Abstract: Encrypted signal segment locating device and method. The device is configured to execute the following operations. An encrypted signal template is transformed into a signal template formed by template data points. The signal template is adjusted based on a frequency difference and a clock rate difference between a side-channel input signal and the signal template to generate an adjusted template. The adjusted template and the side-channel input signal are compared by using a sliding window to generate compared segments in the side-channel input signal and similarities corresponding to the compared segments. When the similarities are higher than a threshold, one of the compared segments is selected as an encrypted signal segment, and an encryption position is located by using the sliding window, wherein the encrypted signal segment is the compared segment having a highest similarity.

Abstract: A liquid crystal display includes a display panel and a driving unit. The display panel includes a plurality of resetting sections, which correspond to display a plurality of screens, respectively. There is a first voltage difference between a corresponding one of the column voltages and a corresponding one of the row voltages of one of the resetting sections, and there is a second voltage difference between a corresponding one of the column voltages and a corresponding one of the row voltages of another of the resetting sections. The second voltage difference reaching a second maximum voltage difference value is after the first voltage difference reaching a first maximum voltage difference value by a delay time, so as to clear the screens.

Abstract: A method of manufacturing a transmission gate includes overlying a substrate with first through fourth adjacent metal segments in a same metal layer. Each of the first and second metal segments, second and third metal segments, and third and fourth metal segments are offset from each other by an offset distance in a first direction, the first metal segment overlies a first active area in the substrate including first and second PMOS transistors, and the fourth metal segment overlies a second active area in the substrate including first and second NMOS transistors. The method includes configuring the first and second PMOS transistors and the first and second NMOS transistors as a transmission gate by forming first through third conductive paths, the first conductive path including a fifth metal segment overlying at least three of the first through fourth metal segments along a second direction perpendicular to the first direction.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: A laser soldering system using dynamic light spot and a method thereof are provided. A laser module is controlled to radiate toward multi-lens to form a light spot on a soldering target for soldering, and a lens distance between the multi-lens is adjusted to adjust a light spot size. The disclosure may provide multiple heating densities respectively adequate to different soldering status via adjusting the light spot size when using same laser power, so as to improve the soldering quality.

Abstract: Example systems, methods, and apparatus are disclosed herein for zero-shot black-box detection of neural Trojans.

Abstract: A test system and method of testing are provided. In some embodiments, a system for testing an integrated circuit package includes a device tester. The device tester includes a socket, a cylinder head unit engageable with the socket, and a pressure regulator. The socket includes a first pressure cylinder configured to engage a first region of the integrated circuit package and a second pressure cylinder configured to engage a second region of the integrated circuit package. The pressure regulator is configured to provide at gas at a first pressure to the first pressure cylinder and to provide the gas at a second pressure different than the first pressure to the second pressure cylinder.

Abstract: An electrostatic discharge (ESD) protection device is provided. A deep-well region is formed on a substrate. A first well region, a second well region, a third well region, and a fourth well region are formed on the deep-well region. A fifth well region is formed in the fourth well region. A first doped region is formed in the first well region. A second doped region is formed in the second well region. A third doped region is formed in the fourth well region. A gate structure covers the third well region. Each of the substrate, the second well region, the fourth well region, the second doped region, and the third doped region has a first conductivity type. Each of the deep-well region, the first well region, the third well region, the fifth well region, and the first doped region has a second conductivity type.

Abstract: A cell on an integrated circuit is provided. The cell includes: a fin structure; an intermediate fin structure connection metal track disposed in an intermediate fin structure connection metal layer above the fin structure, the intermediate fin structure connection metal track being connected to the fin structure; and a first intermediate gate connection metal track disposed in an intermediate gate connection metal layer above the intermediate fin structure connection metal layer, the first intermediate gate connection metal track being connected to the intermediate fin structure connection metal track. A first power supply terminal is connected to the first intermediate gate connection metal track.

Abstract: A method includes designing a plurality of cells for a semiconductor device, wherein designing the plurality of cells comprises reserving a routing track of a plurality of routing tracks within each of the plurality of cells, wherein each of the plurality of cells comprises signal lines, and the reserved routing track is free of the signal lines. The method includes placing a first cell and a second cell of the plurality of cells in a layout of the semiconductor device. The method includes determining whether any power rails overlap with any of the plurality of routing tracks other than the reserved routing track in the second cell. The method includes adjusting a distance between the first cell and the second cell in response to a determination that at least one power rail overlaps with at least one routing track other than the reserved routing track.

Abstract: A thermosiphon is provided for a computing system. The thermosiphon includes an evaporating portion and a pool portion. The evaporating portion is operable to be in thermal communication with a computing component of the computing system. The evaporating portion is operable to retain an evaporating volume of fluid to lower a temperature of the computing component. The pool portion is in fluid communication with the evaporating portion. The pool portion is operable to receive excess fluid of the fluid from the evaporating portion when a volume of the fluid in the evaporating portion is greater than the evaporating volume.

Abstract: The embodiments of the disclosure provide a method for rendering a virtual object, a host, and a computer readable storage medium. The method includes: determining a plurality of regions in an environment; determining lighting information of each of the plurality of regions; obtaining a to-be-rendered virtual object and selecting at least one candidate region corresponding to the to-be-rendered virtual object among the plurality of regions; determining a reference lighting information based on the lighting information of each of the at least one candidate region; and rendering the to-be-rendered virtual object based on the reference lighting information.

Abstract: A server system includes a rack, servers disposed in the rack and a heat dissipation module including a pump assembly, a main manifold assembly, heat exchange assemblies and a sub manifold assembly. The pump assembly is disposed in the rack. The main manifold assembly includes two main pipelines, one is connected to a main outlet of the pump assembly and inlets of the servers, and the other is connected to outlets of the servers and a main inlet of the pump assembly. The heat exchange assemblies are removably disposed in the rack. The sub manifold assembly includes two sub pipelines, one is connected to a sub outlet of the pump assembly and inlets of the heat exchange assemblies, and the other is connected to outlets of the heat exchange assemblies and a sub inlet of the pump assembly.

Abstract: An exemplary work press assembly for a test handler includes a presser and a guide frame. The presser is configured to secure a device under test (DUT) and press the DUT into a socket for testing. The guide frame is configured to receive guide pins of the socket. The presser extends through an opening of the guide frame, and the guide frame is sandwiched between a first presser portion and a second presser portion. The presser is formed of a first material having a first coefficient of thermal expansion (CTE), and the guide frame is formed from a second material having a second CTE that is less than the first CTE. In some embodiments, a thermal insulation layer(s) separates the presser from the guide frame. In some embodiments, a spacing between sidewalls of the presser and sidewalls of the guide frame is configured to accommodate thermal expansion of the presser.

Abstract: A device and a method of flattening recycled carbon fiber material are provided. A main body is provided with two flat plates at an upper and a lower positions corresponding to each other and an ultrasonic unit is disposed on each of the flat plates. While in use, recycled carbon fiber material is placed at the lower flat plate and then at least one ultrasonic probe of the ultrasonic unit is driven to work and vibrate the recycled carbon fiber material into a flat and thin state. After the flattened recycled carbon fiber material being pressurized to form products required, the product has flat and smooth surfaces with special textures. A thickness of the product can be controlled and the product can be thinned according to users' needs, without surface treatment such as grinding, polishing, etc. Thereby production cost is reduced and yield rate of the products is improved.

Abstract: A card edge connector includes: a connector base having a card slot and plural terminals; a latch located at one end of the connector base for locking a card; and a releasing member. The releasing member includes two levers and a moving member, the levers are connected with the connector base in a pivoting manner, a first end of the lever is connected with the latch and an opposite second end of the lever is coupled to the moving member, wherein when the card is inserted into the slot and presses against the moving member downwards, the moving member drives the second ends of the levers to move downward, resulting in the first ends moving upwards to push the latch to lock with the card, and when the card is pulled out the moving member resets and drives the levers to release the latch from the card.

Abstract: The present invention provides a polynucleotide and recombinant AAV encoding human alpha galactosidase A. The present invention also provides a method of treating Fabry disease comprising administering the recombinant AAV to a subject in need thereof.

Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.