Abstract: The actinic ray-sensitive or radiation-sensitive resin composition includes a crosslinking agent having a polarity converting group and an alkali-soluble resin, in which the polarity converting group is a group capable of decomposing by the action of an alkaline aqueous solution to generate a carboxylic acid or sulfonic acid on the side having a crosslinking group.

Abstract: A negative resist composition includes an onium salt compound (A) containing a nitrogen atom in its cation moiety, a compound (B) that is configured to produce an acid when exposed to actinic rays or radiation, and a compound (C) containing an acid-crosslinkable group.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes; a compound (A) which generates an acid by irradiation with actinic rays or radiation, wherein the acid is linked with a group represented by the following general formula (M) through covalent bonding. In the formula, Y1 and Y2 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, an aryl group, or an acyl group. Z represents a hydrogen atom or a substituent.

Abstract: Provided is an active light sensitive or radiation sensitive resin composition which contains a compound (A) represented by General Formula (I) or (II): in the formulae, each of Y1 and Y2 represents a monovalent organic group; each of M1+ and M2+ represents an organic onium ion; each of X1 and X2 represents a group that is represented by —S—, —NH—, or —NR1—; R1 represents a monovalent organic group; each of n1 and n2 represents an integer of 1 or more; and R1 and Y1 or Y2 may bond with each other to form a ring.

Abstract: Provide are a pattern forming method including a step (1) of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition including a resin having an acid-decomposable repeating unit capable of decomposing by the action of an acid to generate an acid having a pKa of 3.0 or less, a step (2) of exposing the film using actinic rays or radiation, and a step (3) of carrying out development using a developer including an organic solvent after the exposure to form a negative tone pattern; and a method for manufacturing an electronic device, including the pattern forming method.

Abstract: There are provided A pattern formation method, including: (1) forming a film using an active light-sensitive or radiation-sensitive resin composition; (2) exposing the film to active light or radiation; and (3) developing the exposed film using a developer including an organic solvent, wherein the active light-sensitive or radiation-sensitive resin composition contains a resin (A) having specific 3 repeating units.

Abstract: An actinic ray sensitive or radiation sensitive resin composition contains a polymer compound (A) having a phenolic hydroxyl group and satisfying the following (a) and (b), a compound (B) capable of generating an acid upon irradiation with actinic rays or radiation, and a crosslinking agent (C) for crosslinking the polymer compound (A) by the action of an acid and having a glass transition temperature (Tg) of 200° C. or higher: (a) the weight-average molecular weight is 3,000 or more and 6,500 or less, and (b) the glass transition temperature (Tg) is 140° C. or higher.

Abstract: A resin composition of the present invention includes a polymer compound (A) containing a repeating unit (Q) represented by the following general formula (1): wherein R1 represents a hydrogen atom, a methyl group, or a halogen atom; R2 and R3 represent a hydrogen atom, an alkyl group, or a cycloalkyl group; L represents a divalent linking group or a single bond; Y represents a substituent excluding a methylol group; Z represents a hydrogen atom or a substituent; m represents an integer of 0 to 4; n represents an integer of 1 to 5; and m+n is 5 or less.

Abstract: A pattern forming method includes forming a film using an actinic ray-sensitive or radiation-sensitive resin composition, exposing the film with active light or radiation, and developing the exposed film using a developer including an organic solvent, in which the actinic ray-sensitive or radiation-sensitive resin composition contains a compound having a partial structure represented by General Formula (I).

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition containing: a resin (A) containing a repeating unit represented by a specific formula (1), and an ionic compound (B) represented by a specific formula (2), a resist film formed by using the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method including: (a) a step of forming the resist film, (b) a step of exposing the film, and (c) a step of developing the exposed film using a developer to form a pattern.

Abstract: A chemical amplification resist composition contains: (A) a polymer compound having a structure where a hydrogen atom of a phenolic hydroxyl group is replaced by a group having a non-acid-decomposable polycyclic alicyclic hydrocarbon structure; and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation.

Abstract: A radiation-sensitive or actinic ray-sensitive resin composition contains a polymer compound (A) including a structural part (a) that is decomposed by irradiation with actinic rays or radiation to generate an acid anion on a side chain and a repeating unit (b) that is represented by the following Formula (I), in the formula, R3 represents a hydrogen atom, an organic group, or a halogen atom, A1 represents an aromatic ring group or an alicyclic group. R1 and R2 each independently represent an alkyl group, a cycloalkyl group, or an aryl group, at least two of A1, R1, or R2 may be bonded to each other to form a ring. B1 and L1 each independently represent a single bond or a divalent linking group, X represents a hydrogen atom or an organic group, n represents an integer of 1 or greater.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition contains a compound (P) that contains at least one phenolic hydroxyl group and at least one group in which a hydrogen atom of a phenolic hydroxyl group has been substituted with a group represented by the following General Formula (1) (in the formula, M11 represents a single bond or a divalent linking group; Q11 represents an alkyl group, a cycloalkyl group, or an aryl group).

Abstract: There is provided a pattern forming method comprising (1) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin containing an acid-decomposable repeating unit and being capable of decreasing the solubility for an organic solvent-containing developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a compound capable of decomposing by the action of an acid to generate an acid, and (D) a solvent; (2) a step of exposing the film by using an actinic ray or radiation, and (4) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern.

Abstract: Provided is a semiconductor element having a semiconductor layer and an insulating layer adjacent to the semiconductor layer, in which the insulating layer is formed of a crosslinked product of a polymer compound having a repeating unit (IA) represented by the following General Formula (IA) and a repeating unit (IB) represented by the following General Formula (IB). In General Formula (IA), R1a represents a hydrogen atom, a halogen atom, or an alkyl group. L1a and L2a each independently represent a single bond or a linking group. X represents a crosslinkable group. m2a represents an integer of 1 to 5, and in a case where m2a is 2 or more, m2a number of X's may be the same or different from each other, m1a represents an integer of 1 to 5, and in a case where m1a is 2 or more, m1a number of (-L2a-(X)m2a)'s may be the same or different from each other. In General Formula (IB), R1b represents a hydrogen atom, a halogen atom, or an alkyl group.

Abstract: A manufacturing method for an actinic ray-sensitive or radiation-sensitive resin composition that contains a resin, an acid generator, an organic acid, and a solvent, includes at least one of (i), (ii), or (iii) below, and a content ratio of the organic acid in the actinic ray-sensitive or radiation-sensitive resin composition is greater than 5% by mass based on a total solid content in the composition; (i) dissolving the organic acid in a solution that does not substantially contain the resin and the acid generator, (ii) dissolving the organic acid in a solution that contains the acid generator and does not substantially contain the resin, and (iii) dissolving the organic acid in a solution that contains the resin and does not substantially contain the acid generator, an actinic ray-sensitive or radiation-sensitive resin composition, an actinic ray-sensitive or radiation-sensitive film, a mask blank including the film, a forming method for a photo mask and a pattern, a manufacturing method for an electronic

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes (A) a polymer compound having a structure in which a hydrogen atom of a phenolic hydroxyl group is substituted by a group represented by specific General Formula (I), and (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation.

Abstract: An actinic ray sensitive or radiation sensitive resin composition contains a polymer compound (A) having a phenolic hydroxyl group and satisfying the following (a) and (b), a compound (B) capable of generating an acid upon irradiation with actinic rays or radiation, and a crosslinking agent (C) for crosslinking the polymer compound (A) by the action of an acid and having a glass transition temperature (Tg) of 200° C. or higher: (a) the weight-average molecular weight is 3,000 or more and 6,500 or less, and (b) the glass transition temperature (Tg) is 140° C. or higher.

Abstract: There is provided a photosensitive composition containing a compound represented by Formula (I), and the Formula (I) is defined as herein, and chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and a chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation.

Abstract: The actinic ray-sensitive or radiation-sensitive resin composition includes a crosslinking agent having a polarity converting group and an alkali-soluble resin, in which the polarity converting group is a group capable of decomposing by the action of an alkaline aqueous solution to generate a carboxylic acid or sulfonic acid on the side having a crosslinking group.