Abstract: A semiconductor module includes a circuit board and a power semiconductor chip embedded in the circuit board. The power semiconductor chip has a first load electrode. The semiconductor module further includes a power terminal connector electrically connected to the first load electrode. The embedded power semiconductor chip is positioned laterally within a footprint zone of the power terminal connector.

Abstract: Electronic module (100), which comprises a first substrate (102), a first dielectric layer (104) on the first substrate (102), at least one electronic chip (106), which is mounted with a first main surface (108) directly or indirectly on partial region of the first dielectric layer (104), a second substrate (110) over a second main surface (114) of the at least one electronic chip (106), and an electrical contacting (116) for the electric contact of the at least one electronic chip (106) through the first dielectric layer (104), wherein the first adhesion layer (104) on the first substrate (102) extends over an area, which exceeds the first main surface (108).

Abstract: A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a second semiconductor chip including a first face, wherein a first contact pad is arranged over the first face, wherein the first semiconductor chip and the second semiconductor chip are arranged such that the first face of the first semiconductor chip faces in a first direction and the first face of the second semiconductor chip faces in a second direction opposite to the first direction. The first semiconductor chip is located laterally outside of an outline of the second semiconductor chip.

Abstract: A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a second semiconductor chip including a first face, wherein a first contact pad is arranged over the first face, wherein the first semiconductor chip and the second semiconductor chip are arranged such that the first face of the first semiconductor chip faces in a first direction and the first face of the second semiconductor chip faces in a second direction opposite to the first direction. The first semiconductor chip is located laterally outside of an outline of the second semiconductor chip.

Abstract: In accordance with an embodiment of the present invention, a semiconductor device includes a semiconductor chip having a first side and an opposite second side, and a chip contact pad disposed on the first side of the semiconductor chip. A dielectric liner is disposed over the semiconductor chip. The dielectric liner includes a plurality of openings over the chip contact pad. A interconnect contacts the semiconductor chip through the plurality of openings at the chip contact pad.

Abstract: A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a first electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction; a trench arranged in the dielectric layer and extending in the horizontal direction; and a filling material filling the trench, wherein the filling material is different from the material of the dielectric layer.

Abstract: Electronic module (100), which comprises a first substrate (102), a first dielectric layer (104) on the first substrate (102), at least one electronic chip (106), which is mounted with a first main surface (108) directly or indirectly on partial region of the first dielectric layer (104), a second substrate (110) over a second main surface (114) of the at least one electronic chip (106), and an electrical contacting (116) for the electric contact of the at least one electronic chip (106) through the first dielectric layer (104), wherein the first adhesion layer (104) on the first substrate (102) extends over an area, which exceeds the first main surface (108).

Abstract: A package comprising an electronic chip, a laminate type encapsulant in and/or on which the electronic chip is mounted, a solderable electric contact on a solder surface of the package, and a solder flow path on and/or in the package which is configured so that, upon soldering the electric contact with a mounting base, part of solder material flows along the solder flow path towards a surface of the package at which the solder material is optically inspectable after completion of the solder connection between the mounting base and the electric contact.

Abstract: In accordance with an embodiment of the present invention, a semiconductor device includes a semiconductor chip having a first side and an opposite second side, and a chip contact pad disposed on the first side of the semiconductor chip. A dielectric liner is disposed over the semiconductor chip. The dielectric liner includes a plurality of openings over the chip contact pad. A interconnect contacts the semiconductor chip through the plurality of openings at the chip contact pad.

Abstract: A package comprising an electronic chip, a laminate-type encapsulant at least partially encapsulating the electronic chip, a wiring structure extending from the electronic chip up to a contact pad, and a completely galvanically formed solderable exterior electric contact electrically coupled with the electronic chip by being arranged on the contact pad.

Abstract: A semiconductor module includes a circuit board and a power semiconductor chip embedded in the circuit board. The power semiconductor chip has a first load electrode. The semiconductor module further includes a power terminal connector electrically connected to the first load electrode. The embedded power semiconductor chip is positioned laterally within a footprint zone of the power terminal connector.

Abstract: A semiconductor package includes a semiconductor die and a metal clip. In one embodiment, the semiconductor die is embedded in an insulating material and has a first surface facing in a first direction, a second surface facing in a second direction opposite the first direction and an edge extending between the first and second surfaces. The metal clip is embedded in the insulating material above the die and bonded to the second surface of the die. Part of the metal clip extends laterally beyond the edge of the die and vertically in the first direction to provide galvanic redistribution at the second surface of the die. Other embodiments of semiconductor packages are also provided.

Abstract: A combination of a towing vehicle and an agricultural harvesting machine drawn by the towing machine is provided. The harvesting machine includes at least one working assembly for conveying crop (G), for processing crop (G) or both. The harvesting machine also includes a working connection to the towing vehicle in order to be supplied with drive power by the towing vehicle in order to operate the at least one working assembly and a control device can be operated in a harvesting mode in order to specify a ground speed (v) for the combination depending on ascertained operating parameters of the harvesting machine and the towing vehicle.

Abstract: A baler is formed with a bale chamber for compressing agricultural crop into bales, at least one knotter for knotting twine wrapped around a finished bale and a twine store having at least one magazine in which the twine rolls for supplying the knotter are accommodated with axes lying on a common line.

Abstract: A semiconductor device includes a laminate, a first semiconductor chip at least partly embedded in the laminate, a second semiconductor chip mounted on a first main surface of the laminate, and a first electrical contact arranged on the first main surface of the laminate. The second semiconductor chip is electrically coupled to the first electrical contact.

Abstract: A twine retaining device for a baler includes a retaining disk, which can rotate about a shaft, and a retaining plate, which jointly delimit a retaining gap. The retaining gap is defined by a plurality of constrictions distributed along a twine strand extending through the retaining gap.

Abstract: A block baling press has a bale chamber and a baling ram moveable in the bale chamber in an oscillating manner to compress bale material. An end face of the baling ram facing the bale material is divided into ram segments separated from one another by needle slots. At least a first needle slot is flanked by ram segments with a profiling transverse to the first needle slot. The profiling brings about a weaker compression of the bale material in an edge region of the ram segments adjacent to the first needle slot than in a region of the ram segments spaced apart from the first needle slot. Bales are obtained in which zones of high compression and low compression alternate across the width of the bale chamber. The bales are held together by twine placed around the zones having low compression.

Abstract: A method for operating a baler with a pressing chamber which serves for the pressing of a straw-like crop includes compacting the crop using an adjustable pressing pressure and binding the crop through a holding material. The pressing pressure is limited to a maximum value and controlled through a control circuit. A control circuit reference variable is a load variable of the holding material. The load variable is adjustable and is smaller than or equal to the maximum value.

Abstract: Electronic module (100), which comprises a first substrate (102), a first dielectric layer (104) on the first substrate (102), at least one electronic chip (106), which is mounted with a first main surface (108) directly or indirectly on partial region of the first dielectric layer (104), a second substrate (110) over a second main surface (114) of the at least one electronic chip (106), and an electrical contacting (116) for the electric contact of the at least one electronic chip (106) through the first dielectric layer (104), wherein the first adhesion layer (104) on the first substrate (102) extends over an area, which exceeds the first main surface (108).

Abstract: A semiconductor package includes a semiconductor die and a metal clip. In one embodiment, the semiconductor die is embedded in an insulating material and has a first surface facing in a first direction, a second surface facing in a second direction opposite the first direction and an edge extending between the first and second surfaces. The metal clip is embedded in the insulating material above the die and bonded to the second surface of the die. Part of the metal clip extends laterally beyond the edge of the die and vertically in the first direction to provide galvanic redistribution at the second surface of the die. Other embodiments of semiconductor packages are also provided.