Patents by Inventor Tomohiro Okumura
Tomohiro Okumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230334243Abstract: A document processing method is provided for causing a processor to execute a process. The document processing method includes: confirming whether the extracted order letters are in an ascending order and serially numbered according to a predetermined rule in the document information, the order letters being extracted form units information and defining an order of the units information in the document information, the units information being generated by diving the document information by a predetermined unit; and outputting alert information including a correction candidate which shows the order letters being in the ascending order and serially numbered.Type: ApplicationFiled: June 21, 2023Publication date: October 19, 2023Inventors: Ruka FUNAKI, Tomohiro OKUMURA, Yuya WATANABE
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Patent number: 11522486Abstract: A temperature estimation device estimates a drive duty ratio by taking account of the influence of ambient temperature on the energization to a coil part, on the basis of a drive duty ratio and the ambient temperature, and estimates the power consumption of a motor when the coil part is energized with the estimated drive duty ratio, the power consumption of the motor, this power consumption being accompanied by the heat dissipation of the coil part, the power difference between both the power consumption values, the temperature time constant of the coil part, and a temperature variation during a period of the temperature time constant of the coil part, and estimates the temperature variation of the coil part from the ambient temperature on the basis of these estimated values and a last temperature variation of the coil part.Type: GrantFiled: November 13, 2018Date of Patent: December 6, 2022Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Yoshitaka Ikitake, Ryoichi Ishihara, Yuki Minakuchi, Tomohiro Okumura, Daishi Iwasa
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Publication number: 20210336576Abstract: A temperature estimation device estimates a drive duty ratio by taking account of the influence of ambient temperature on the energization to a coil part, on the basis of a drive duty ratio and the ambient temperature, and estimates the power consumption of a motor when the coil part is energized with the estimated drive duty ratio, the power consumption of the motor, this power consumption being accompanied by the heat dissipation of the coil part, the power difference between both the power consumption values, the temperature time constant of the coil part, and a temperature variation during a period of the temperature time constant of the coil part, and estimates the temperature variation of the coil part from the ambient temperature on the basis of these estimated values and a last temperature variation of the coil part.Type: ApplicationFiled: November 13, 2018Publication date: October 28, 2021Applicant: Mitsubishi Electric CorporationInventors: Yoshitaka IKITAKE, Ryoichi ISHIHARA, Yuki MINAKUCHI, Tomohiro OKUMURA, Daishi IWASA
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Patent number: 10804122Abstract: To provide a substrate heating apparatus, a substrate heating method and a method of manufacturing an electronic device having excellent uniformity at the time of processing the substrate by a linear heat source. A substrate heating apparatus including a substrate holding tool holding a substrate as a processed object, a heat source heating the substrate held by the substrate holding tool by a linear heating portion, a moving mechanism allowing the substrate holding tool and the heat source to relatively move in a direction orthogonal to a longitudinal direction of the linear heating portion of the heat source and a cooling mechanism arranged in the substrate holding tool and contacting the substrate to cool an outer peripheral portion of the substrate, in which the cooling mechanism has a distribution in cooling ability according to a position of the substrate.Type: GrantFiled: December 13, 2017Date of Patent: October 13, 2020Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Masahiro Yamamoto, Tomohiro Okumura
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Patent number: 10229814Abstract: A plasma processing apparatus has a circular chamber having an opening portion which serves as a plasma ejection port surrounded by a dielectric member, a gas supply pipe for introducing gas into the inside of the chamber, a coil provided in the vicinity of the chamber, a high-frequency power supply connected to the coil, and a base material mounting table.Type: GrantFiled: October 26, 2012Date of Patent: March 12, 2019Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Tomohiro Okumura, Hiroshi Kawaura, Tetsuya Yukimoto
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Patent number: 10181406Abstract: In an inductively-coupled plasma torch unit, a coil, a first ceramic block, and a second ceramic block are arranged parallel to one another, and an elongated chamber has an annular shape. Plasma generated inside the chamber is ejected toward a substrate through an opening portion in the chamber. The substrate is processed by relatively moving the elongated chamber and the substrate in a direction perpendicular to a longitudinal direction of the opening portion. A rotating ceramic pipe having a cylindrical shape is provided so as to cause a refrigerant to flow into a cavity formed inside the ceramic pipe. Accordingly, it becomes possible to apply greater high-frequency power, thereby enabling fast plasma processing.Type: GrantFiled: September 1, 2015Date of Patent: January 15, 2019Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Tomohiro Okumura, Satoshi Suemasu
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Patent number: 10147585Abstract: A plasma processing apparatus having a dielectric member that surrounds a circular chamber having a long shape and communicating with an opening portion having a long and linear shape, a gas supply pipe for introducing gas into an inside of the circular chamber, a coil provided in a vicinity of the circular chamber and having a long shape in parallel with a longitudinal direction of the opening portion, a high-frequency power supply connected to the coil, a base material mounting table that mounts a base material, and a moving mechanism that allows relative movement between the circular chamber and the base material mounting table in a perpendicular direction with respect to an longitudinal direction of the opening portion.Type: GrantFiled: April 8, 2014Date of Patent: December 4, 2018Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Tomohiro Okumura, Hiroshi Kawaura, Tetsuya Yukimoto
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Patent number: 10141162Abstract: Linear coils, a first ceramic block, and a second ceramic block are arranged in an inductively-coupled plasma torch. A chamber has an annular shape. Plasma generated inside the chamber is ejected to a substrate through an opening portion in the chamber. The substrate is processed by relatively moving the chamber and the substrate in a direction perpendicular to a longitudinal direction of the opening portion. The coil is arranged inside a rotating cylindrical ceramic pipe. Accordingly, the plasma can be generated with excellent power efficiency, and fast plasma processing can be performed.Type: GrantFiled: July 11, 2017Date of Patent: November 27, 2018Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Tomohiro Okumura, Satoshi Suemasu
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Patent number: 10115565Abstract: According to the invention, there is provided a plasma processing apparatus which can generate plasma stably and efficiently, and can efficiently treat all of the desired regions to be treated of a base material within a short period of time. Provided is a plasma processing apparatus including an opening portion having an opening width of 1 mm or more; a dielectric member that defines a circular chamber constituting a circular space which communicates the opening; a gas supply pipe that introduces gas into an inside of the circular chamber; a coil that is provided in a vicinity of the circular chamber; a high-frequency power supply that is connected to the coil; and a base material mounting table on which a base material is disposed near the opening.Type: GrantFiled: March 1, 2013Date of Patent: October 30, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Tomohiro Okumura, Ichiro Nakayama
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Publication number: 20180211855Abstract: To provide a substrate heating apparatus, a substrate heating method and a method of manufacturing an electronic device having excellent uniformity at the time of processing the substrate by a linear heat source. A substrate heating apparatus including a substrate holding tool holding a substrate as a processed object, a heat source heating the substrate held by the substrate holding tool by a linear heating portion, a moving mechanism allowing the substrate holding tool and the heat source to relatively move in a direction orthogonal to a longitudinal direction of the linear heating portion of the heat source and a cooling mechanism arranged in the substrate holding tool and contacting the substrate to cool an outer peripheral portion of the substrate, in which the cooling mechanism has a distribution in cooling ability according to a position of the substrate.Type: ApplicationFiled: December 13, 2017Publication date: July 26, 2018Inventors: MASAHIRO YAMAMOTO, TOMOHIRO OKUMURA
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Patent number: 9978593Abstract: A plasma processing device, a plasma processing method and a manufacturing method of an electronic device with excellent uniformity, are capable of performing heating and high-speed processing for a short period of time as well as controlling the distribution of heating performances in a linear direction (amounts of heat influx to a substrate). In an inductively-coupled plasma torch unit, coils, a first ceramic block and a second ceramic block are arranged, and a chamber has an annular shape. A plasma P is applied to a substrate at an opening of the chamber. The chamber and the substrate are relatively moved in a direction perpendicular to a longitudinal direction of the opening. Plural gas jetting ports jetting a gas toward a substrate stage are provided side by side in a direction of a line formed by the opening, thereby controlling the distribution of heating performances in the linear direction and realizing plasma processing with excellent uniformity.Type: GrantFiled: March 17, 2017Date of Patent: May 22, 2018Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventor: Tomohiro Okumura
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Patent number: 9885115Abstract: A plasma treatment apparatus that includes a chamber having an opening portion which serves as a plasma ejection port surrounded by a dielectric member; a gas supply pipe that introduces gas into an inside of the chamber; a solenoid coil disposed in a vicinity of the chamber; a high-frequency power supply having a pulse modulation function which is connected to the solenoid coil; and a base material mounting table disposed on a plasma ejection port side. Plasma can be stably generated using the plasma treatment apparatus.Type: GrantFiled: November 29, 2012Date of Patent: February 6, 2018Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventor: Tomohiro Okumura
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Publication number: 20170309451Abstract: Linear coils, a first ceramic block, and a second ceramic block are arranged in an inductively-coupled plasma torch. A chamber has an annular shape. Plasma generated inside the chamber is ejected to a substrate through an opening portion in the chamber. The substrate is processed by relatively moving the chamber and the substrate in a direction perpendicular to a longitudinal direction of the opening portion. The coil is arranged inside a rotating cylindrical ceramic pipe. Accordingly, the plasma can be generated with excellent power efficiency, and fast plasma processing can be performed.Type: ApplicationFiled: July 11, 2017Publication date: October 26, 2017Inventors: TOMOHIRO OKUMURA, SATOSHI SUEMASU
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Patent number: 9799495Abstract: A plasma processing apparatus that performs plasma processing on a substrate held on a transport carrier including an annular frame and a holding sheet. The apparatus includes a process chamber; a process gas supply unit that supplies process gas to the process chamber; a decompressing mechanism that decompresses the process chamber; a plasma excitation device that generates plasma in the process chamber; a stage in the chamber, on which the transport carrier is loaded; a cooling mechanism for cooling the stage; a cover that partly covers the holding sheet and the frame and that has a window section through which the substrate is partly exposed to plasma; a correction member that presses the frame onto the stage and corrects warpage of the frame; and a movement device that moves the correction member. The correction member is provided separately from the cover to be covered by the cover.Type: GrantFiled: August 25, 2015Date of Patent: October 24, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Shogo Okita, Bunji Miizuno, Tomohiro Okumura
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Publication number: 20170287712Abstract: A plasma processing device, a plasma processing method and a manufacturing method of an electronic device with excellent uniformity, are capable of performing heating and high-speed processing for a short period of time as well as controlling the distribution of heating performances in a linear direction (amounts of heat influx to a substrate). In an inductively-coupled plasma torch unit, coils, a first ceramic block and a second ceramic block are arranged, and a chamber has an annular shape. A plasma P is applied to a substrate at an opening of the chamber. The chamber and the substrate are relatively moved in a direction perpendicular to a longitudinal direction of the opening. Plural gas jetting ports jetting a gas toward a substrate stage are provided side by side in a direction of a line formed by the opening, thereby controlling the distribution of heating performances in the linear direction and realizing plasma processing with excellent uniformity.Type: ApplicationFiled: March 17, 2017Publication date: October 5, 2017Inventor: TOMOHIRO OKUMURA
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Patent number: 9741538Abstract: Linear coils, a first ceramic block, and a second ceramic block are arranged in an inductively-coupled plasma torch. A chamber has an annular shape. Plasma generated inside the chamber is ejected to a substrate through an opening portion in the chamber. The substrate is processed by relatively moving the chamber and the substrate in a direction perpendicular to a longitudinal direction of the opening portion. The coil is arranged inside a rotating cylindrical ceramic pipe. Accordingly, the plasma can be generated with excellent power efficiency, and fast plasma processing can be performed.Type: GrantFiled: March 18, 2016Date of Patent: August 22, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Tomohiro Okumura, Satoshi Suemasu
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Patent number: 9691593Abstract: To provide a plasma processing device and a plasma processing method capable of performing high-speed processing. In an inductively-coupled plasma torch unit, a coil, a lid and a first ceramic block are bonded together, and a long chamber has an annular shape. Plasma generated in the chamber is ejected from an opening in the chamber toward a substrate. The substrate is processed by moving the long chamber and the substrate mounting table relatively in a direction perpendicular to a longitudinal direction of the opening. The first ceramic block is cooled efficiently by allowing a refrigerant to flow in a refrigerant flow path.Type: GrantFiled: July 22, 2014Date of Patent: June 27, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventor: Tomohiro Okumura
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Publication number: 20170178925Abstract: To provide a plasma processing device, a plasma processing method and a method of manufacturing electronic devices capable of performing high-speed processing as well as using the plasma stably. In an inductively-coupled plasma, torch unit, a coil, a first ceramic block and a second ceramic block are arranged in parallel, and a long chamber has an annular shape. Plasma generated in the chamber is ejected from an opening in the chamber toward a substrate. The substrate is processed by moving the long chamber and the substrate mounting table relatively in a direction perpendicular to a longitudinal direction of the opening. A discharge suppression gas is introduced into a space between the inductively-coupled plasma torch unit and the substrate inside the chamber through a discharge suppression gas supply hole, thereby generating long plasma stably.Type: ApplicationFiled: March 9, 2017Publication date: June 22, 2017Inventor: TOMOHIRO OKUMURA
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Patent number: 9673062Abstract: To provide a plasma processing device, a plasma processing method and a method of manufacturing electronic devices capable of performing high-speed processing as well as using the plasma stably. In an inductively-coupled plasma torch unit, a coil, a first ceramic block and a second ceramic block are arranged in parallel, and a long chamber has an annular shape. Plasma generated in the chamber is ejected from an opening in the chamber toward a substrate. The substrate is processed by moving the long chamber and the substrate mounting table relatively in a direction perpendicular to a longitudinal direction of the opening. A discharge suppression gas is introduced into a space between the inductively-coupled plasma torch unit and the substrate inside the chamber through a discharge suppression gas supply hole, thereby generating long plasma stably.Type: GrantFiled: March 9, 2017Date of Patent: June 6, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventor: Tomohiro Okumura
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Patent number: 9627183Abstract: To provide a plasma processing device, a plasma processing method and a method of manufacturing electronic devices capable of performing high-speed processing as well as using the plasma stably. In an inductively-coupled plasma torch unit, a coil, a first ceramic block and a second ceramic block are arranged in parallel, and a long chamber has an annular shape. Plasma generated in the chamber is ejected from an opening in the chamber toward a substrate. The substrate is processed by moving the long chamber and the substrate mounting table relatively in a direction perpendicular to a longitudinal direction of the opening. A discharge suppression gas is introduced into a space between the inductively-coupled plasma torch unit and the substrate inside the chamber through a discharge suppression gas supply hole, thereby generating long plasma stably.Type: GrantFiled: July 25, 2014Date of Patent: April 18, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventor: Tomohiro Okumura