Patents by Inventor Thomas Scott Morris
Thomas Scott Morris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140021603Abstract: A semiconductor die, which includes a first semiconductor device, a first passivation layer, and a first interconnect bump, is disclosed. The first passivation layer is over the first semiconductor device, which includes a first group of device fingers. The first interconnect bump is thermally and electrically connected to each of the first group of device fingers. Additionally, the first interconnect bump protrudes through a first opening in the first passivation layer.Type: ApplicationFiled: July 23, 2013Publication date: January 23, 2014Applicant: RF Micro Devices, Inc.Inventors: Thomas Scott Morris, Michael Meeder
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Patent number: 8434220Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: December 7, 2007Date of Patent: May 7, 2013Assignee: RF Micro Devices, Inc.Inventors: Jayanti Jaganatha Rao, Thomas Scott Morris, Milind Shah
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Patent number: 8415567Abstract: The present invention relates to a multi-layer laminate or substrate manufacturing process for forming soldering surfaces on a substrate of a module without requiring a solder mask. In one embodiment, a substrate is provided having a substrate body, soldering pads, and a metal segment. A patterned mask is formed over the substrate such that soldering surfaces of the soldering pads remain exposed. The soldering surfaces of the soldering pads are plated to create plated soldering surfaces over the soldering pads. The plated soldering surfaces are the regions for solder placement. The patterned mask is then removed from the substrate. Next, an anti-wetting treatment is applied to the substrate such that any unplated metal surfaces react to the anti-wetting treatment to form treated surfaces. As such, the plated soldering surfaces will wet solder while the treated surface will not wet solder. In a preferred embodiment, the anti-wetting treatment is an oxidation process.Type: GrantFiled: February 4, 2010Date of Patent: April 9, 2013Assignee: RF Micro Devices, Inc.Inventors: Brian D. Sawyer, Thomas Scott Morris, Milind Shah
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Patent number: 8296941Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: May 27, 2011Date of Patent: October 30, 2012Assignee: RF Micro Devices, Inc.Inventors: David J. Hiner, Waite R. Warren, Jr., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Publication number: 20120262189Abstract: Embodiments of methods of non-destructively testing whether a laminated substrate satisfies structural requirements are disclosed herein. Additionally, laminated substrates that can be non-destructively tested are also disclosed along with methods of manufacturing the same. To non-destructively test whether the laminated substrates satisfies the structural requirement, an electrical characteristic of the laminated substrate may be detected. Since the detected electrical characteristic is related to a structural characteristic being tested, whether the structural characteristic complies with the structural requirement can be determined based on the electrical characteristic.Type: ApplicationFiled: April 16, 2012Publication date: October 18, 2012Applicant: RF MICRO DEVICES, INC.Inventors: Thomas Scott Morris, David C. Dening, Chris Botzis
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Publication number: 20120217048Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: February 25, 2011Publication date: August 30, 2012Applicant: RF MICRO DEVICES, INC.Inventors: Donald Joseph Leahy, Brian D. Sawyer, Stephen Parker, Thomas Scott Morris
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Publication number: 20120217624Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.Type: ApplicationFiled: February 25, 2011Publication date: August 30, 2012Applicant: RF MICRO DEVICES, INC.Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Donald Joseph Leahy
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Publication number: 20120193781Abstract: Disclosed is a method for fabricating a customized micro-electromechanical systems (MEMS) integrated circuit using at least one redistribution layer. The method includes steps of providing a substrate on which MEMS components are fabricated and coupling predetermined ones of the MEMS components via the redistribution traces.Type: ApplicationFiled: December 6, 2011Publication date: August 2, 2012Applicant: RF MICRO DEVICES, INC.Inventors: Julio Costa, Jonathan Hale Hammond, Thomas Scott Morris
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Publication number: 20120044653Abstract: Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module.Type: ApplicationFiled: July 25, 2011Publication date: February 23, 2012Applicant: RF MICRO DEVICES, INC.Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Brian D. Sawyer, Milind Shah, John Robert Siomkos, Mark Alan Crandall, Dan Carey
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Publication number: 20110225803Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: May 27, 2011Publication date: September 22, 2011Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Patent number: 7999197Abstract: A method for making a dual sided electronic module. A substrate has a first surface that is substantially parallel to a second surface. The second surface forms a cavity extending into an interior portion of the substrate. The substrate has at least one through hole connecting the cavity to the first surface. A first component is mounted with respect to the first surface, and a second component is mounted at least partially within the cavity. An encapsulant is applied to the first surface and through the at least one through hole into the cavity about the second component.Type: GrantFiled: April 20, 2009Date of Patent: August 16, 2011Assignee: RF Micro Devices, Inc.Inventors: Brian D. Sawyer, Milind Shah, Thomas Scott Morris, Carl Hinshaw
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Publication number: 20100199492Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: April 23, 2010Publication date: August 12, 2010Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Publication number: 20090000815Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: December 7, 2007Publication date: January 1, 2009Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Publication number: 20090000114Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: December 7, 2007Publication date: January 1, 2009Applicant: RF MICRO DEVICES, INC.Inventors: Jayanti Jaganatha Rao, Thomas Scott Morris, Milind Shah
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Patent number: 7451539Abstract: An electromagnetic shield for an electronic module includes a surface finish that is applied to the surface of an electronic module so as to minimize the size of the shield. Once the shield is in place, the shield acts to address electromagnetic interference (EMI) concerns associated with the electronic module. An electronic module having a ring of conductive material embedded about its peripheral edge is formed. The electronic module is then sub-diced so as to expose the ring of conductive material. After sub-dicing, a conductive material may be applied through an electroless plating process followed by an electrolytic plating process. Alternatively, a conductive epoxy may be sprayed or painted onto the surface of the electronic module.Type: GrantFiled: August 8, 2005Date of Patent: November 18, 2008Assignee: RF Micro Devices, Inc.Inventors: Thomas Scott Morris, Milind Shah, Donald Joseph Leahy, Lewis Kermit Law, II
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Patent number: 6884661Abstract: The present invention provides for attaching a Gallium Arsenide (GaAs) semiconductor die to a package using bumps formed over a metallic heat sink covering the output transistor area of the semiconductor die. In general, one or more bumps are formed on the metallic heat sink, thereby eliminating stress on the bumps caused by stress risers on the surface of the semiconductor die. In addition, the upper and lower surfaces of the bumps are substantially planar, thereby maximizing contact with the semiconductor die and the package and allowing maximum heat transfer. The planarization is due to the conforming contact surface of the solder. The combination of the bumps and the metallic heat sink provide an efficient way to reduce the thermal and electrical impedance of the die. In one embodiment, the bumps are substantially copper. In another embodiment, the bumps are substantially gold.Type: GrantFiled: November 4, 2003Date of Patent: April 26, 2005Assignee: RF Micro Devices, Inc.Inventors: Thomas Scott Morris, Milind Shah, Jon Jorgenson