Patents by Inventor Toshiki Ogawara

Toshiki Ogawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060254750
    Abstract: The present provides a heat-emitting element cooling apparatus which has a higher heat-emitting efficiency than that of conventional heat-emitting element cooling apparatus. A heat-emitting element cooling apparatus 1 includes a heat sink 7 and a fan unit 5. The heat sink 7 has a base 33 onto which a heat-emitting element is to be mounted, radiation fins of a first type 35, and radiation fins of a second type 37. The radiation fins 35 extend from an upper surface 33A in an upward direction. The radiation fins 37 extend from either of two side surfaces 33B and 33C in either of rightward and leftward directions. The radiation fins 35 and 37 continuously extend in forward and rearward directions respectively.
    Type: Application
    Filed: May 12, 2006
    Publication date: November 16, 2006
    Applicant: Sanyo Denki Co., Ltd.
    Inventors: Masashi Miyazawa, Tomoaki Ikeda, Toshiki Ogawara
  • Publication number: 20050253467
    Abstract: There is provided a fan unit in which when the fan unit is conveyed, existence of a plurality of lead wires will not become an obstacle to the conveyance. Four lead wire engaging sections 27, 29, 31, and 33 are provided along the contour of an outer wall section 25 of a fan casing 15 as the fan casing 15 is viewed from a predetermined position in a forward direction. Then, the lead wire engaging sections 27, 29, 31 and 33 are configured to engage a part of lead wires 24 so as to prevent the lead wires 24 from coming out of the fan casing 15 one or more during the conveyance.
    Type: Application
    Filed: May 12, 2005
    Publication date: November 17, 2005
    Applicant: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Haruhisa Maruyama
  • Patent number: 6927979
    Abstract: A heat-emitting element cooling apparatus that can improve a cooling effect on a heat-emitting element without increasing its size is provided. A heat sink is so constructed that all or part of radiation fins are located outside the contour of a base as seen from a side on which an axial flow fan unit is mounted. Then, the axial flow fan unit is so constructed as to discharge air along the portions of the radiation fin located outside the contour of the base.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: August 9, 2005
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Haruhisa Maruyama, Masayuki Iijima
  • Publication number: 20050168946
    Abstract: A heat-emitting element cooling apparatus that can improve a cooling effect on a heat-emitting element without increasing its size is provided. A heat sink is so constructed that all or part of radiation fins are located outside the contour of a base as seen from a side on which an axial flow fan unit is mounted. Then, the axial flow fan unit is so constructed as to discharge air along the portions of the radiation fin located outside the contour of the base.
    Type: Application
    Filed: April 1, 2005
    Publication date: August 4, 2005
    Applicant: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Haruhisa Maruyama, Masayuki Iijima
  • Publication number: 20040261976
    Abstract: An axial-flow fan unit that produces less noise is provided. Blades 19 are exposed from a venturi 29. The shape of each of the blades 19 is so defined that a space formed between at least an inner surface 28a of each of web leg sections 28A to 28C and an edge 19a of each of the blades 19 located in the radially outward direction of the blades 19 expands toward the ends of the web leg sections 28A to 28C (or web bodies 30A to 30C). With this arrangement, noise produced when the blades 19 rotate along the web leg sections 28A to 28C is reduced.
    Type: Application
    Filed: June 29, 2004
    Publication date: December 30, 2004
    Applicant: Sanyo Denki Co., Ltd
    Inventors: Michinori Watanabe, Toshiki Ogawara, Haruhisa Maruyama
  • Publication number: 20040050536
    Abstract: A heat-emitting element cooling apparatus that can improve a cooling effect on a heat-emitting element without increasing its size is provided. A heat sink is so constructed that all or part of radiation fins are located outside the contour of a base as seen from a side on which an axial flow fan unit is mounted. Then, the axial flow fan unit is so constructed as to discharge air along the portions of the radiation fin located outside the contour of the base.
    Type: Application
    Filed: January 10, 2003
    Publication date: March 18, 2004
    Inventors: Michinori Watanabe, Toshiki Ogawara, Haruhisa Maruyama, Masayuki Iijima
  • Patent number: 6621699
    Abstract: An electronic component cooling apparatus is provided that can prevent a reduction in a heat dissipation effect on an electronic component with a pushing force toward a heat sink thereof being applied to the opposite wall of a casing thereof. Pushing force transferring sections 37 for transferring a pushing force from mounting tools 35 to a heat sink 3 through contact with leading ends of radiation fins 11 are integrally formed on a pair of wall sections 25a of a casing 21. The pushing force transfer sections 37 have a shape that can distribute the pushing force and transfer distributed force to the heat sink 3 so as to prevent a force applied to an electronic component MPU by the pushing force from being locally and extremely increased.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: September 16, 2003
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Haruhisa Maruyama
  • Publication number: 20030002257
    Abstract: An electronic component cooling apparatus is provided that can prevent a reduction in a heat dissipation effect on an electronic component with a pushing force toward a heat sink thereof being applied to the opposite wall of a casing thereof. Pushing force transferring sections 37 for transferring a pushing force from mounting tools 35 to a heat sink 3 through contact with leading ends of radiation fins 11 are integrally formed on a pair of wall sections 25a of a casing 21. The pushing force transfer sections 37 have a shape that can distribute the pushing force and transfer distributed force to the heat sink 3 so as to prevent a force applied to an electronic component MPU by the pushing force from being locally and extremely increased.
    Type: Application
    Filed: June 28, 2002
    Publication date: January 2, 2003
    Applicant: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Haruhisa Maruyama
  • Patent number: 6437471
    Abstract: Vibration applied to a rotary shaft in an axial direction is suppressed when the rotary shaft is supported by a single hearing. A width dimension in a direction parallel with an axial direction of rotor-side magnetic poles of a permanent magnet unit is set to be larger than a width dimension in the direction parallel with the axial direction of stator-side magnetic poles. The rotor-side magnetic poles are fixed to a peripheral wall portion of a cup member such that the rotor-side magnetic poles completely face the stator-side magnetic poles and project toward a front side further than an end face of the stator-side magnetic poles on a motor support side. By using thrust formed of magnetic attracting force generated by decentering a magnetic center of the rotor-side magnetic poles and a magnetic center of the stator-side magnetic poles, the vibration of the rotary shaft in the axial direction is suppressed.
    Type: Grant
    Filed: May 15, 2000
    Date of Patent: August 20, 2002
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Toshiki Ogawara, Tomoaki Ikeda
  • Patent number: 6419007
    Abstract: A heat sink-equipped cooling apparatus capable of exhibiting increased cooling performance and durability and being reduced in dimensions in a radial direction thereof. A heat sink includes a radiation fin unit including a plurality of radiation fins arranged so as to surround a virtual central line while keeping a center thereof aligned with the central line. A cooling fan includes an impeller including a plurality of blades and rotated through a motor. The cooling fan is mounted on the heat sink in such a manner that the impeller is positioned above the radiation fin unit of the heat sink. The radiation fins each are inclined with respect to a virtual vertical plane so as to form a predetermined inclination angle &thgr; therebetween. The inner edges of the radiation fins are connected in a manner to be heat-transferable or in a manner that a thermally conductive passage is formed between the inner edges.
    Type: Grant
    Filed: May 24, 2001
    Date of Patent: July 16, 2002
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Toshiki Ogawara, Haruhisa Maruyama, Michinori Watanabe, Noriyasu Sasa
  • Patent number: 6411510
    Abstract: A heat sink-equipped cooling apparatus capable of exhibiting increased cooling performance and durability and being reduced in dimensions in a radial direction thereof. A heat sink includes a radiation fin unit including a plurality of radiation fins arranged so as to surround a virtual central line while keeping a center thereof aligned with the central line. A cooling fan includes an impeller including a plurality of blades and rotated through a motor. The cooling fan is mounted on the heat sink in such a manner that the impeller is positioned above the radiation fin unit of the heat sink. The radiation fins each are inclined with respect to a virtual vertical plane so as to form a predetermined inclination angle &thgr; therebetween.
    Type: Grant
    Filed: February 7, 2001
    Date of Patent: June 25, 2002
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Noriyasu Sasa, Toshiki Ogawara, Michinori Watanabe, Haruhisa Maruyama
  • Patent number: 6405436
    Abstract: A heat sink preform having a base 2, a fan case engagement portion 3 and a radiating fin formation portion is integrally formed by extrusion molding. A plurality of radiating fins 5 having a tong ratio which is defined as a ration of the height of the radiating fins with respect to the interval dimension between neighboring radiating fins of more than or equal to 10 is formed by subjecting the radiating fin formation portion to cutting work. In this way, a cooling fan attached type heat sink with a plurality of radiating fins having a shape that is difficult to be formed or cannot be formed or having a large tong ratio can be produced with low costs and with relative ease.
    Type: Grant
    Filed: August 29, 2000
    Date of Patent: June 18, 2002
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Toshiki Ogawara, Yuichi Kodaira, Haruhisa Maruyama
  • Patent number: 6353274
    Abstract: The present invention provides a mounting structure of a rotary shaft of rotary electric machinery in which it is possible to cope with vibration of the rotary shaft in an axial direction with a low parts count. A fitting groove into which a portion of a rear side stopper is fitted is formed at a rear end portion of the rotary shaft. A rear side stopper has three projecting chips fitted into the fitting groove and three leaf spring chips in contact with an inner ring of a rolling bearing forming a bearing structure. The rear side stopper has a structure in which the rear side stopper generates spring force for restoring an original shape thereof when the rear side stopper is compressed in an axial direction of the rotary shaft. The rear side stopper is disposed in a compressed state between a wall face surrounding the fitting groove and the inner ring of the rolling bearing.
    Type: Grant
    Filed: May 23, 2000
    Date of Patent: March 5, 2002
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Toshiki Ogawara, Toshio Shinohara, Michihiro Suzuki
  • Patent number: 6311767
    Abstract: A computer fan assembly is described which may be constructed so as to be suitable for use in enclosures for notebook computers or laptops. A heat pipe may be secured to a housing of the computer fan assembly. The heat pipe may be located in a position so that heat is transferred away from the heat pipe by air passing through the housing. Heat may, for example, be conducted from the heat pipe and then convected by means of fins to the air passing through the housing.
    Type: Grant
    Filed: May 26, 1999
    Date of Patent: November 6, 2001
    Assignee: Intel Corporation
    Inventors: Shuji Inoue, Toshiki Ogawara, Michinori Watanabe
  • Publication number: 20010014011
    Abstract: A heat sink-equipped cooling apparatus capable of exhibiting increased cooling performance and durability and being reduced in dimensions in a radial direction thereof. A heat sink includes a radiation fin unit including a plurality of radiation fins arranged so as to surround a virtual central line while keeping a center thereof aligned with the central line. A cooling fan includes an impeller including a plurality of blades and rotated through a motor. The cooling fan is mounted on the heat sink in such a manner that the impeller is positioned above the radiation fin unit of the heat sink. The radiation fins each are inclined with respect to a virtual vertical plane so as to form a predetermined inclination angle &thgr; therebetween.
    Type: Application
    Filed: February 7, 2001
    Publication date: August 16, 2001
    Inventors: Noriyasu Sasa, Toshiki Ogawara, Michinori Watanabe, Haruhisa Maruyama
  • Patent number: D501450
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: February 1, 2005
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Masayuki Iijima, Haruhisa Maruyama
  • Patent number: D509483
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: September 13, 2005
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Masayuki Iijima, Haruhisa Maruyama
  • Patent number: D511326
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: November 8, 2005
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Masayuki Iijima, Haruhisa Maruyama
  • Patent number: D516526
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: March 7, 2006
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Masayuki Iijima, Haruhisa Maruyama
  • Patent number: D529450
    Type: Grant
    Filed: November 8, 2005
    Date of Patent: October 3, 2006
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Masashi Miyazawa, Tomoaki Ikeda, Toshiki Ogawara