Abstract: A semiconductor device includes a laminate, a first semiconductor chip at least partly embedded in the laminate, a second semiconductor chip mounted on a first main surface of the laminate, and a first electrical contact arranged on the first main surface of the laminate. The second semiconductor chip is electrically coupled to the first electrical contact.

Abstract: A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a second semiconductor chip including a first face, wherein a first contact pad is arranged over the first face, wherein the first semiconductor chip and the second semiconductor chip are arranged such that the first face of the first semiconductor chip faces in a first direction and the first face of the second semiconductor chip faces in a second direction opposite to the first direction. The first semiconductor chip is located laterally outside of an outline of the second semiconductor chip.

Abstract: A twine retaining device for a baler includes a retaining disk, which can rotate about a shaft, and a retaining plate, which jointly delimit a retaining gap. The retaining gap is defined by a plurality of constrictions distributed along a twine strand extending through the retaining gap.

Abstract: A combination of a towing vehicle and an agricultural harvesting machine drawn by the towing machine is provided. The harvesting machine includes at least one working assembly for conveying crop (G), for processing crop (G) or both. The harvesting machine also includes a working connection to the towing vehicle in order to be supplied with drive power by the towing vehicle in order to operate the at least one working assembly and a control device can be operated in a harvesting mode in order to specify a ground speed (v) for the combination depending on ascertained operating parameters of the harvesting machine and the towing vehicle.

Abstract: In accordance with an embodiment of the present invention, a semiconductor device includes a semiconductor chip having a first side and an opposite second side, and a chip contact pad disposed on the first side of the semiconductor chip. A dielectric liner is disposed over the semiconductor chip. The dielectric liner includes a plurality of openings over the chip contact pad. A interconnect contacts the semiconductor chip through the plurality of openings at the chip contact pad.

Abstract: A chip arrangement is provided. The chip arrangement including: a chip including at least one electrically conductive contact; a passivation material formed over the at least one electrically conductive contact; an encapsulation material formed over the passivation material; one or more holes formed through the encapsulation material and the passivation material, wherein the passivation material at least partially surrounds the one or more holes; and electrically conductive material provided within the one or more holes, wherein the electrically conductive material is electrically connected to the at least one electrically conductive contact.

Abstract: A bale press includes a pressing channel in which a piston is displaceable for forming a bale from crop material supplied to the pressing channel. The bale press includes a yarn supply and a knotter device arranged at a side of the pressing channel. The knotter device has a first holder for releasably holding an end portion of a yarn, a yarn deflecting member and a knotter beak. The yarn extends between the first holder and the yarn supply across the deflecting member and a side of the bale facing away from the piston. The knotter beak ties a knot in a first stretch of the yarn extending between the first holder and the deflecting member. A second holder holds the yarn at the deflecting member in an initial phase of bale formation.

Abstract: A semiconductor device includes a chip. The chip includes a single circuit element formed in a semiconductor substrate, a first metal layer on a first face of the semiconductor substrate, and a second metal layer on a second face of the semiconductor substrate opposite the first face. The first metal layer and the second metal layer are configured for accessing the single circuit element. A smaller of a first width of the first face of the semiconductor substrate and a second width of the first face of the semiconductor substrate perpendicular to the first width is less than or equal to a distance between an exposed face of the first metal layer parallel to the first face of the semiconductor substrate and an exposed face of the second metal layer parallel to the second face of the semiconductor substrate.

Abstract: A bale press includes a pressing channel in which a piston is displaceable for forming a bale from crop material supplied to the pressing channel. The bale press includes a yarn supply and a knotter device arranged at a side of the pressing channel. The knotter device has a first holder for releasably holding an end portion of a yarn, a yarn deflecting member and a knotter beak. The yarn extends between the first holder and the yarn supply across the deflecting member and a side of the bale facing away from the piston. The knotter beak ties a knot in a first stretch of the yarn extending between the first holder and the deflecting member. A second holder holds the yarn at the deflecting member in an initial phase of bale formation.

Abstract: A method for operating a baler with a pressing chamber which serves for the pressing of a straw-like crop includes compacting the crop using an adjustable pressing pressure and binding the crop through a holding material. The pressing pressure is limited to a maximum value and controlled through a control circuit. A control circuit reference variable is a load variable of the holding material. The load variable is adjustable and is smaller than or equal to the maximum value.

Abstract: A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first material and a second material capable of conducting a self-sustaining exothermic reaction upon initiation by an external energy to generate heat sufficient to melt the meltable joining material.

Abstract: A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first material and a second material capable of conducting a self-sustaining exothermic reaction upon initiation by an external energy to generate heat sufficient to melt the meltable joining material.

Abstract: The present invention relates to a rope winding system (1) for winding and unwinding a steel rope (4) of a crane (7). A rope winding system (1) according to the present invention has a rope drum (6), onto which the steel rope (4) can be wound in a plurality of layers, and a magnetic system (7) which is configured to generate a magnetic field over a section of the steel rope (4) with its magnetic flux being deflected by a movement of the steel rope (4) in such a way that the steel rope (4) is braked. A crane (7) is also discloses which is equipped with such a rope winding system (1) for winding and unwinding a steel rope (4).

Abstract: A semiconductor device includes a chip. The chip includes a single circuit element formed in a semiconductor substrate, a first metal layer on a first face of the semiconductor substrate, and a second metal layer on a second face of the semiconductor substrate opposite the first face. The first metal layer and the second metal layer are configured for accessing the single circuit element. A smaller of a first width of the first face of the semiconductor substrate and a second width of the first face of the semiconductor substrate perpendicular to the first width is less than or equal to a distance between an exposed face of the first metal layer parallel to the first face of the semiconductor substrate and an exposed face of the second metal layer parallel to the second face of the semiconductor substrate.

Abstract: The present invention relates to a rope winding system (1) for winding and unwinding a steel rope (4) of a crane (7). A rope winding system (1) according to the present invention has a rope drum (6), onto which the steel rope (4) can be wound in a plurality of layers, and a magnetic system (7) which is configured to generate a magnetic field over a section of the steel rope (4) with its magnetic flux being deflected by a movement of the steel rope (4) in such a way that the steel rope (4) is braked. A crane (7) is also discloses which is equipped with such a rope winding system (1) for winding and unwinding a steel rope (4).