Abstract: A memory cell includes a first electrode, a second electrode, and phase-change material including a first portion contacting the first electrode, a second portion contacting the second electrode, and a third portion between the first portion and the second portion. A width of the third portion is less than a width of the first portion and a width of the second portion.

Abstract: One embodiment of the present invention provides a memory cell device. The memory cell device includes a first electrode, a phase-change material adjacent the first electrode, and a second electrode adjacent the phase-change material. The phase-change material has a sublithographic width defined by a pattern shrink material process.

Abstract: A memory cell device that includes a plurality of phase-change memory cells, at least one write pulse generator, and at least one temperature sensor. The plurality of phase-change memory cells are each capable of defining at least two states. The write pulse generator generates a write pulse for the plurality of phase-change memory cells. The temperature sensor is capable of sensing temperature. The write pulse generator adjusts the write pulse for the plurality of phase-change memory cells with the temperature sensed by the temperature sensor.

Abstract: A semiconductor memory device suitable for use in a memory cell array includes a solid electrolyte memory cell including: a first electrode device, a second electrode device, and a solid electrolyte material region between the first and second electrode devices. The solid electrolyte material region is materially cohesive, and the second electrode device is materially cohesive.

Abstract: A memory cell device includes a first electrode, a heater adjacent the first electrode, phase-change material adjacent the heater, a second electrode adjacent the phase-change material, and isolation material adjacent the phase-change material for thermally isolating the phase-change material.

Abstract: The present invention includes a memory cell device and method that includes a memory cell, a first electrode, a second electrode, phase-change material and an isolation material. The phase-change material is coupled adjacent the first electrode. The second electrode is coupled adjacent the phase-change material. The isolation material adjacent the phase-change material thermally isolates the phase-change material.

Abstract: A memory cell device includes a first electrode, phase-change material adjacent the first electrode, a second electrode adjacent the phase-change material, a diffusion barrier adjacent the phase-change material, and isolation material adjacent the diffusion barrier for thermally isolating the phase-change material. The diffusion barrier prevents diffusion of the phase-change material into the isolation material.

Abstract: The present invention includes a phase-change memory cell device and method that includes a memory cell, a selection device, a contact, and a sublithographic pillar. The contact is coupled to the selection device. The phase-change pillar is coupled to the contact. The sublithographic pillar is coupled to the contact. The sublithographic pillar is surrounded by insulating material thereby defining sublithographic lateral dimensions of the sublithographic pillar. There is also sublithographic contact between the sublithographic pillar and the contact.

Abstract: A nonvolatile integrated semiconductor memory has an arrangement of layers with a tunnel barrier layer and a charge-storing level. The charge-storing level has a dielectric material which stores scattered in charge carriers in a spatially fixed position. The tunnel barrier layer has a material through which high-energy charge carriers can tunnel. At least one interface surface of the charge-storing level has a greater microscopic roughness than the interface surface of the tunnel barrier layer, which is remote from the charge-storing level. The charge-storing level has a greater layer thickness in first regions than in second regions. This produces a relatively identical distribution and localization of positive and negative charge carriers in the lateral direction. The charge carriers which are scattered into the charge-storing level, therefore, recombine completely, so that the risk of unforeseen data loss during long-term operation of nonvolatile memories is reduced.

Abstract: The memory apparatus according to the invention and having a cell 14 has a high electrical resistance in a first state and a low electrical resistance in a second state. The cell 14 has an edge area 16 and a core area 15, in which the electrical resistivity in the edge area 16 is higher than in the core area 15 in the second state.

Abstract: The object of providing a method for manufacturing solid body electrolyte memory cells or CB memory cells, respectively, which is suited for the simplified manufacturing of highly dense arrays with crosspoint architecture is solved by the present invention in that the solid body electrolyte memory cells are manufactured by self-aligned etching of the word lines that constitute simultaneously the top electrodes of the memory cells, and of the CB memory cells themselves. An advantage of the inventive method consists in that no via lithography is required, so that the manufacturing method is easier to perform, less expensive, and yields reliable results.

Abstract: A memory cell field with an integrated arrangement of solid body electrolyte memory cells, and in particular of CBRAM solid body electrolyte memory cells with 1T1R architecture, wherein the solid body electrolyte memory cells each comprise a layer stack that comprises at least a bottom and a top electroconductive, in particular metal layer and a layer of solid body electrolyte material or ion conductor material, respectively, positioned therebetween, and wherein each solid body electrolyte memory cell can be controlled via a word line, a bit line, and a plate line by means of a selection transistor, wherein at least a number of solid body electrolyte memory cells in the memory cell field have a common plate electrode or are connected to a common plate line, respectively.

Abstract: The invention relates to a method for manufacturing at least one resistively switching memory cell, in particular a phase change memory cell, said method comprising at least the steps of (a) structuring a hardmask applied above a layer and (b) etching back at least part of the structured hardmask, in particular by isotropic etching.

Abstract: A memory cell device that includes a plurality of phase-change memory cells, at least one write pulse generator, and at least one temperature sensor. The plurality of phase-change memory cells are each capable of defining at least two states. The write pulse generator generates a write pulse for the plurality of phase-change memory cells. The temperature sensor is capable of sensing temperature. The write pulse generator adjusts the write pulse for the plurality of phase-change memory cells with the temperature sensed by the temperature sensor.

Abstract: A method which makes it possible to define in a patterning layer openings having a first dimension that is substantially less than the feature size that can be obtained lithographically includes applying a sacrificial layer made of a material that is different from that of the patterning layer in a predetermined layer thickness on the patterning layer. Afterward, a photoresist layer is applied on the surface of the sacrificial layer, and an opening having a second dimension is defined lithographically in the photoresist layer. Afterward, an etching angle is set in a manner dependent on the layer thickness of the sacrificial layer and also the first and second dimensions, and the sacrificial layer is etched at the etching angle set. Afterward, the patterning layer is etched, the sacrificial layer is removed and a filling material is introduced into the opening produced in the patterning layer.

Abstract: A memory cell device and method that includes a memory cell, and first and second write pulse signals. The memory cell has phase-change material capable of being set and capable of being reset. The first and second write pulse signals are used for a single reset operation of the memory cell. The first write pulse signal heats and melts a first portion of the phase-change material of the memory cell. The second write pulse signal heats and melts a second portion of the phase-change material of the memory cell.

Abstract: An electrically operated, resistive memory element includes a volume of resistive memory material, adapted to be switched between different detectable resistive states in response to selected enery pulses; means for delivering electrical signals to at least a portion of the volume of resistive memory material; and a volume of heating material for Ohmic heating of the resistive memory material in response to the electrical signals. The volume of heating material is embedded in the volume of resistive memory material.

Abstract: An electrically operated, resistive memory element includes a volume of resistive memory material, adapted to be switched between different detectable resistive states in response to selected enery pulses; means for delivering electrical signals to at least a portion of the volume of resistive memory material; and a volume of heating material for Ohmic heating of the resistive memory material in response to the electrical signals. The volume of heating material is embedded in the volume of resistive memory material.

Abstract: A nonvolatile, resistively switching memory cell includes a layer arranged between a first electrode and a second electrode. The layer includes one or more chalcogenide compound(s) selected from the group consisting of CuInS, CuInSe, CdInS, CdInSe, ZnInS, MnInS, MnZnInS, ZnInSe, InS, InSSe and InSe, with alkali metal or alkaline-earth metal ions contained in the layer of the chalcogenide compound(s).

Abstract: A method is describe for fabricating memory components including memory cells based on an active material of an active layer, the phase state of which can be changed and which is enclosed between a bottom electrode and a top electrode. To reduce the current intensity of the programming current and the erase current required for programming and erasing of the memory element and therefore the quantity of heat which is required to change the phase state, a nanoporous aluminium oxide layer is used as a mask during the production of the active layer or the interface with the electrodes. The nanoporous aluminium oxide layer can be used as a positive mask, as a negative mask, or used directly as an insulating current aperture. The contact surface between electrode and active layer can be set in virtually any desired form by varying the process parameters of the aluminium oxide mask.