Abstract: An image-capturing element manufacturing method includes: preparing a first substrate having a plurality of pixels that are two-dimensionally continuously arrayed; preparing a second substrate having a plurality of circuit blocks that respectively have connection terminals to a power supply and a reference potential and that are electrically independent from each other, each of the plurality of circuit blocks having at least some of circuits to read out signals from the plurality of pixels; laminating the first substrate and the second substrate to electrically couple the plurality of circuit blocks and the plurality of pixels overlapping therewith; and cutting circuit blocks around at least one of the plurality of circuit blocks and pixels overlapping therewith to form a laminate in which the plurality of pixels are laminated onto the at least one of the plurality of circuit blocks.

Abstract: An image sensor includes a first semiconductor layer provided with a pixel, including a photoelectric conversion unit that photoelectrically converts incident light to generate an electric charge, an accumulation unit that accumulates the electric charge generated by the photoelectric conversion unit, and a transfer unit that transfers the electric charge generated by the photoelectric conversion unit to the accumulation unit, a second semiconductor layer provided with a supply unit that supplies the transfer unit with a transfer signal for transferring the electric charge from the photoelectric conversion unit to the accumulation unit, and a third semiconductor layer into which a signal is inputted, the signal being based on the electric charge that has been transferred to the accumulation unit.

Abstract: An image sensor includes: a photoelectric conversion unit that photoelectrically converts incident light transmitted through a microlens to generate electric charge; an accumulation unit that accumulates the electric charge generated by the photoelectric conversion unit; and a transfer unit that transfers the electric charge generated by the photoelectric conversion unit to the accumulation unit, wherein: the photoelectric conversion unit, the transfer unit, and the accumulation unit are provided along a direction of an optical axis of the microlens.

Abstract: A polarization property image measurement device includes: a first radiation unit that radiates light beams in different polarization conditions onto a target object after subjecting the light beams to intensity modulation at frequencies different from one another; a light receiving unit including first photoelectric conversion units that photoelectrically convert the light beams having been radiated from the first radiation unit and scattered at the target object in correspondence to each of the different polarization conditions, and second photoelectric conversion units that photoelectrically convert visible light from the target object; and a processor that detects signals individually output from the first photoelectric conversion units at the different frequencies and differentiates each signal from other signals so as to determine an origin of the signal as one of the light beams; and creates an image of the target object based upon signals individually output from the second photoelectric conversion un

Abstract: A failure diagnostic device for performing a failure diagnosis on a multi-axis robot includes a position detector that detects a movement position of each of joint shafts included in the multi-axis robot, a torque detector that detects a disturbance torque applied to the joint shaft, a routine-operation determination circuit that determines whether or not the multi-axis robot is executing a predefined routine operation, from the movement position detected by the position detector, a reference-value calculation circuit that calculates a disturbance-torque reference value from the disturbance torque detected during execution of the routine operation, a torque correction circuit that corrects the disturbance torque detected while the multi-axis robot executes an operation different from the routine operation by using the disturbance-torque reference value, calculated by the reference-value calculation circuit, to thereby acquire a corrected disturbance torque, and a failure diagnostic circuit that performs a fai

Abstract: A failure diagnosis device applicable to a mechanical device provided with. motors independent of One another as sources to drive motion axes, respectively, and configured to acquire a moving position of each motion axis and a disturbance torque value applied to the motion axis every predetermined period, and to diagnose a failure of the mechanical device, includes a failure diagnosis unit configured to diagnose the motion axis as a failure when the disturbance torque value is larger than a predetermined failure determination threshold, and a re-determination unit configured to conduct re-determination of the failure on the motion axis, which is diagnosed as the failure by the failure diagnosis unit, based on a previous maintenance record and a previous inspection result.

Abstract: Provided is an image processing apparatus including as image acquiring section that acquires a plurality of images obtained by imaging, at different times, a subject irradiated with lights intensity-modulated with a plurality of modulation frequencies or modulation frequency bands; and a demodulating section that demodulates pixel values of the plurality of images with a plurality of demodulation frequencies or demodulation frequency bands based on the plurality of modulation frequencies or modulation frequency bands, for each pixel, thereby generating a plurality of pieces of pixel information indicating subject light amounts from the subject caused by each of the lights intensity-modulated with the plurality of modulation frequencies or modulation frequency bands, for each pixel.

Abstract: A controller includes a control computation unit, a control computation output correction unit, and a final-control-element output upper-lower limit processing unit. The control computation unit calculates, for each control cycle, a control computation output value by performing a control computation using a controlled variable and a set point as input values. The control computation output correction unit corrects the control computation output value to a predetermined final-control-element output upper limit in a case where the control computation output value is equal to or larger than a predetermined threshold A. The final-control-element output upper-lower limit processing unit outputs to a control target a value obtained by limiting the corrected control computation output value to a value that is equal to or larger than a predetermined final-control-element output lower limit and that is equal to or smaller than the final-control-element output upper limit, as a final-control-element output value.

Abstract: Solid-state image sensors are disclosed that include one or more pixels formed on a semiconductor substrate. Each pixel includes a photoelectric converter to convert light to an electric signal, and a microlens above the photoelectric converter. The microlens has a plan profile in which the direct distance from a center to a lens edge is variable. The microlens has first base regions and second base regions not including the first base regions. The first base regions are provided near n positions (n being a natural number) of the lens edge from which the direct distance is relatively long. The vertical height of the first base regions from an upper surface of the photoelectric converter is less than the vertical height of the second base regions from the upper surface of the photoelectric converter.

Abstract: The present invention provides an electron beam apparatus for evaluating a sample surface, which has a primary electro-optical system for irradiating a sample with a primary electron beam, a detecting system, and a secondary electro-optical system for directing secondary electron beams emitted from the sample surface by the irradiation of the primary electron beam to the detecting system.

Abstract: A guide system terminal device is provided to facilitate group operation vehicles. The guide system terminal device has a transceiver that receives the traveling environment information from another vehicle, such as for the turn signal, vehicle speed, running position, a road change judgment module that judges course changes by the other vehicle based on the traveling environment information of the other vehicle, and a user interface that outputs the judgment result obtained by road change judgment module. For example, the road change judgment module judges a left/right turn to have occurred when the blinker information acquired by turn signal sensor lasts longer than a prescribed time, and when the maximum value of the change in vehicle speed exceeds a prescribed level.

Abstract: A vehicle information processing system 100 conducts wireless communications between a preceding vehicle 200 and a succeeding vehicle 201, and exhibits information on a winker operation of the preceding vehicle 200 to a driver of the succeeding vehicle 201, and includes vehicle-mounted apparatuses 1 in the preceding and succeeding vehicles, of which one 1 in the preceding vehicle 200 wirelessly transmits information on a winker operation of the preceding vehicle, and the other 1 in the succeed vehicle 201 receives the wirelessly transmitted information on the winker state, and exhibits same to a driver of the succeeding vehicle 201, while the apparatus 1 in the succeeding vehicle 201 estimates a relationship between the preceding vehicle 200 and the succeeding vehicle 201, judges whether an exhibition liming of the information on the winker state is to be hastened or delayed based on an estimation result, and exhibits the information on the winker state at the judged timing.

Abstract: An inspection apparatus and a semiconductor device manufacturing method using the same. The inspection apparatus is used for defect inspection, line width measurement, surface potential measurement or the like of a sample such as a wafer. In the inspection apparatus, a plurality of charged particles is delivered from a primary optical system to the sample, and secondary charged particles emitted from the sample are separated from the primary optical system and introduced through a secondary optical system to a detector. Irradiation of the charged particles is conducted while moving the sample. Irradiation spots of the charged particles are arranged by N rows along a moving direction of the sample and by M columns along a direction perpendicular thereto. Every row of the irradiation spots of the charged particles is shifted successively by a predetermined amount in a direction perpendicular to the moving direction of the sample.

Abstract: Solid-state image sensors are disclosed that include one or more pixels formed on a semiconductor substrate. Each pixel includes a photoelectric converter to convert light to an electric signal, and a microlens above the photoelectric converter. The microlens has a plan profile in which the direct distance from a center to a lens edge is variable. The microlens has first base regions and second base regions not including the first base regions. The first base regions are provided near n positions (n being a natural number) of the lens edge from which the direct distance is relatively long. The vertical height of the first base regions from an upper surface of the photoelectric converter is less than the vertical height of the second base regions from the upper surface of the photoelectric converter.

Abstract: The present invention provides an electron beam apparatus for evaluating a sample surface, which has a primary electro-optical system for irradiating a sample with a primary electron beam, a detecting system, and a secondary electro-optical system for directing secondary electron beams emitted from the sample surface by the irradiation of the primary electron beam to the detecting system.

Abstract: An on-vehicle communication apparatus provided with: endpoint radio communication devices each provided for each one or more on-vehicle units; gateway radio communication devices which are respectively arranged in function networks provided with the above-mentioned one or more on-vehicle units, and performs radio communications with the endpoint radio communication devices that are included in the function network; and power sources each provided for any one of the above-mentioned one or more on-vehicle units and the above-mentioned one or more function networks.