Patents by Inventor Tom K. Cho

Tom K. Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190226512
    Abstract: Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.
    Type: Application
    Filed: January 16, 2019
    Publication date: July 25, 2019
    Inventors: Govinda RAJ, Tom K. CHO, Hamid MOHIUDDIN, Ian WIDLOW
  • Patent number: 10347522
    Abstract: A method and apparatus for discharging a residual charge from a substrate support. In one example, a substrate support is provided that includes a body, an electrode disposed in the body, a radiation emitter and a diffuser. The body has one or more holes formed in a workpiece support surface, the workpiece support surface configured to accept a substrate thereon. The electrode is configured to electrostatically hold a substrate to the workpiece support surface. The radiation emitter is disposed in a first hole of the one or more holes formed in the workpiece support surface. The radiation emitter is configured to emit electromagnetic energy out of the first hole. The diffuser is disposed in first hole over the radiation emitter.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: July 9, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Wendell Glen Boyd, Jr., Tom K. Cho, Robert T. Hirahara
  • Publication number: 20190148121
    Abstract: The present disclosure generally relates to apparatus and methods for symmetry in electrical field, gas flow and thermal distribution in a processing chamber to achieve process uniformity. Embodiment of the present disclosure includes a plasma processing chamber having a plasma source, a substrate support assembly and a vacuum pump aligned along the same central axis to create substantially symmetrical flow paths, electrical field, and thermal distribution in the plasma processing chamber resulting in improved process uniformity and reduced skew.
    Type: Application
    Filed: January 15, 2019
    Publication date: May 16, 2019
    Inventors: Andrew NGUYEN, Yogananda SARODE VISHWANATH, Tom K. CHO
  • Patent number: 10211033
    Abstract: The present disclosure generally relates to apparatus and methods for symmetry in electrical field, gas flow and thermal distribution in a processing chamber to achieve process uniformity. Embodiment of the present disclosure includes a plasma processing chamber having a plasma source, a substrate support assembly and a vacuum pump aligned along the same central axis to create substantially symmetrical flow paths, electrical field, and thermal distribution in the plasma processing chamber resulting in improved process uniformity and reduced skew.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: February 19, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Andrew Nguyen, Yogananda Sarode Vishwanath, Tom K. Cho
  • Publication number: 20190043744
    Abstract: A method and apparatus for monitoring substrate lift pin operation is disclosed and includes a support pedestal for a vacuum chamber, the support pedestal comprising a body having a plurality of openings formed between two major sides of the body, and a substrate support device disposed in each of the plurality of openings, each of the support devices comprising a housing disposed in the body, the housing having a bore formed therethrough, and a support pin disposed in the bore, wherein the body includes a monitoring device positioned proximal to the support pins of each of the substrate support devices.
    Type: Application
    Filed: July 26, 2018
    Publication date: February 7, 2019
    Inventors: Tom K. CHO, Ali SALEHPOUR, Stanley WU, Ying MA
  • Publication number: 20180342377
    Abstract: An apparatus includes a reactive species source, a spectral measurement volume, a light source to emit a light beam into the spectral measurement volume, a spectrometer to receive the light beam from the spectral measurement volume. The apparatus includes an a controller configured to, when a reactive species is present in the spectral measurement volume, control the light source to emit the light beam into the spectral measurement volume and the spectrometer to determine an environment spectrum using the light beam, and when the reactive species is not present in the spectral measurement volume, control the light source to emit the light beam into the spectral measurement volume and the spectrometer to determine a baseline spectrum using the light beam, calculate a net spectrum based on a difference between the environment spectrum and the baseline spectrum, and estimate a concentration of the reactive species based on the net spectrum.
    Type: Application
    Filed: May 9, 2018
    Publication date: November 29, 2018
    Inventors: Ramesh GOPALAN, Tom K. CHO, George ALAJAJIAN, Michael J. MARK
  • Patent number: 10010912
    Abstract: Methods and apparatus for particle reduction in throttle gate valves used in substrate process chambers are provided herein. In some embodiments, a gate valve for use in a process chamber includes a body having an opening disposed therethrough from a first surface to an opposing second surface of the body; a pocket extending into the body from a sidewall of the opening; a gate movably disposed within the pocket between a closed position that seals the opening and an open position that reveals the opening and disposes the gate completely within the pocket; and a plurality of gas ports disposed in the gate valve configured to direct a gas flow into a portion of the gate valve fluidly coupled to the opening.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: July 3, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jared Ahmad Lee, Dmitry Lubomirsky, Martin Jeff Salinas, Andrew Nguyen, Tom K. Cho, Eric A. Englhardt, Fernando Silveira
  • Publication number: 20180105922
    Abstract: An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 ?m, wherein the plasma resistant rare earth oxide film consists essentially of 40 mol % to less than 100 mol % of Y2O3, over 0 mol % to 60 mol % of ZrO2, and 0 mol % to 9 mol % of Al2O3.
    Type: Application
    Filed: December 15, 2017
    Publication date: April 19, 2018
    Inventors: Jennifer Y. Sun, Vahid Firouzdor, Biraja Prasad Kanungo, Tom K. Cho, Vedapuram S. Achutharaman, Ying Zhang
  • Publication number: 20180010234
    Abstract: An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 ?m, wherein the plasma resistant rare earth oxide is selected from a group consisting of YF3, Er4Al2O9, ErAlO3, and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.
    Type: Application
    Filed: September 21, 2017
    Publication date: January 11, 2018
    Inventors: Jennifer Y. Sun, Vahid Firouzdor, Biraja Prasad Kanungo, Tom K. Cho, Vedapuram S. Achutharaman, Ying Zhang
  • Publication number: 20180010235
    Abstract: An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 ?m, wherein the plasma resistant rare earth oxide film is selected from a group consisting of an Er—Y composition, an Er—Al—Y composition, an Er—Y—Zr composition, and an Er—Al composition.
    Type: Application
    Filed: September 21, 2017
    Publication date: January 11, 2018
    Inventors: Jennifer Y. Sun, Vahid Firouzdor, Biraja Prasad Kanungo, Tom K. Cho, Vedapuram S. Achutharaman, Ying Zhang
  • Patent number: 9797037
    Abstract: An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 ?m, wherein the plasma resistant rare earth oxide has a composition of 40-45 mol % of Y2O3, 5-10 mol % of ZrO2, 35-40 mol % of Er2O3, 5-10 mol % of Gd2O3, and 5-15 mol % of SiO2.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: October 24, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Jennifer Y. Sun, Vahid Firouzdor, Biraja Prasad Kanungo, Tom K. Cho, Vedapuram S. Achutharaman, Ying Zhang
  • Publication number: 20170263487
    Abstract: A method and apparatus for discharging a residual charge from a substrate support. In one example, a substrate support is provided that includes a body, an electrode disposed in the body, a radiation emitter and a diffuser. The body has one or more holes formed in a workpiece support surface, the workpiece support surface configured to accept a substrate thereon. The electrode is configured to electrostatically hold a substrate to the workpiece support surface. The radiation emitter is disposed in a first hole of the one or more holes formed in the workpiece support surface. The radiation emitter is configured to emit electromagnetic energy out of the first hole. The diffuser is disposed in first hole over the radiation emitter.
    Type: Application
    Filed: March 14, 2017
    Publication date: September 14, 2017
    Inventors: Wendell Glen BOYD, JR., Tom K. CHO, Robert T. HIRAHARA
  • Patent number: 9761416
    Abstract: Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: September 12, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Andrew Nguyen, Bradley Howard, Shahid Rauf, Ajit Balakrishna, Tom K. Cho, Kenneth S. Collins, Anand Kumar, Michael D. Willwerth, Yogananda Sarode Vishwanath
  • Patent number: 9725799
    Abstract: A method of manufacturing an article includes providing a component for an etch reactor. Ion beam sputtering with ion assisted deposition (IBS-IAD) is then performed to deposit a protective layer on at least one surface of the component, wherein the protective layer is a plasma resistant film having a thickness of less than 1000 ?m.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: August 8, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Jennifer Y. Sun, Vahid Firouzdor, Biraja Prasad Kanungo, Tom K. Cho, Vedapuram S. Achutharaman, Ying Zhang
  • Patent number: 9714465
    Abstract: Embodiments of the present invention generally provide apparatus and methods for altering the flow and pressure differential of process gases supplied across a showerhead of a processing chamber to provide improved deposition uniformity across the surface of a substrate disposed therein. In one embodiment, a blocker plate is disposed between a backing plate and a showerhead. In one embodiment, the distance between the blocker plate and the showerhead is adjustable. In another embodiment, the blocker plate has a non-planar surface contour. In another embodiment, a regional blocker plate is disposed between a backing plate and a showerhead. In another embodiment, a central blocker plate and a peripheral blocker plate are disposed between a backing plate and a showerhead.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: July 25, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Lun Tsuei, Alan Tso, Tom K. Cho, Brian Sy-Yuan Shieh
  • Publication number: 20160326625
    Abstract: An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 ?m, wherein the plasma resistant rare earth oxide is selected from a group consisting of YF3, Er4Al2O9, ErAlO3, and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.
    Type: Application
    Filed: July 15, 2016
    Publication date: November 10, 2016
    Inventors: Jennifer Y. Sun, Vahid Firouzdor, Biraja Prasad Kanungo, Tom K. Cho, Vedapuram S. Achutharaman, Ying Zhang
  • Publication number: 20150293527
    Abstract: The present disclosure generally relates to process chambers having modular design to provide variable process volume and improved flow conductance and uniformity. The modular design according to the present disclosure achieves improved process uniformity and symmetry with simplified chamber structure. The modular design further affords flexibility of performing various processes or processing substrates of various sizes by replacing one or more modules in a modular process chamber according to the present disclosure.
    Type: Application
    Filed: April 2, 2015
    Publication date: October 15, 2015
    Inventors: Andrew NGUYEN, Yogananda SARODE VISHWANATH, Tom K. CHO
  • Publication number: 20150218697
    Abstract: The present disclosure generally relates to apparatus and methods for symmetry in electrical field, gas flow and thermal distribution in a processing chamber to achieve process uniformity. Embodiment of the present disclosure includes a plasma processing chamber having a plasma source, a substrate support assembly and a vacuum pump aligned along the same central axis to create substantially symmetrical flow paths, electrical field, and thermal distribution in the plasma processing chamber resulting in improved process uniformity and reduced skew.
    Type: Application
    Filed: February 2, 2015
    Publication date: August 6, 2015
    Inventors: Andrew NGUYEN, Yogananda SARODE VISHWANATH, Tom K. CHO
  • Patent number: 9089007
    Abstract: Methods and substrate processing systems are provided for controlling substrate heating efficiency and generating a desired temperature profile on the surface of a substrate when the substrate is disposed on a substrate support surface of a substrate support assembly. The substrate support assembly is provided with minimum software control and hardware requirement and includes a heating element comprised of multiple heating elements sections. The heating element is connected to a power source for adjusting the temperature outputs of the multiple heating element sections and providing adjustable multi-heating zones and desired temperature distribution over the substrate support surface of the substrate support assembly within a process chamber.
    Type: Grant
    Filed: February 14, 2013
    Date of Patent: July 21, 2015
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Yao-Hung Yang, Jeonghoon Oh, Frank F. Hooshdaran, Tom K. Cho, Tao Hou
  • Publication number: 20150158775
    Abstract: A method of manufacturing an article includes providing a component for an etch reactor. Ion beam sputtering with ion assisted deposition (IBS-IAD) is then performed to deposit a protective layer on at least one surface of the component, wherein the protective layer is a plasma resistant film having a thickness of less than 1000 ?m.
    Type: Application
    Filed: December 5, 2014
    Publication date: June 11, 2015
    Inventors: Jennifer Y. Sun, Vahid Firouzdor, Biraja Prasad Kanungo, Tom K. Cho, Vedapuram S. Achutharaman, Ying Zhang