Abstract: A first circuit layer including a first semiconductor substrate with photoelectric conversion unit that photoelectrically converts incident light and generates charge, and a first wiring layer with wiring that reads out signal based upon charge generated by the photoelectric conversion unit; second circuit layer including a second wiring layer with wiring connected to the wiring of the first wiring layer, and a second semiconductor substrate with a through electrode connected to the wiring of the second wiring layer; third circuit layer including a third semiconductor substrate with a through electrode connected to the through electrode of the second circuit layer, and third wiring layer with wiring connected to the through electrode of the third semiconductor substrate; and a fourth circuit layer including a fourth wiring layer with wiring connected to the wiring of the third wiring layer, and fourth semiconductor substrate connected to the wiring of the fourth wiring layer.

Abstract: An abnormality determination device includes an input unit to which a device-condition signal output from an operating device is input, a first memory configured to store a determination algorithm for determining a predetermined abnormality of the operating device, an abnormality determination unit configured to determine the predetermined abnormality of the operating device in accordance with the device-condition signal and the determination algorithm, an output unit configured to output a determination result regarding the predetermined abnormality made by the abnormality determination unit to a user, an operation unit configured to receive an input of true-or-false information of whether the determination result is correct from the user, and an update unit configured to update the determination algorithm in accordance with the true-or-false information.

Abstract: A first circuit layer including a first semiconductor substrate with photoelectric conversion unit that photoelectrically converts incident light and generates charge, and a first wiring layer with wiring that reads out signal based upon charge generated by the photoelectric conversion unit; second circuit layer including a second wiring layer with wiring connected to the wiring of the first wiring layer, and a second semiconductor substrate with a through electrode connected to the wiring of the second wiring layer; third circuit layer including a third semiconductor substrate with a through electrode connected to the through electrode of the second circuit layer, and third wiring layer with wiring connected to the through electrode of the third semiconductor substrate; and a fourth circuit layer including a fourth wiring layer with wiring connected to the wiring of the third wiring layer, and fourth semiconductor substrate connected to the wiring of the fourth wiring layer.

Abstract: An image sensor includes: a first photoelectric conversion unit that photoelectrically converts light to generate an electric charge; a first output unit that outputs a first signal based on the electric charge generated by the first photoelectric conversion unit; a plurality of second photoelectric conversion units that photoelectrically convert light to generate electric charges; a plurality of second output units that output second signals based on the electric charges generated by the second photoelectric conversion units; an output line to which the first output unit and the plurality of second output units are connected, and from which at least one of the first signal and the second signals is output; a first control line for controlling the output of the first signal from the first output unit; and second control lines for controlling the outputs of the second signals from the plurality of second output units.

Abstract: An abnormality detection apparatus detects an abnormality of equipment according to sensor data that is related to a vibration of the equipment and is obtained while a brake device for braking a motion of a movable part of the equipment is in operation.

Abstract: An abnormality determination apparatus of the present invention acquires state data from work equipment provided with an attaching part to which a plural kinds of work parts are attached in a replaceable manner, identifies the kind of a work part attached to the attaching part, sets, corresponding to the identified kind of the work part, abnormality determination data for determining an abnormality of the work equipment, acquires, from among state data acquired from the work equipment, state data of a time when the identified kind of the work part was being attached, and compares the acquired state data with the set abnormality determination data to determine an abnormality of the work equipment.

Abstract: An image-capturing device allowing skew reduction, and an image-capturing system allowing skew reduction are provided. An image-capturing device is provided, including a plurality of photoelectric converting units; and a plurality of light-receiving units that are arranged corresponding to a plurality of blocks each constituted by one or more photoelectric converting units, and receive drive light instructing driving of the photoelectric converting units to output a drive signal to a corresponding photoelectric converting unit among the photoelectric converting units. In addition, an image-capturing system is provided, including the image-capturing device; and a light-emitting unit that is spaced apart from the plurality of light-receiving units, and emits the drive light to the plurality of light-receiving units.

Abstract: An abnormality detection device of detecting an abnormality of a robot which executes an operation such as welding on a target object, includes a control unit including a signal input unit to which a detection signal is input, the detection signal being obtained when a state of the robot is detected by a sensor, so that the control unit detects an abnormality of the robot in accordance with the detection signal. The control unit outputs a control signal to the robot so as to execute an integrated action in which a necessary action necessary for detecting an abnormality is added to a predetermined action in which the operation is not executed on the target object. The control unit detects the abnormality of the robot in accordance with the detection signal detected when the integrated action is executed.

Abstract: An image-capturing element manufacturing method includes: preparing a first substrate having a plurality of pixels that are two-dimensionally continuously arrayed; preparing a second substrate having a plurality of circuit blocks that respectively have connection terminals to a power supply and a reference potential and that are electrically independent from each other, each of the plurality of circuit blocks having at least some of circuits to read out signals from the plurality of pixels; laminating the first substrate and the second substrate to electrically couple the plurality of circuit blocks and the plurality of pixels overlapping therewith; and cutting circuit blocks around at least one of the plurality of circuit blocks and pixels overlapping therewith to form a laminate in which the plurality of pixels are laminated onto the at least one of the plurality of circuit blocks.

Abstract: An abnormality detecting device determines an abnormality in an apparatus by comparing data on vibration detected in the apparatus with a predetermined threshold. Moreover, the abnormality detecting device changes the threshold depending on a length of work time required for the apparatus to perform a certain work.

Abstract: A failure diagnosis device applicable to a mechanical device provided with motors independent of One another as sources to drive motion axes, respectively, and configured to acquire a moving position of each motion axis and a disturbance torque value applied to the motion axis every predetermined period, and to diagnose a failure of the mechanical device, includes a failure diagnosis unit configured to diagnose the motion axis as a failure when the disturbance torque value is larger than a predetermined failure determination threshold, and a re-determination unit configured to conduct re-determination of the failure on the motion axis, which is diagnosed as the failure by the failure diagnosis unit, based on a previous maintenance record and a previous inspection result.

Abstract: A malfunction detection device compares detected data on a condition at a predetermined part of an apparatus with a threshold so as to determine a malfunction of the apparatus. The malfunction detection device varies the threshold in accordance with a type of a lubricant used for movable parts of the apparatus.

Abstract: A driving force sensor detects a driving force in a rotating mechanism provided in an apparatus. A vibration sensor detects vibrations of the apparatus. A control unit determines a type of a malfunction of the apparatus in accordance with a combination of the detected driving force and the detected vibrations.

Abstract: A control unit causes a sensor to start sampling at a plurality of start timings different from each other. The control unit combines sampling signals obtained by the start of the sampling at the different start timings, and detects a malfunction of an apparatus in accordance with the combined sampling signal.

Abstract: An image sensor includes: a photoelectric conversion unit that photoelectrically converts incident light transmitted through a microlens to generate electric charge; an accumulation unit that accumulates the electric charge generated by the photoelectric conversion unit; and a transfer unit that transfers the electric charge generated by the photoelectric conversion unit to the accumulation unit, wherein: the photoelectric conversion unit, the transfer unit, and the accumulation unit are provided along a direction of an optical axis of the microlens.

Abstract: A malfunction determination method for a production machine including a motor as a driving source of a rotating mechanism acquires sensor data of a sensor for detecting a condition of the production machine, determines whether the production machine has an operation stop period during which the production machine has stopped its operation for a predetermined period of time or longer in accordance with an operation history of the production machine, sets a malfunction determination suspension period for suspending a malfunction determination of the production machine when determined to have the operation stop period, in accordance with a length of the operation stop period, and determines whether the production machine has a malfunction in a period other than the malfunction determination suspension period.

Abstract: An image sensor includes: a photoelectric conversion unit that photoelectrically converts incident light and generates electric charge; a reflecting portion that reflects a portion of light passing through the photoelectric conversion unit toward the photoelectric conversion unit; a first output unit that outputs electric charge generated due to photoelectric conversion by the photoelectric conversion unit of light reflected by the reflecting portion; and a second output unit that outputs electric charge generated due to photoelectric conversion by the photoelectric conversion unit of light other than the light reflected by the reflecting portion.

Abstract: A first circuit layer including a first semiconductor substrate with photoelectric conversion unit that photoelectrically converts incident light and generates charge, and a first wiring layer with wiring that reads out signal based upon charge generated by the photoelectric conversion unit; second circuit layer including a second wiring layer with wiring connected to the wiring of the first wiring layer, and a second semiconductor substrate with a through electrode connected to the wiring of the second wiring layer; third circuit layer including a third semiconductor substrate with a through electrode connected to the through electrode of the second circuit layer, and third wiring layer with wiring connected to the through electrode of the third semiconductor substrate; and a fourth circuit layer including a fourth wiring layer with wiring connected to the wiring of the third wiring layer, and fourth semiconductor substrate connected to the wiring of the fourth wiring layer.

Abstract: A first circuit layer including a first semiconductor substrate with photoelectric conversion unit that photoelectrically converts incident light and generates charge, and a first wiring layer with wiring that reads out signal based upon charge generated by the photoelectric conversion unit; second circuit layer including a second wiring layer with wiring connected to the wiring of the first wiring layer, and a second semiconductor substrate with a through electrode connected to the wiring of the second wiring layer; third circuit layer including a third semiconductor substrate with a through electrode connected to the through electrode of the second circuit layer, and third wiring layer with wiring connected to the through electrode of the third semiconductor substrate; and a fourth circuit layer including a fourth wiring layer with wiring connected to the wiring of the third wiring layer, and fourth semiconductor substrate connected to the wiring of the fourth wiring layer.

Abstract: An image-capturing element manufacturing method includes: preparing a first substrate having a plurality of pixels that are two-dimensionally continuously arrayed; preparing a second substrate having a plurality of circuit blocks that respectively have connection terminals to a power supply and a reference potential and that are electrically independent from each other, each of the plurality of circuit blocks having at least some of circuits to read out signals from the plurality of pixels; laminating the first substrate and the second substrate to electrically couple the plurality of circuit blocks and the plurality of pixels overlapping therewith; and cutting circuit blocks around at least one of the plurality of circuit blocks and pixels overlapping therewith to form a laminate in which the plurality of pixels are laminated onto the at least one of the plurality of circuit blocks.