Abstract: A main portion 10 of an optical module 1 includes a thermoelectric cooler 21, and a chip carrier 22b placed on the cooler 21. A semiconductor light-emitting device 31, a lens 32, photodetectors 33a, 33b, and an etalon 34 are directly or indirectly mounted on the chip carrier 22b. Supporting members 36a and 36b are also fixed on the chip carrier 22b. A roof 35 is supported by the supporting members 36a, 36b and positioned above the etalon 34. The roof 35, supporting members 36a, 36b and chip carrier 22b are maintained at substantially equal temperatures by the cooler 21. As a result, the temperature of the etalon 34 is stabilized, and therefore the variation in the lock wavelength is suppressed.

Abstract: The light generating module comprises a housing, a semiconductor light emitting device, a first mounting face, a second mounting face, and a lens. The housing comprises a base and an optical window. The base extends along a predetermined plane and is made from material exhibiting a first thermal conductivity. The semiconductor light emitting device is provided in the housing. The first mounting face is made from material exhibiting a thermal conductivity equal to or more than the first thermal conductivity. The second mounting face mounts the semiconductor light emitting device and is made from material exhibiting a thermal conductivity equal to or more than the first thermal conductivity. The lens is provided in the housing. The lens has an installation face mounted on the first mounting face. The lens is used to direct light from the semiconductor light emitting device toward the optical window.

Abstract: This invention provides a light-emitting module in which the semiconductor light-emitting device and its driver circuit are arranged in side by side configuration, thereby realizing a high-speed transmission. The light-emitting module comprises the first beam splitter that splits light emitted from the front surface of the light-emitting device into an output light and a monitoring light. The monitored light is split again by the second splitter into the first and second monitoring light, one of which is monitored by the wavelength detector. Since the wavelength detector monitors the front light emitted from the light-emitting device, the driver can be arranged in side by side to the light-emitting device.

Abstract: An optical module 1 includes an optical component 30, a body 10 incorporating an optical element 14, and a metallic sleeve 40 having a tubular shape. The optical component 30 includes a nonmetallic ferrule 32 having an optical fiber insertion hole 36, and a metallic holder 34 which covers part of the ferrule 32. In this optical module 1, part of the holder 34 is inserted into the sleeve 40, and is positioned and welded to the sleeve 40. The sleeve 40 is positioned to a tubular portion 29 of the body 10 and welded thereto.

Abstract: An order receiver, when requested to make an estimate of a product, makes an estimate and calculates a delivery time while designing the product, and notifies them to a purchaser. A purchaser (3) requests an order receiver (5) an estimate of a product. The order receiver (5) prepares a 3-D profile sketch (V) from the three-side drawings of the product. The 3-D profile sketch (V) is divided into a plurality of components for a proper working. Development drawings for respective components are produced. Material costs, blanking costs are calculated from the development drawings. Bending processes are determined from respective development drawings. Bending hours and bending costs are calculated from the bending processes. Then, the components are assembled into a product. A welding cost, painting cost and an assembling cost are calculated from the product. A delivery time and an estimate are notified to the purchaser based on the costs and times to thereby shorten a lead time in producing the product.

Abstract: The optical module 10 of the present invention comprises a semiconductor optical device 14, a package 12 containing the semiconductor device, and lead terminals 22. The package 12 comprises a bottom member 34 and a side member 36. The bottom member contains a device mounting surface S2, the side member mounting surface S3, and a lead terminal joining surface S1. The optical semiconductor device 14 is mounted on the device mounting surface S2 and lead terminals are joined to the lead terminal joining surface S1.

Abstract: Disclosed are an apparatus and a method, which assist CAD data to be usable by supplier's own CAD and automatic programming tool no matter how a format of the CAD data from an orderer may be. Electronic drawing data Dx prepared in an orderer 11 is received in an outsourcing service center 14, the received electronic drawing data Dx is subjected to data conversion into electronic drawing data Dc in a format designated by the supplier 12, and the electronic drawing data Dc having been subjected to the data conversion is transmitted to the supplier 12 or a designated destination.

Abstract: The light generating module comprises a housing, a semiconductor light emitting device, a first mounting face, a second mounting face, and a lens. The housing comprises a base and an optical window. The base extends along a predetermined plane and is made from material exhibiting a first thermal conductivity. The semiconductor light emitting device is provided in the housing. The first mounting face is made from material exhibiting a thermal conductivity equal to or more than the first thermal conductivity. The second mounting face mounts the semiconductor light emitting device and is made from material exhibiting a thermal conductivity equal to or more than the first thermal conductivity. The lens is provided in the housing. The lens has an installation face mounted on the first mounting face. The lens is used to direct light from the semiconductor light emitting device toward the optical window.

Abstract: A main portion 10 of an optical module 1 includes a thermoelectric cooler 21, and a chip carrier 22b placed on the cooler 21. A semiconductor light-emitting device 31, a lens 32, photodetectors 33a, 33b, and an etalon 34 are directly or indirectly mounted on the chip carrier 22b. Supporting members 36a and 36b are also fixed on the chip carrier 22b. A roof 35 is supported by the supporting members 36a, 36b and positioned above the etalon 34. The roof 35, supporting members 36a, 36b and chip carrier 22b are maintained at substantially equal temperatures by the cooler 21. As a result, the temperature of the etalon 34 is stabilized, and therefore the variation in the lock wavelength is suppressed.

Abstract: A combination tap with external water purifier capable of preventing unwanted bacteria from breeding by washing a system on purified water side including the interior of the water purifier and pipes across the water purifier when raw water is used and also capable of selecting any delivery mode, comprising a combination stop valve mixing hot water with water and forming a main valve, the water purifier disposed on the outside of the combination tap on the downstream side of the combination stop valve so as to purify raw water and having flow paths for purified water and raw water, and a water quality switching valve disposed on the downstream side of the water purifier and allowing either of the purified water and raw water to flow to the delivery side.

Abstract: The present invention relates to a light-emitting module employable in optical communications. A light-emitting module 10 comprises a semiconductor light-emitting device 12, a first mounting member 14, a driving device 16, a second mounting member 18, and a housing 20. The first mounting member 14 mounts the light-emitting device 12. The driving device 16 drives the light-emitting device 12. The second mounting member 18 mounts the driving device 16. The housing 20 accommodates the light-emitting device 12, first mounting member 14, driving device 16, and second mounting member 18. The first mounting member 14 and the second mounting member 18 are disposed apart from each other within the housing 20. Since the mounting members are not directly in contact with each other, the heat generated by the driving device 16 is hard to be transmitted to the light-emitting device 12. Therefore, the light-emitting device 12 is restrained from changing its temperature, whereby its output is stabilized.

Abstract: The light-emitting module 1a comprises a semiconductor light-emitting device 16, a first optical detector 20a for monitoring magnitude of light emitted from the semiconductor device, a second optical detector 20b for monitoring a oscillation wavelength of the semiconductor device, and an Ethalon. The first detector 20a locates in the position where the wavelength variation of the transmitted light from the Ethalon is relatively small, while the second detector locates in the position where the wavelength variation of the transmitted light is relatively large. The geometrical size of the second detector along the first direction is wider than that along the second direction normal to the first direction, thus enhances the efficiency of the sensitivity for the wavelength.

Abstract: The object of the present invention is to provide an optical module for the WDM communication system, in which the oscillation wavelength is on the grid of the WDM regulation, moreover the optical output power and the oscillation wavelength can be controlled independently. The present module comprises a semiconductor light-emitting device, a wedge shaped Ethalon device and two light-receiving devices. The Ethalon contains a first portion, on which the anti-reflection films are coated, and a second portion. One of the receiving devices detects light transmitted through the first portion of the Ethalon, while the other device detects light through the second portion. Signal from the former device controls the output power of the light-emitting device, while the signal from the latter receiving device controls the oscillation wavelength of the laser.

Abstract: The optical module 10 of the present invention comprises a semiconductor optical device 14, a package 12 containing the semiconductor device, and lead terminals 22. The package 12 comprises a bottom member 34 and a side member 36. The bottom member contains a device mounting surface S2, the side member mounting surface S3, and a lead terminal joining surface S1. The optical semiconductor device 14 is mounted on the device mounting surface S2 and lead terminals are joined to the lead terminal joining surface S1.

Abstract: The present invention relates to a light-emitting module employable in optical communications. A light-emitting module 10 comprises a semiconductor light-emitting device 12, a first mounting member 14, a driving device 16, a second mounting member 18, and a housing 20. The first mounting member 14 mounts the light-emitting device 12. The driving device 16 drives the light-emitting device 12. The second mounting member 18 mounts the driving device 16. The housing 20 accommodates the light-emitting device 12, first mounting member 14, driving device 16, and second mounting member 18. The first mounting member 14 and the second mounting member 18 are disposed apart from each other within the housing 20. Since the mounting members are not directly in contact with each other, the heat generated by the driving device 16 is hard to be transmitted to the light-emitting device 12. Therefore, the light-emitting device 12 is restrained from changing its temperature, whereby its output is stabilized.

Abstract: This invention provides an integrated support system for supporting sheet metal machining adapted to store and reuse the know how of skilled machine operators and improve the quality of sheet metal products and the rate of operation of machine tools by shifting the arrangement operation from the actual machining phase to the design phase. An integrated support system for supporting sheet metal machining according to the invention is adapted to collect actual machining information obtained during the actual machining process on the machining site and site-specific attribute information that provide the basis for actual machining data and feed back the collected actual machining information and the site-specific attribute information to a sheet metal machining data storing means containing machining information for controlling the machine tools and machining support information relating to the machining information.

Abstract: A single-substrate-heat-processing apparatus includes an airtight process chamber, the interior of which is partitioned into a process space and a lower space by a mount plate and a shield frame. Heating lamps are disposed at a position outside the process chamber and below the mount plate. The mount plate is supported by a shield frame via an isolator, which has a thermal conductivity lower than that of the mount plate. The isolator is formed of a lower member and an upper member. The upper member has outer and inner cover portions, which cover the inner edge of the shield frame and the outer edge of the mount plate, respectively, in a non-contacting state.

Abstract: A single-substrate-heat-processing apparatus includes an airtight process chamber, the interior of which is partitioned into a process space and a lower space by a mount plate and a shield frame. Heating lamps are disposed at a position outside the process chamber and below the mount plate. The mount plate is supported by a shield frame via an isolator, which has a thermal conductivity lower than that of the mount plate. The isolator is formed of a lower member and an upper member. The upper member has outer and inner cover portions, which cover the inner edge of the shield frame and the outer edge of the mount plate, respectively, in a non-contacting state.

Abstract: A wireless data storage medium comprising an image recording section for rewritably recording and displaying a visible image, and wireless data storage means less in flexibility produced by bonding the wireless data storage section with the image recording section in such a manner that only part of a whole structure of the wireless data storage section is superposed on part of a whole structure of the image recording section, for storing and reading data on a memory for storing data by performing communication with an external system by use of the memory and an antenna.

Abstract: In a semiconductor laser module which contains a semiconductor laser 31 installed in a package 10 with an optical fiber 21 is fixed through support members 41, 43 to a submount 30 on which the semiconductor laser 31 is mounted. A ferrule 21 is fixed to the support members 41, 43 at first portion close to the leading end of the ferrule 21 and second portion apart forn the leading end of the ferrule 21. The support members 41, 43 and the ferrule 21 are not contact with the package 10 but placed in the same temperature condition as that of the semiconductor laser 31.