Patents by Inventor Toshio Shiobara

Toshio Shiobara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition for sealing optical device and cured product thereof
    Publication number: 20060270786
    Abstract: A resin composition for sealing an optical device is provided. The composition includes (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 3×103, having an average composition formula: R1a(OX)bSiO(4-a-b)/2 wherein, R1 represents an alkyl, alkenyl or aryl group of 1 to 8 carbon atoms, X represents a hydrogen atom, or an alkyl, alkenyl, alkoxyalkyl or acyl group of 1 to 8 carbon atoms, a is a number within a range from 1.05 to 1.5, b is a number that satisfies 0<b<2, and 1.05<a+b<2, (ii) a condensation catalyst, and (iii) inorganic fine particles. The composition is excellent in light extraction efficiency from semiconductor light emitting elements, and useful for sealing LED and like.
    Type: Application
    Filed: May 26, 2006
    Publication date: November 30, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hisashi Shimizu, Tsutomu Kashiwagi, Toshio Shiobara
  • Lens-forming silicone resin composition and silicone lens
    Publication number: 20060264583
    Abstract: Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO-, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.
    Type: Application
    Filed: May 22, 2006
    Publication date: November 23, 2006
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu Kashiwagi, Toshio Shiobara, Katsuyuki Imazawa
  • Lens-forming silicone resin composition and silicone lens
    Publication number: 20060264567
    Abstract: Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a platinum group metal base catalyst, and (D) a mold release agent cure into colorless, transparent, heat resistant parts which can be smoothly released from the mold and used as lenses in LED devices.
    Type: Application
    Filed: May 22, 2006
    Publication date: November 23, 2006
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Toshio Shiobara, Tsutomu Kashiwagi, Katsuyuki Imazawa
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
    Publication number: 20060241215
    Abstract: An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a rare earth oxide or hydrotalcite compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
    Type: Application
    Filed: April 24, 2006
    Publication date: October 26, 2006
    Inventors: Shoichi Osada, Yasuo Kimura, Eiichi Asano, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
    Publication number: 20060241250
    Abstract: An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a phosphazene compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
    Type: Application
    Filed: April 24, 2006
    Publication date: October 26, 2006
    Inventors: Shoichi Osada, Yasuo Kimura, Eiichi Asano, Toshio Shiobara
  • Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
    Patent number: 7122587
    Abstract: A flame retardant epoxy resin composition for semiconductor encapsulation includes as essential components, (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a phosphazene compound of the average compositional formula (1) having a melting point of 110–130° C., wherein a, b and n are numbers satisfying 0<a?0.05n, 1.90n?b<2n, 2a+b=2n, and 3?n?6, the composition being substantially free of bromides and antimony compounds.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: October 17, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tarou Shimoda, Shoichi Osada, Hiroyuki Takenaka, Shingo Ando, Kazutoshi Tomiyoshi, Toshio Shiobara
  • Curable resin composition for sealing LED element
    Publication number: 20060229408
    Abstract: A curable resin composition for sealing an LED element is provided. The composition includes (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, (ii) a condensation catalyst, (iii) a solvent, and (iv) a finely powdered inorganic filler. It is suited to formation of a coating film or the like with excellent heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and is ideal for applications such as the sealing of LED elements.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 12, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hisashi Shimizu, Tsutomu Kashiwagi, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
    Publication number: 20060216519
    Abstract: An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and (C) an inorganic filler, the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
    Type: Application
    Filed: March 23, 2006
    Publication date: September 28, 2006
    Inventors: Yasuo Kimura, Eiichi Asano, Toshio Shiobara, Takayuki Aoki
  • Liquid epoxy resin composition and semiconductor device
    Publication number: 20060204762
    Abstract: A liquid epoxy resin composition comprising a liquid epoxy resin, a curing agent, and an inorganic filler is useful for semiconductor encapsulation when the curing agent contains 5-100% by weight of a specific aromatic amine compound of at least 99% pure, the epoxy resin and the curing agent are present in a molar ratio from 0.7 to 0.9, and the composition has a toughness K1c of at least 3.5. The composition is adherent to the surface of silicon chips, does not deteriorate under hot humid conditions, and is fully resistant to thermal shocks.
    Type: Application
    Filed: May 8, 2006
    Publication date: September 14, 2006
    Inventors: Kazuaki Sumita, Shingo Ando, Toshio Shiobara
  • Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device
    Publication number: 20060199923
    Abstract: A primer composition comprising an alkoxysilyl-containing polyamide-imide resin, an epoxy resin, a curing promoter, and an organic solvent forms a cured coating having heat resistance and water resistance through brief low-temperature heating and helps bonding of epoxy resin molding compound to semiconductor members.
    Type: Application
    Filed: February 22, 2006
    Publication date: September 7, 2006
    Inventors: Hideki Akiba, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
    Patent number: 7095125
    Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: August 22, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara
  • Liquid epoxy resin composition and semiconductor device
    Patent number: 7094844
    Abstract: A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is useful for semiconductor encapsulation. The composition is adherent to the surface of silicon chips, does not deteriorate under hot humid conditions, and is fully resistant to thermal shocks.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: August 22, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki Sumita, Shingo Ando, Toshio Shiobara
  • Liquid epoxy resin composition and semiconductor device
    Patent number: 7067930
    Abstract: A liquid epoxy resin composition is provided comprising (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) acrylic submicron particles of core-shell structure formed of polymers or copolymers comprising an alkyl acrylate and/or alkyl methacrylate as a monomeric component, the core having a Tg of up to ?10° C., the shell having a Tg of 80-150° C. The composition is adherent to surfaces of silicon chips, especially polyimide resins and nitride film and useful as sealant for flip chip type semiconductor devices.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: June 27, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki Sumita, Toshio Shiobara
  • Heat resistant resin composition and adhesive film
    Patent number: 7060786
    Abstract: A resin composition comprising the associated product of a polyimide resin having phenolic hydroxyl groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin having at least two glycidyl groups, and an epoxy resin-curing agent has a high bond strength, a low modulus of elasticity and heat resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: June 13, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Nobuhiro Ichiroku, Toshio Shiobara
  • Method for sealing semiconductor component
    Patent number: 7056772
    Abstract: In connection with a semiconductor component having a circuit region and electrodes formed on a substrate surface, the circuit region is sealed by (1) applying a resist material onto the substrate surface to form a resist layer, (2) selectively exposing the resist layer to radiation and developing the resist with a liquid developer for thereby removing only the portion of the resist layer which overlies the circuit region, (3) applying a resin sealant onto the circuit region and curing the resin sealant into a cured resin layer that covers the circuit region, and (4) removing the residual resist layer using a solvent.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: June 6, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toshio Shiobara, Tsutomu Kashiwagi
  • Optical waveguide, forming material and making method
    Patent number: 7031591
    Abstract: An optical waveguide-forming material is comprised of a photocurable organopolysiloxane composition comprising an alkali-soluble organopolysiloxane and a photoacid generator, wherein the organopolysiloxane is obtained by (co)hydrolytic condensation of a triorganoxysilane having hydrolyzable epoxide and has an average molecular weight of 500–50,000 as determined by GPC using polystyrene standards. The optical waveguide-forming material, when subjected to pattern formation by photolithography, can be resolved with an alkaline aqueous solution, has a high sensitivity and resolution, and offers a cured film having improved light transmittance, heat resistance and humidity resistance.
    Type: Grant
    Filed: July 17, 2003
    Date of Patent: April 18, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kinya Kodama, Tsutomu Kashiwagi, Toshio Shiobara
  • Conductive resin composition
    Patent number: 7026382
    Abstract: A conductive resin composition primarily comprising (A) 100 parts by weight of a thermosetting or thermoplastic resin, (B) 5–2,000 parts by weight of a conductive filler, and (C) 0.1–300 parts by weight of organic resin or rubber particulates has a low volume resistivity and stability thereof, and is effectively adherent. When applied to semiconductor packages, the composition can prevent the semiconductor chips from warpage or cracking due to thermal stresses in the semiconductor packages, ensuring the fabrication of semiconductor devices with high reliability.
    Type: Grant
    Filed: April 24, 2003
    Date of Patent: April 11, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hideki Akiba, Masachika Yoshino, Nobuhiro Ichiroku, Toshio Shiobara
  • Resin composition for sealing LED elements and cured product generated by curing the composition
    Publication number: 20060035092
    Abstract: Provided is a resin composition for sealing LED elements, including (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, represented by an average composition formula (1): R1a(OX)bSiO(4-a-b)/2, in which, each R1 represents, independently, an alkyl group, alkenyl group or aryl group of 1 to 6 carbon atoms, each X represents, independently, a hydrogen atom, or an alkyl group, alkenyl group, alkoxyalkyl group or acyl group of 1 to 6 carbon atoms, a represents a number within a range from 1.05 to 1.5, b represents a number that satisfies 0<b<2, and 1.05<a+b<2), and (ii) a condensation catalyst. Also provided are a cured product produced by curing the composition and a process for sealing LED elements with the cured product. The composition exhibits excellent thermal resistance, ultraviolet light resistance, optical transparency, toughness and adhesion.
    Type: Application
    Filed: August 9, 2005
    Publication date: February 16, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hisashi Shimizu, Tsutomu Kashiwagi, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
    Publication number: 20050267236
    Abstract: In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Table having a second ionization potential of up to 20 eV, typically Zn2SiO4, ZnCrO4, ZnFeO4 or ZnMoO4. When used for semiconductor encapsulation, the epoxy resin composition is highly reliable and cures into a product which is effective for minimizing electrical failure such as defective insulation due to a copper migration phenomenon.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 1, 2005
    Inventors: Eiichi Asano, Toshio Shiobara
  • Partial block polyimide-polysiloxane copolymer, making method , and resin composition comprising the copolymer
    Publication number: 20050261456
    Abstract: A partial block polyimide-polysiloxane copolymer is provided comprising repeat unit structures having structural formulae (1) and (2) wherein X is an aromatic or aliphatic ring-containing tetravalent organic radical, Y1 is a diamine residue, Y2 is a diaminosiloxane residue, Y1 and Y2 are contained in the copolymer in amounts of 99-20 mol % and 1-80 mol %, respectively, L and m each are an integer of 2-50. The copolymer has good adhesion to substrates, moisture-proof reliability and a low modulus of elasticity.
    Type: Application
    Filed: May 18, 2005
    Publication date: November 24, 2005
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hideki Akiba, Nobuhiro Ichiroku, Toshio Shiobara