the state of the memory cell after it has been changed into the more or less conductive state.

Abstract: The present invention relates to a switching device to be irreversibly switched from an electrically isolating off-state into an electrically conducting on-state for use in a configurable interconnect, comprising two separate electrodes, at least one of which being a reactive metal electrode, and a solid state electrolyte arranged between said electrodes and being capable of electrolyte isolating said electrodes to define said off-state, said electrodes and said solid state electrolyte forming a redox-system having a mini-mum voltage (“turn-on voltage”) to start a redox reaction, the redox reaction resulting in the generation of metal ions to be released into said solid state electrolyte, the metal ions being reduced to increase a metal concentration within said solid state electrolyte, wherein an increase of said metal concentration results in a conductive metallic connection bridging the electrodes to define the on-state.

Abstract: The invention relates to a method for producing a memory device, and to a memory device having an active material adapted to be placed in a more or less conductive state by means of appropriate switching processes, the active material is embedded in electrically insulating material.

Abstract: The invention relates to a memory device electrode, in particular for a resistively switching memory device, wherein the surface of the electrode is provided with a structure, in particular comprises one or a plurality of shoulders or projections, respectively. Furthermore, the invention relates to a memory cell comprising at least one such electrode, a memory device, as well as a method for manufacturing a memory device electrode.

Abstract: According to the invention, a memory system, and a process for controlling a memory component, to achieve different kinds of memory characteristics on one and the same memory component, is provided, the process comprising the steps: Sending out a signal to select one of several possible modes for the memory component; and Operating the memory component in accordance with the specific mode selected by the signal.

Abstract: A nonvolatile integrated semiconductor memory has an arrangement of layers with a tunnel barrier layer and a charge-storing level. The charge-storing level has a dielectric material which stores scattered in charge carriers in a spatially fixed position. The tunnel barrier layer has a material through which high-energy charge carriers can tunnel. At least one interface surface of the charge-storing level has a greater microscopic roughness than the interface surface of the tunnel barrier layer, which is remote from the charge-storing level. The charge-storing level has a greater layer thickness in first regions than in second regions. This produces a relatively identical distribution and localization of positive and negative charge carriers in the lateral direction. The charge carriers which are scattered into the charge-storing level, therefore, recombine completely, so that the risk of unforeseen data loss during long-term operation of nonvolatile memories is reduced.