Abstract: A PTFE sheet in which PTFE fibers having a diameter of 1 ?m or less are spun, the PTFE sheet having a Gurley value in the range of 1 s/100 cc/in2 to 3 s/100 cc/in2 and a shrinkage factor in a direction orthogonal to a sheet winding direction of no more than 10% when heated to 300° C. The PTFE sheet makes a die adsorbable via a tool, which is for heating the die when the die is mounted on a mounting body, by being sandwiched between the die and the tool, and suppresses the adhesion, to an adsorption surface of the tool or to the die, of an adhesion member for fixing the die to the mounted body. Through this configuration, a PTFE sheet capable of stabilizing vacuum adsorption and improving maintainability and a method for mounting a die are provided.

Abstract: An inspection apparatus includes a light source unit, cameras, a keyboard, and a controller that determines a wavelength of the excitation light, based on the information on the emission color received by the keyboard, and that controls the light source unit so that the light source unit generates excitation light with the determined wavelength. The controller determines a wavelength longer than an absorption edge wavelength of the substrate of the sample and shorter than a peak wavelength of an emission spectrum of the light-emitting element, the peak wavelength being specified from the information on the emission color, to be the wavelength of the excitation light.

Abstract: A pick-up device 10 for picking up a semiconductor chip 100 attached to a front surface of a sheet material 110 is provided with: a stage 12 that includes a material a part or the entirety of which is capable of transmitting a destaticizing electromagnetic wave having an ionization effect and that attracts and holds a rear surface of the sheet material 110; a jacking-up pin 26 for jacking up the semiconductor chip 100 from the rear side of the stage 12; and a destaticizing mechanism 20 that destaticizes charge generated between the semiconductor chip 100 and the sheet material 110 by irradiating the rear surface of the semiconductor chip 100 with the destaticizing electromagnetic wave that is made to pass through the sheet material 110 from the rear side of the stage 12.

Abstract: A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.

Abstract: A solid immersion lens unit includes a solid immersion lens and a holder for swingably holding the solid immersion lens. The solid immersion lens includes a first lens portion formed of a first material, and a second lens portion formed of a second material having a refractive index smaller than a refractive index of the first material and coupled to the first lens portion. The first lens portion includes a contact surface for contacting with an observation object and a convex first spherical surface. The second lens portion includes a concave second spherical surface facing the first spherical surface and a convex third spherical surface to be disposed to face an objective lens. The holder has a contact portion configured to be contactable with the third spherical surface.

Abstract: A device analysis apparatus is a device analysis apparatus for determining a quality of a power semiconductor device, including an application unit that applies a voltage signal to the power semiconductor device, a light detection unit that detects light from the power semiconductor device at a plurality of detection positions and outputs detection signals based on detection results, and a determination unit that determines the quality of the power semiconductor device based on temporal changes of the detection signals.

Abstract: A carrier lifetime measurement method for measuring a lifetime of carriers in a measurement target object includes an irradiation step of irradiating a DUT 10 serving as a measurement target object with measurement light and stimulus light subjected to intensity modulation using a plurality of frequencies, an outputting step of outputting a detection signal by detecting an intensity of reflected light from the DUT 10 or transmitted light through the DUT 10, and a generation step of detecting a phase delay of the detection signal with respect to a modulation signal including a frequency in association with a concentration of impurities in a measurement target region of the plurality of frequencies and generating image data indicating a distribution of lifetimes of carriers in the DUT 10 on the basis of the phase delay.

Abstract: The present invention relates to a measuring device having a structure for adjusting inclination of an observation surface of a sample with respect to a reference surface which is orthogonal to an optical axis of an objective lens, and the like. The measuring device includes a scanner, arranged on a propagation path of illumination light traveling from a light source toward the sample, configured to change an emission angle of the illumination light, and inclination information of the sample is obtained by associating a signal value of a detection signal for reflected light from the sample and the emission angle of the illumination light, while changing the emission angle of the illumination light by the scanner.

Abstract: A bonding apparatus bonds a semiconductor die, which has a first mam surface provided with a bump electrode, to a substrate by means of thermo-compression, with a thermo-compression film being interposed therebetween. The bonding apparatus includes: an intermediate stage that has a die placing surface on which the semiconductor die is placed such that the die placing surface faces the first main surface; and a bonding tool which detachably holds a second main surface of the semiconductor die that is placed on the intermediate stage, the second main surface being on the reverse side of the first main surface. The intermediate stage has a push-up mechanism which applies, to the first main surface of the semiconductor die, a force for separating the semiconductor die therefrom in the normal direction of the die placing surface (in a Z-axis direction).

Abstract: An inspection apparatus is an inspection apparatus for inspecting a sample in which a plurality of light-emitting elements including a first light-emitting element and a second light-emitting element arranged around the first light-emitting element is formed, the inspection apparatus including an excitation light source that generates excitation light to irradiate the sample, a camera that images fluorescence from the sample, and a determining unit that calculates a relative luminance of fluorescence from the first light-emitting element based on the fluorescence from the first light-emitting element and fluorescence from the second light-emitting element imaged by the camera, and compares a calculated value based on an absolute luminance and the relative luminance of the fluorescence from the first light-emitting element with a predetermined threshold value, thereby determining a quality of the first light-emitting element.

Abstract: An inspection apparatus is an inspection apparatus includes an excitation light source that generates excitation light to irradiate the object, a dichroic mirror that separates fluorescence from the sample by transmitting or reflecting the fluorescence according to a wavelength, a camera that images fluorescence reflected by the dichroic mirror, a camera that images fluorescence transmitted through the dichroic mirror, and a control apparatus that derives color irregularity information of a light-emitting element based on a first fluorescence image acquired by the camera and a second fluorescence image acquired by the camera, and an edge shift width corresponding to a width of a wavelength band in which transmittance and reflectance change according to a change in wavelength in the dichroic mirror is wider than a full width at half maximum of a normal fluorescence spectrum of the light-emitting element.

Abstract: A bonding apparatus and method for correcting movement amount of bonding head are provided. The bonding apparatus performs: mark correction of imaging a reference mark using a position detection camera at every prescribed timing and correcting the amount of movement of a bonding head on the basis of the amount of positional deviation between the position of the imaged reference mark and a reference position of the position detection camera; and actual position correction of detecting the actual bonding position of a semiconductor element after bonding using the position detection camera at every timing when the cumulative value of the amounts of correction of the mark correction from the previous actual position correction exceeds a prescribed first threshold and correcting the amount of movement of the bonding head on the basis of the amount of positional deviation between the detected actual bonding position and a target bonding position.

Abstract: An inspection apparatus is an inspection apparatus for inspecting a sample on which a plurality of light-emitting elements is formed, and includes an excitation light source that generates excitation light to irradiate the sample, a camera that images fluorescence having a wavelength longer than a reference wavelength in fluorescence from the light-emitting elements, and a control apparatus that determines a quality of each of the light-emitting elements based on fluorescence imaged by the camera, in which the reference wavelength is a wavelength obtained by adding a full width at half maximum of a normal fluorescence spectrum of the light-emitting element to a peak wavelength of the normal fluorescence spectrum.

Abstract: Provided is a mounting device in which two or more semiconductor chips are laminated and mounted at a plurality of locations on a substrate, said mounting device including: a stage that supports the substrate; a bonding part that laminates and mounts the plurality of semiconductor chips on the substrate while heating the plurality of semiconductor chips and the substrate; and a heat insulating member that is interposed between the stage and the substrate, said heat insulating member including a first layer which is in contact with the substrate and to which heat is applied from the bonding part via the semiconductor chips and the substrate, and a second layer which is disposed closer to the stage side than the first layer, wherein the first layer has a larger heat resistance than the second layer.

Abstract: Provided is a cooling unit to be used in an inspection of a semiconductor device. The cooling unit includes a jacket for dissipating heat of the semiconductor device. The jacket is provided with a light passing portion for passing light from the semiconductor device. The jacket has a space defining surface that faces the semiconductor device and defines a space between the space defining surface and the semiconductor device in a state where the light passing portion faces the semiconductor device. The jacket is provided with a supply flow path through which a fluid to be supplied to the space flows.

Abstract: A concentration measurement method for measuring a concentration of impurities includes a step of irradiating a DUT 10 serving as a measurement target object with measurement light and stimulus light subjected to intensity modulation using a modulation signal including a default frequency, a step of outputting a detection signal by detecting an intensity of reflected light from the DUT 10 or transmitted light through the DUT 10, and a step of detecting a phase delay of the detection signal with respect to the modulation signal, obtaining a frequency at which the phase delay has a predetermined value, and estimating a concentration of impurities in the measurement target object on the basis of the frequency.

Abstract: The solid immersion lens unit includes: a solid immersion lens having a contact surface allowed to be in contact with an inspection object and a spherical surface allowed to be opposite to an objective lens; a holder holding the solid immersion lens; a magnet provided to the holder; and a spherical body rotatably held by a magnetic force of the magnet at a position opposite to the spherical surface. The holder swingably holds the solid immersion lens in a state where the spherical surface is in contact with the spherical body.

Abstract: An inspection system includes a light source, a mirror, Galvano mirrors, a casing that holds the mirror and the Galvano mirrors inside and includes an attachment portion for attaching an optical element, and a control unit that controls a deflection angle of the Galvano mirrors, wherein the control unit controls the deflection angle so that an optical path optically connected to a semiconductor device is switched between a first optical path passing through the Galvano mirrors and the mirror, and a second optical path passing through the Galvano mirrors and the attachment portion, and controls the deflection angle so that the deflection angle when switching to the first optical path has been performed and the deflection angle when switching to the second optical path has been performed do not overlap.

Abstract: A mounting device includes: an application part applying paste on a substrate to form an application body; a bonding part forming a mounted body by mounting a chip component on the substrate via the application body; a first imaging part imaging the application body after application processing and before mounting processing to acquire first image information; a second imaging part imaging the mounted body after the mounting processing to acquire second image information; and a control part controlling the application part, the bonding part, and the first and second imaging parts, and obtains a 3D application body shape (first shape) from the first image information as a first shape and calculates a 3D mounted body shape (second shape) from the second image information. The control part evaluates the application processing or the mounting processing based on the first and the second shapes.

Abstract: An inspection system includes a light source, a mirror, Galvano mirrors, a casing that holds the mirror and the Galvano mirrors inside and includes an attachment portion for attaching an optical element, and a control unit that controls a deflection angle of the Galvano mirrors, wherein the control unit controls the deflection angle so that an optical path optically connected to a semiconductor device is switched between a first optical path passing through the Galvano mirrors and the mirror, and a second optical path passing through the Galvano mirrors and the attachment portion, and controls the deflection angle so that the deflection angle when switching to the first optical path has been performed and the deflection angle when switching to the second optical path has been performed do not overlap.