Abstract: A semiconductor device may include a through substrate via (TSV) conductive structure that may extend vertically through two or more layers of the semiconductor device. The TSV conductive structure may be coupled to a first voltage supply. The semiconductor device may include substrate layer. The substrate layer may include a first dopant region and a second dopant region. The first dopant region may be coupled to a second voltage supply. The second dopant region may be in electrical communication with the TSV conductive structure. The semiconductor device may include a first metal layer and a first insulator layer disposed between the substrate layer and the first metal layer. The first metal layer may laterally contact the TSV conductive structure. The first and second voltage supply may be adapted to create a capacitance at a junction between the first dopant region and the second dopant region.

Abstract: A semiconductor chip has shapes on a particular level that are small enough to require a first mask and a second mask, the first mask and the second mask used in separate exposures during processing. A circuit on the semiconductor chip requires close tracking between a first and a second FET (field effect transistor). For example, the particular level may be a gate shape level. Separate exposures of gate shapes using the first mask and the second mask will result in poorer FET tracking (e.g., gate length, threshold voltage) than for FETs having gate shapes defined by only the first mask. FET tracking is selectively improved by laying out a circuit such that selective FETs are defined by the first mask. In particular, static random access memory (SRAM) design benefits from close tracking of six or more FETs in an SRAM cell.

Abstract: A TCAM may have a plurality of rows of cells. Each row may have a match line. Each cell may have elements for storing first and second bits, and compare circuitry associated to determine matches between a bit of a search word and data stored in the cell. For at least one first row of the rows, the TCAM includes a valid row cell having at least one element to store a partial update indication. The valid row cell may cause the match line associated with the first row to signal that the first row does not match a search word when the partial update indication associated with the first row is enabled. When the partial update indication associated with the first row is disabled, the determination of matches with a search word is performed solely by the compare circuitry without influence of the valid row cell.

Abstract: A TCAM may have a plurality of rows of cells. Each row may have a match line. Each cell may have elements for storing first and second bits, and compare circuitry associated to determine matches between a bit of a search word and data stored in the cell. For at least one first row of the rows, the TCAM includes a valid row cell having at least one element to store a partial update indication. The valid row cell may cause the match line associated with the first row to signal that the first row does not match a search word when the partial update indication associated with the first row is enabled. When the partial update indication associated with the first row is disabled, the determination of matches with a search word is performed solely by the compare circuitry wi thout influence of the valid row cell.

Abstract: A TCAM may have a plurality of rows of cells. Each row may have a match line. Each cell may have elements for storing first and second bits, and compare circuitry associated to determine matches between a bit of a search word and data stored in the cell. For at least one first row of the rows, the TCAM includes a valid row cell having at least one element to store a partial update indication. The valid row cell may cause the match line associated with the first row to signal that the first row does not match a search word when the partial update indication associated with the first row is enabled. When the partial update indication associated with the first row is disabled, the determination of matches with a search word is performed solely by the compare circuitry without influence of the valid row cell.

Abstract: A static random access memory (SRAM) having two or more SRAM memory cells connected with a write bit line (WBL) and a write bit line complement (WBLC) is disclosed. The SRAM may include a write driver logic coupled to the WBL and the WBLC. The write driver logic is adapted to drive a selected bit line of the WBL and the WBLC to a voltage uplevel below a first supply voltage and shut off the drive to the selected bit line when the selected bit line reaches the uplevel. The write driver logic is further adapted to drive an unselected bit line of the WBL and the WBLC to a downlevel, in conjunction with the driving of the selected bit line to the uplevel, where the downlevel is a second supply voltage lower than the first supply voltage.

Abstract: A semiconductor chip has shapes on a particular level that are small enough to require a first mask and a second mask, the first mask and the second mask used in separate exposures during processing. A circuit on the semiconductor chip requires close tracking between a first and a second FET (field effect transistor). For example, the particular level may be a gate shape level. Separate exposures of gate shapes using the first mask and the second mask will result in poorer FET tracking (e.g., gate length, threshold voltage) than for FETs having gate shapes defined by only the first mask. FET tracking is selectively improved by laying out a circuit such that selective FETs are defined by the first mask. In particular, static random access memory (SRAM) design benefits from close tracking of six or more FETs in an SRAM cell.

Abstract: An embodiment of the current disclosure is directed to a Static Random Access Memory (SRAM) device, and a design structure for the SRAM device. The SRAM device may include one or more SRAM cells. Each SRAM cell may further include a first and a second CMOS inverter that are cross-coupled. The first and second CMOS inverters may each have a first switch and a second switch. The SRAM device may also include a reset circuit. The reset circuit may be coupled to a first node of the first switch of the first CMOS inverter. The reset circuit may drive the first CMOS inverter to output a logical high signal in a reset mode.

Abstract: A domino static random access memory (SRAM) having one or more SRAM memory cells connected with a local bit line is disclosed. The SRAM may include a global bit line, a first precharge device connected between a voltage supply and the local bit line, and a second precharge device connected between the voltage supply and the global bit line. In addition the SRAM may include a global bit line discharge logic connected with the global bit line and the local bit line. The global bit line discharge logic is adapted to draw the global bit line to a voltage below a precharge voltage and above a ground voltage during a read operation.

Abstract: A static random access memory (SRAM) includes a column of SRAM memory cells. The SRAM may include a circuit to copy a value stored in any SRAM memory cell in a column of SRAM memory cells to any SRAM memory cell in the column of SRAM memory cells in a single cycle of the SRAM.

Abstract: A static random access memory (SRAM) having two or more SRAM memory cells connected with a write bit line (WBL) and a write bit line complement (WBLC) is disclosed. The SRAM may include a write driver logic coupled to the WBL and the WBLC. The write driver logic is adapted to drive a selected bit line of the WBL and the WBLC to a voltage uplevel below a first supply voltage and shut off the drive to the selected bit line when the selected bit line reaches the uplevel. The write driver logic is further adapted to drive an unselected bit line of the WBL and the WBLC to a downlevel, in conjunction with the driving of the selected bit line to the uplevel, where the downlevel is a second supply voltage lower than the first supply voltage.

Abstract: A semiconductor chip and method for diagnostic testing of combinational logic in a logic and array system including Logic Built in Self Test (LBIST) diagnostics are provided. The semiconductor chip includes a logic and array system, an LBIST system, a clocking module, and an addressing module. The method for diagnostic testing includes providing an initialization pattern to an array in the logic and array system, applying a diagnostic control setup, and running the diagnostic test. The diagnostic control setup includes firing a clock every diagnostic test clock cycle and selecting an address from a subset of an address space.

Abstract: A domino static random access memory (SRAM) having one or more SRAM memory cells connected with a local bit line is disclosed. The SRAM may include a precharge device connected between a voltage supply and the local bit line, and global bit line (GBL) discharge logic connected between a local bit line and a GBL. The GBL discharge logic transfers a logic value of the local bit line to the GBL during a read operation. GBL precharge logic connects the GBL to a global precharge input. The GBL precharge logic is adapted to draw the GBL to a precharge voltage above a discharge voltage and below a supply voltage during a precharge operation.

Abstract: A domino static random access memory (SRAM) having one or more SRAM memory cells connected with a local bit line is disclosed. The SRAM may include a precharge device connected between a voltage supply and the local bit line, and global bit line (GBL) discharge logic connected between a local bit line and a GBL. The GBL discharge logic transfers a logic value of the local bit line to the GBL during a read operation. GBL precharge logic connects the GBL to a global precharge input. The GBL precharge logic is adapted to draw the GBL to a precharge voltage above a discharge voltage and below a supply voltage during a precharge operation.

Abstract: A semiconductor device may include a through substrate via (TSV) conductive structure that may extend vertically through two or more layers of the semiconductor device. The TSV conductive structure may be coupled to a first voltage supply. The semiconductor device may include substrate layer. The substrate layer may include a first dopant region and a second dopant region. The first dopant region may be coupled to a second voltage supply. The second dopant region may be in electrical communication with the TSV conductive structure. The semiconductor device may include a first metal layer and a first insulator layer disposed between the substrate layer and the first metal layer. The first metal layer may laterally contact the TSV conductive structure. The first and second voltage supply may be adapted to create a capacitance at a junction between the first dopant region and the second dopant region.

Abstract: A semiconductor device may include a through substrate via (TSV) conductive structure that may extend vertically through two or more layers of the semiconductor device. The TSV conductive structure may be coupled to a first voltage supply. The semiconductor device may include substrate layer. The substrate layer may include a first dopant region and a second dopant region. The first dopant region may be coupled to a second voltage supply. The second dopant region may be in electrical communication with the TSV conductive structure. The semiconductor device may include a first metal layer and a first insulator layer disposed between the substrate layer and the first metal layer. The first metal layer may laterally contact the TSV conductive structure. The first and second voltage supply may be adapted to create a capacitance at a junction between the first dopant region and the second dopant region.

Abstract: A circuit and method erase at power-up all data stored in a DRAM chip for increased data security. All the DRAM memory cells are erased by turning on the transistors for the DRAM storage cells simultaneously by increasing the body voltage of cells. In the example circuit, the body voltage is increased by a charge pump controlled by a power-on-reset (POR) signal applying a voltage to the p-well of the memory cells. The added voltage to the p-well lowers the threshold voltage of the cell, such that the NFET transistor of the memory cell will turn on. With all the devices turned on, the data stored in the memory cells is erased as the voltage of all the cells connected to a common bitline coalesce to a single value.

Abstract: A domino static random access memory (SRAM) having one or more SRAM memory cells connected with a local bit line is disclosed. The SRAM may include a global bit line, a first precharge device connected between a voltage supply and the local bit line, and a second precharge device connected between the voltage supply and the global bit line. In addition the SRAM may include a global bit line discharge logic connected with the global bit line and the local bit line. The global bit line discharge logic is adapted to draw the global bit line to a voltage below a precharge voltage and above a ground voltage during a read operation.

Abstract: A domino static random access memory (SRAM) having one or more SRAM memory cells connected with a local bit line is disclosed. The SRAM may include a global bit line, a first precharge device connected between a voltage supply and the local bit line, and a second precharge device connected between the voltage supply and the global bit line. In addition the SRAM may include a global bit line discharge logic connected with the global bit line and the local bit line. The global bit line discharge logic is adapted to draw the global bit line to a voltage below a precharge voltage and above a ground voltage during a read operation.

Abstract: A method and circuit for implementing delay correction in static random access memory (SRAM), and a design structure on which the subject circuit resides are provided. The SRAM circuit includes a precharge enable signal coupled between precharge near and precharge far signals and wordline near and wordline far signals of the SRAM. A precharge pull down device is coupled between the precharge far signal and ground and is controlled responsive to the precharge enable signal to decrease a time delay of the falling transition of the precharge far signal. A respective word line pull up device is coupled between a respective wordline far signal and a voltage supply rail and is controlled responsive to the precharge enable signal to increase wordline voltage level upon a rising transition of the wordline far signal.