Abstract: A non-contact type liquid level sensor according to the invention has an electromagnetic shield plate mounted on a housing for blocking effects from an external magnetic field onto a magnetoelectric converting element.

Abstract: A memory which stores an output value indicating a liquid level is provided in a Hall-effect IC, and an uppermost position and a lowermost position of a float, which are set in advance, are written to the memory as an uppermost liquid level and a lowermost liquid level using a reference position writing jig.

Abstract: A non-contact type sensor that measures a liquid level in a non-contact fashion and outputs a measured value as a digital pulse is provided. Then, a sensor-output converting circuit is caused to input the digital pulse, which is output from the non-contact type sensor, into an existing central processing unit as an analogue voltage that corresponds to a duty factor of the digital pulse.

Abstract: The base polymer of a resist material contains a polymer compound including a first unit represented by a general formula of the following Chemical Formula 4 and a second unit represented by a general formula of the following Chemical Formula 5: wherein R1, R2 and R3 are the same or different and are a hydrogen atom, a fluorine atom, or a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20; R4 is a straight-chain alkylene group or a branched or cyclic alkylene group with a carbon number not less than 0 and not more than 20; R5 and R6 are the same or different and are a hydrogen atom, a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20, or a protecting group released by an acid; R7 is a methylene group, an oxygen atom, a sulfur atom or -SO2-; R8, R9, R10 and R11 are the same or different and are a hydrogen atom, a

Abstract: The base polymer of a resist material contains a polymer compound including a first unit represented by a general formula of the following Chemical Formula 5 and a second unit represented by a general formula of the following Chemical Formula 6: wherein R1, R2, R3, R7, R8 and R9 are the same or different and are a hydrogen atom, a fluorine atom, or a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20; R4 is a straight-chain alkylene group or a branched or cyclic alkylene group with a carbon number not less than 0 and not more than 20; R5, R6 and R11 are the same or different and are a hydrogen atom, a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20, or a protecting group released by an acid; R12 is a fluorine atom, or a straight-chain fluoridated alkyl group or a branched or cyclic fluoridated alkyl group with

Abstract: A base polymer of a resist material includes a unit represented by a general formula of the following Chemical Formula 3: wherein R1, R2 and R3 are the same or different and are a hydrogen atom, a fluorine atom, a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20; R4 is a straight-chain alkylene group or a branched or cyclic alkylene group with a carbon number not less than 0 and not more than 20; and R5 and R6 are the same or different and are a hydrogen atom, a straight-chain alkyl group, a branched or cyclic alkyl group, a fluoridated alkyl group with a carbon number not less than 1 and not more than 20, or a protecting group released by an acid.

Abstract: A liquid level sensor includes a housing, a rotary shaft which is rotatably provided in the housing, a magnet which is fixed to the rotary shaft, and rotating together with the rotary shaft, a pair of stators which are disposed so as to face an outer peripheral surface of the magnet, and an electronic circuit which includes at least a set of terminals and a magnetoelectric transducing element for detecting a change of magnetic flux in the stators caused by rotation of the magnet and for outputting an electric signal. The magnetoelectric transducing element and the stators are electrically connected and fixed to the set of terminals so that a terminal assembly is formed. The housing is formed by insert molding the terminal assembly with resin so that the terminal assembly is embedded in the housing.

Abstract: A non-contact type liquid level sensor includes a sensor housing; a rotary shaft, rotatably mounted on the sensor housing; a float, vertically movable with a change of a liquid level; a float arm, having a first end mounted on the float, and a second end coupled to the rotary shaft such that the rotary shaft is rotated with a vertical movement of the float; an annular magnet, coupled to the rotary shaft, and rotating together with the rotary shaft; a pair of arcuate stators, disposed in the sensor housing so as to confront an outer peripheral surface of the magnet; and a magnetoelectric transducing element, disposed between the first ends of the stators, for detecting a change of a magnetic flux density in the stators, which is caused by a turn of the magnet, and for converting the detected change of the magnetic flux density into an electrical signal. Second ends of the stators are spaced from each other to form a gap having an opening angle within a range from 50° to 200°.

Abstract: A process for manufacturing resin-molded semiconductor devices which are sealed in an epoxy resin is carried out without employing a metal mold. In the process, an epoxy resin is deposited on a sub-assembly consisting of a semiconductor pellet brazed to axial leads while turning the sub-assembly with the axial leads as a center so that the epoxy resin is applied to a predetermined shape; then the epoxy resin is heated at an elevated temperature while turning the sub-assembly so that surface portions of the epoxy resin are hardened and the epoxy resin is further heated at an elevated temperature without turning the sub-assembly so that the epoxy resin is completely hardened.