Abstract: A method to solve the problem of a technique generally used to detect a defect of a semiconductor by calculating the differential image based on pattern matching, which requires that a reference image must be picked up to pick up an image of the inspection position in an area with the semiconductor pattern having no periodicity, resulting in a low throughput. The image of the inspection position is divided into local areas, each local area is matched with the local area of the image already stored and the difference between the local areas thus matched is determined to extract a defect area.

Abstract: An image picked up by a detection system capable of actualizing a three-dimensional inclination is usually poor in the signal-to-noise ratio, and it is difficult to stably detect minute defects. Images that actualize a three-dimensional inclination are picked up from opposed directions. The images are subject to subtraction and addition. The images improved in signal-to-noise ratio as compared with original images are calculated. The images calculated and improved in signal-to-noise ratio respectively of a defect portion and a reference portion are compared with each other. Regions differing in comparison results are detected as defects. As a result, minute defects can be inspected stably.

Abstract: A defect judgement processing method and apparatus which can optimize image processing and defect judgement parameters for a detection image cut out by each inspection window to avoid erroneous judgement and defect missing and to realize reliable defect judgement.

Abstract: A solder testing apparatus comprising image processing means for performing image processing on an image of an appearance of a soldered portion to identify shape characterizing amounts for the soldered portion; and defect determining means for performing good/bad determination on the soldered portion from data derived by the image processing means and data from test parameter storing means for storing shape characterizing amounts at design time, wherein tested-object standard shape estimating means is included for extracting shape characterizing amounts of a non-defective soldered portion by statistically processing shape characterizing amounts for soldered portions identified by the image processing means, and defect determining parameters stored in the test parameter storing means are updated based on standard shape values from the tested-object standard shape estimating means, so that a highly reliable test is realized by setting defect determining parameters based on actual shapes and dimensions of leads