Patents by Inventor Ting Yu

Ting Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240196377
    Abstract: A user equipment (UE) configured to establish a packet data unit (PDU) session with a network, wherein the PDU session comprises a quality of service (QOS) flow, receive one or more radio resource control (RRC) messages indicating a configured grant (CG) allocated to the UE, wherein the QoS flow is mapped to a logical channel (LCH) and wherein the LCH is mapped to the CG and transmit data on a physical uplink shared channel (PUSCH) using a time and a frequency resource of the CG.
    Type: Application
    Filed: September 2, 2021
    Publication date: June 13, 2024
    Inventors: Sarma V. VANGALA, Arjun BHARADWAJ, Fangli XU, Haijing HU, Lakshmi IYER, Ralf ROSSBACH, Sabine ROESSEL, Sree Ram KODALI, Yu-Ting YU
  • Patent number: 12010718
    Abstract: Methods, systems, and devices for wireless communication are described. A wireless communications system may establish radio bearers for certain data transmissions between a user equipment (UE) and a base station. A radio bearer may be associated with one or more quality of services (QoS) parameters, such as a bit rate. The base station may indicate to the UE a time window over which to average the bit rate. In some examples, a radio bearer may include multiple data flows. The base station may provide information regarding QoS parameters for each data flow in control signaling, such as a grant.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: June 11, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Yue Yang, Srinivasan Balasubramanian, Aziz Gholmieh, Yu-Ting Yu
  • Publication number: 20240174381
    Abstract: A test system for modifying a graph-based trained classifier, configured to output control data for controlling the aircraft system according to a graph model representing the aircraft system. The test system is configured to obtain scenario data, control data, and validation data. The test system generates a custom loss score based on differences between the validation data and the control data and modifies the graph-based trained classifier based on the custom loss score, the scenario data, and the control data. A computer-implemented method for modifying the graph-based trained classifier and a storage medium comprising instructions to perform the method are also provided.
    Type: Application
    Filed: November 30, 2023
    Publication date: May 30, 2024
    Inventor: Ting Yu Au
  • Publication number: 20240178177
    Abstract: A structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. The redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers, and a metal pad in the bottom layer and overlapped by the power-ground macro. The metal pad is electrically disconnected from the power-ground macro.
    Type: Application
    Filed: January 31, 2024
    Publication date: May 30, 2024
    Inventors: Ting-Yu Yeh, Chun-Hua Chang, Fong-Yuan Chang, Jyh Chwen Frank Lee
  • Publication number: 20240165302
    Abstract: Disclosed are compositions and related methods of recapitulating bone marrow stroma using scaffold materials (e.g., a porous alginate hydrogel scaffold) containing one or more cellular differentiation factors, and one or more growth factors. Such methods and compositions promote the formation of an ectopic nodule or site that can improve transplanted cell engraftment and selectively drive the development of lymphocytes and the reconstitution of the adaptive immunity after hematopoietic stem cell transplant.
    Type: Application
    Filed: July 20, 2023
    Publication date: May 23, 2024
    Applicants: President and Fellows of Harvard College, The General Hospital Corporation
    Inventors: Nisarg J. Shah, Ting-Yu Shih, Angelo S. Mao, David J. Mooney, David T. Scadden
  • Patent number: 11990351
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh, Chen-Hsuan Tsai
  • Patent number: 11991196
    Abstract: Autoencoder-based anomaly detection methods have been used in identifying anomalous users from large-scale enterprise logs with the assumption that adversarial activities do not follow past habitual patterns. Most existing approaches typically build models by reconstructing single-day and individual-user behaviors. However, without capturing long-term signals and group-correlation signals, the models cannot identify low-signal yet long-lasting threats, and will incorrectly report many normal users as anomalies on busy days, which, in turn, leads to a high false positive rate. A method is provided based on compound behavior, which takes into consideration long-term patterns and group behaviors. The provided method leverages a novel behavior representation and an ensemble of deep autoencoders and produces an ordered investigation list.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: May 21, 2024
    Assignee: QATAR FOUNDATION FOR EDUCATION, SCIENCE AND COMMUNITY DEVELOPMENT
    Inventors: Issa M. Khalil, Ting Yu, Eui J. Choo, Lun-Pin Yuan, Sencun Zhu
  • Publication number: 20240156283
    Abstract: A folding room divider may include at least two divider panels, a plurality of connectors, and at least an anti-pinch plate. Each of the divider panels is connected to a frame at outer edges thereof, and the connectors are positioned on the frame so as to enable the anti-pinch plate to connect to the frame. The two divider panels are pivotally connected through the anti-pinch plate to achieve the anti-pinch effect for the folding room divider.
    Type: Application
    Filed: November 11, 2022
    Publication date: May 16, 2024
    Applicant: KADEYA ENTERPRISE CO., LTD.
    Inventor: Ting-Yu Lai
  • Patent number: 11983267
    Abstract: A data processing method based on Trojan circuit detection includes controlling a processor, in a testing stage, to perform following steps: obtaining a plurality of characteristic values corresponding to a logic gate circuit; performing a distribution adjustment operation on the characteristic values to generate a plurality of adjusted characteristic values; and performing classification on the adjusted characteristic values to generate a logic identification result.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: May 14, 2024
    Assignee: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Jian Wei Liao, Ting Yu Lin, Kai Chiang Wu, Jung Che Tsai
  • Patent number: 11985508
    Abstract: An RF fingerprint signal processing device configured for executing a machine learning algorithm on a plurality of input signals. The RF fingerprint signal processing device includes a receiver-feature determination circuit and a classifying determination circuit. The receiver-feature determination circuit is configured to compute on the plurality of input signals in a neural network. The classifying determination circuit is coupled with the receiver-feature determination circuit, and the classifying determination circuit is configured to send feedback information of a receiver-feature component to the receiver-feature determination circuit. The receiver-feature determination circuit decreases the receiver-feature weight of the neural network. The receiver-feature weight is associated with the receiver-feature component, and the receiver-feature weight which is decreased is applied for computing an output value of the neural network.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: May 14, 2024
    Assignee: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Ting-Yu Lin, Ping-Chun Chen, Chia-Min Lai
  • Publication number: 20240151743
    Abstract: The present disclosure is directed to a method of manufacturing one or more needles of a probe card by refining and processing a conductive body that extends from the probe card to form a respective tip at the end of the respective conductive body. Forming the respective tip of a respective needle includes removing respective portions from the end of the conductive body by flowing an electrolytic fluid between a conductive pattern structure and an end of the respective conductive body. Removing the respective portions with the flow of the electrons may be performed in multiple successive steps to form various needles with various sizes, shapes, and profiles (e.g., cylindrical, rectangular, triangular, trapezoidal, etc.).
    Type: Application
    Filed: February 7, 2023
    Publication date: May 9, 2024
    Inventors: Ting-Yu CHIU, Yi-Neng CHANG, Wen-Chun TU, Te-Kun LIN, Chien Fang HUANG
  • Patent number: 11978714
    Abstract: A method includes bonding a first device die and a second device die to an interconnect die. The interconnect die includes a first portion over and bonded to the first device die, and a second portion over and bonded to the second device die. The interconnect die electrically connects the first device die to the second device die. The method further includes encapsulating the interconnect die in an encapsulating material, and forming a plurality of redistribution lines over the interconnect die.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh
  • Publication number: 20240138364
    Abstract: Disclosed is an air microorganism enrichment device in farms, and relates to the technical field of air microorganism collection.
    Type: Application
    Filed: January 11, 2023
    Publication date: May 2, 2024
    Inventors: Shaolun ZHAI, Chunling LI, Yan LI, Xia ZHOU, Ming LIAO, Mingfei SUN, Jianfeng ZHANG, Huahua KANG, Wenkang WEI, Ting YU
  • Publication number: 20240146305
    Abstract: The present disclosure includes a voltage provision circuit. In one aspect of the present disclosure, a voltage provision circuit is disclosed. The voltage provision circuit includes a first NMOS transistor gated with a first control signal and sourced with a ground voltage. The voltage provision circuit includes a second NMOS transistor gated with a second control signal complementary to the first control signal and sourced with the ground voltage. The voltage provision circuit includes a first PMOS transistor sourced with a first supply voltage. The voltage provision circuit includes a second PMOS transistor sourced with the first supply voltage. The voltage provision circuit includes a voltage modulation circuit, coupled between the first to second PMOS transistors and the first to second NMOS transistors, that is configured to provide a first intermediate signal based on the first and second control signals.
    Type: Application
    Filed: February 16, 2023
    Publication date: May 2, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Yu Yu, Meng-Sheng Chang, Shao-Yu Chou
  • Patent number: 11971172
    Abstract: A premixer assembly for a combustor includes: at least one ring of premixers, each premixer having a central axis, an annular peripheral wall surrounding a centerbody, and at least one swirler disposed between the centerbody and the peripheral wall, wherein the peripheral wall defines an inlet area of the premixer; and a lip extending forward along the central axis from the peripheral wall, the lip extending at an oblique angle to the axis of symmetry.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: April 30, 2024
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: David A. Lind, Ajoy Patra, Ting-Yu Tu, Pradeep Naik, Gregory A. Boardman
  • Publication number: 20240132670
    Abstract: A siloxane monomer, a contact lens composition, and a contact lens are respectively provided. The siloxane monomer is represented by Chemical Formula 1 below: where R1 is H or CH3; R2 is NHR3, N(R3)2, OR3, SR3, or R3 is and R4 is H or an alkyl group having a carbon chain length of C1 to C6; where x is greater than or equal to 0, y is greater than or equal to 1, and z is greater than or equal to 0.
    Type: Application
    Filed: February 7, 2023
    Publication date: April 25, 2024
    Inventors: Ting-Yu Li, Min-Yung Huang
  • Patent number: 11965069
    Abstract: A heat-shrinkable polyester film made of a polyester-forming resin composition includes a recycled material, and has an exothermic crystallization peak and an endothermic melting peak which are determined via differential scanning calorimetry, and which satisfy relationships of T2?T1?68° C. and T3?T2?78° C., where T1 represents an onset point of the exothermic crystallization peak, T2 represents an end point of the exothermic crystallization peak and an onset point of the endothermic melting peak, and T3 represents an end point of the endothermic melting peak. A method for manufacturing the heat-shrinkable polyester film is also disclosed.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: April 23, 2024
    Assignee: FAR EASTERN NEW CENTURY CORPORATION
    Inventors: Li-Ling Chang, Yow-An Leu, Ting-Yu Lin, Ching-Chun Tsai, Wen-Yi Chang
  • Patent number: D1024722
    Type: Grant
    Filed: November 3, 2022
    Date of Patent: April 30, 2024
    Assignee: TAIWAN FU HSING INDUSTRIAL CO., LTD.
    Inventors: Ting-Yu Liu, Jun-Kai Ko
  • Patent number: D1024723
    Type: Grant
    Filed: November 6, 2022
    Date of Patent: April 30, 2024
    Assignee: TAIWAN FU HSING INDUSTRIAL CO., LTD.
    Inventors: Ting-Yu Liu, Jun-Kai Ko
  • Patent number: D1027976
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: May 21, 2024
    Assignee: VIVOTEK INC.
    Inventors: Kuan-Hung Chen, Kai-Sheng Chuang, Chia-Chi Chang, Yu-Fang Huang, Kai-Ting Yu, Wen-Chun Chen, Shu-Jung Hsu, Tsao-Wei Hung