Abstract: A coating device includes a coating roller configured to rotate in a rotation direction to apply a treatment liquid onto a sheet at an application position, and a contacting member in contact with a peripheral surface of the coating roller at a position downstream of the application position in the rotation direction.

Abstract: A heating device, an image forming apparatus, and a liquid discharge apparatus. The heating device includes a heating roller having heat sources inside to heat a sheet. The heat sources include three or more first heat sources having a same distribution of thermal intensity and a second heat source having a distribution of thermal intensity different from the distribution of the thermal intensity of the first heat sources, and the second heat source is disposed inside a polygon whose vertices are the first heat sources when viewed from one end of the heating roller in a longitudinal direction of the heating roller. The image forming apparatus includes an image forming device to form an image on a sheet, and the heating device to heat the sheet. The liquid discharge apparatus includes a liquid discharge device to discharge liquid onto a sheet, and the heating device to heat the sheet.

Abstract: No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module (1) is transferred to a bus bar module (3) via a DC terminal (1A) of the semiconductor module (1). As illustrated in FIG. 4(B), the heat transferred to the bus bar module 3 is then transferred to the pressing member 5 via the annular conductor 8 and the bolt 5A. Since the pressing member 5 is in close contact with the second cooler 2B, the heat transferred to the pressing member 5 is cooled by the second cooler 2B. On the other hand, the heat transferred to the convex portion 6A of the housing 6 is transferred to the first cooler 2A via the housing 6 and cooled. As a result, in the configuration in which a capacitor (4) is connected to the semiconductor module (1) via the bus bar module (3), the heat transferred from the semiconductor module (1) to the capacitor (4) can be suppressed.

Abstract: A liquid discharge apparatus includes a head including a supply path and a discharge path circulating a liquid in a liquid circulation direction, the head configured to discharge the liquid, a circulation path coupled to the head, the liquid circulates through the head in the circulation path, a bypass coupled to a downstream end of the supply path of the head and an upstream end of the discharge path of the head in the liquid circulation direction, a pressure generator configured to generate and apply a circulation pressure to the liquid circulating through the circulation path, and a deaerator configured to remove gas in the liquid circulating the circulation path.

Abstract: An image forming apparatus includes an image forming device, a rotatable conveying member, and a suction device. The image forming device forms an image on a continuous recording medium. The conveying member has a hollow drum shape. The conveying member conveys the continuous recording medium. The suction device is disposed inside the hollow drum shape of the conveying member. The suction device sucks the continuous recording medium through the conveying member in a fixed region in which the continuous recording medium and the conveying member are in contact with each other.

Abstract: A liquid discharge apparatus includes a head including a supply path and a discharge path circulating a liquid in a liquid circulation direction, the head configured to discharge the liquid, a circulation path coupled to the head, the liquid circulates through the head in the circulation path, a bypass coupled to a downstream end of the supply path of the head and an upstream end of the discharge path of the head in the liquid circulation direction, a pressure generator configured to generate and apply a circulation pressure to the liquid circulating through the circulation path, and a deaerator configured to remove gas in the liquid circulating the circulation path.

Abstract: No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module (1) is transferred to a bus bar module (3) via a DC terminal (1A) of the semiconductor module (1). As illustrated in FIG. 4(B), the heat transferred to the bus bar module 3 is then transferred to the pressing member 5 via the annular conductor 8 and the bolt 5A. Since the pressing member 5 is in close contact with the second cooler 2B, the heat transferred to the pressing member 5 is cooled by the second cooler 2B. On the other hand, the heat transferred to the convex portion 6A of the housing 6 is transferred to the first cooler 2A via the housing 6 and cooled. As a result, in the configuration in which a capacitor (4) is connected to the semiconductor module (1) via the bus bar module (3), the heat transferred from the semiconductor module (1) to the capacitor (4) can be suppressed.

Abstract: A coating device includes a coating roller configured to rotate in a rotation direction to apply a treatment liquid onto a sheet at an application position, and a contacting member in contact with a peripheral surface of the coating roller at a position downstream of the application position in the rotation direction.

Abstract: A device includes a temperature control member and a linearly-contact member. The temperature control member has an outer peripheral surface to contact a conveyed substrate to which liquid is applied, and heats or cools the substrate. The linearly-contact member contacts the substrate and the temperature control member on an upstream side from a contact position between the substrate and the temperature control member in a conveyance direction of the substrate.

Abstract: An image forming apparatus includes an image forming device, a rotatable conveying member, and a suction device. The image forming device forms an image on a continuous recording medium. The conveying member has a hollow drum shape. The conveying member conveys the continuous recording medium. The suction device is disposed inside the hollow drum shape of the conveying member. The suction device sucks the continuous recording medium through the conveying member in a fixed region in which the continuous recording medium and the conveying member are in contact with each other.

Abstract: An apparatus according to one aspect of the present disclosure includes a temperature controlling member configured to heat or cool a conveyed substrate to which a liquid is applied, the conveyed substrate contacting an outer peripheral surface of the temperature controlling member; and an upstream inlet air unit configured to draw air between the substrate and the temperature controlling member, the upstream inlet air unit being provided upstream of a contact location of the substrate with the temperature controlling member, in a conveying direction.

Abstract: An object of the present invention is to ensure the reliability of a capacitor element by appropriately securing a heat path around the capacitor element. A power converter according to the present invention includes: a power semiconductor circuit unit that converts DC power into AC power; a capacitor element that smooths the DC power; a DC-side bus bar that transmits the DC power; a capacitor terminal that is connected to an electrode surface of the capacitor element and to the DC-side bus bar; and a case that forms a capacitor housing portion for housing the capacitor element, in which the DC-side bus bar has: a power supply-side terminal; a main body portion that is arranged at a position facing a bottom of the capacitor housing portion with the capacitor element interposed therebetween; and an extending member that is formed between the case and the capacitor element and formed from the main body portion toward the bottom of the capacitor housing portion, and that does not contact the electrode surface.

Abstract: A device includes a temperature control member and a linearly-contact member. The temperature control member has an outer peripheral surface to contact a conveyed substrate to which liquid is applied, and heats or cools the substrate. The linearly-contact member contacts the substrate and the temperature control member on an upstream side from a contact position between the substrate and the temperature control member in a conveyance direction of the substrate.

Abstract: A drying device includes a drum, a contact conveyance roller, and a cooling device. The drum heats a continuous medium while conveying the continuous medium. The continuous medium is wound around a circumferential surface of the drum. The contact conveyance roller contacts the drum at a downstream end of a portion of the continuous medium wound around the circumferential surface of the drum in a conveyance direction of the continuous medium. Further, the contact conveyance roller conveys the continuous medium separated from the drum. The continuous medium is wound around the contact conveyance roller. The cooling device cools the contact conveyance roller.

Abstract: A power module includes a double-sided electrode module, a power semiconductor element, a pair of base plates, and a connecting member. The double-sided electrode module has a plurality of electrode wiring boards and a power semiconductor element which are molded with a resin material. The pair of base plates has the double-sided electrode module sandwiched therebetween. The pair of base plates are connected via the connecting member. The connecting member is formed in a curved shape.

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: An object of the present invention is to ensure the reliability of a capacitor element by appropriately securing a heat path around the capacitor element. A power converter according to the present invention includes: a power semiconductor circuit unit that converts DC power into AC power; a capacitor element that smooths the DC power; a DC-side bus bar that transmits the DC power; a capacitor terminal that is connected to an electrode surface of the capacitor element and to the DC-side bus bar; and a case that forms a capacitor housing portion for housing the capacitor element, in which the DC-side bus bar has: a power supply-side terminal; a main body portion that is arranged at a position facing a bottom of the capacitor housing portion with the capacitor element interposed therebetween; and an extending member that is formed between the case and the capacitor element and formed from the main body portion toward the bottom of the capacitor housing portion, and that does not contact the electrode surface.

Abstract: An apparatus according to one aspect of the present disclosure includes a temperature controlling member configured to heat or cool a conveyed substrate to which a liquid is applied, the conveyed substrate contacting an outer peripheral surface of the temperature controlling member; and an upstream inlet air unit configured to draw air between the substrate and the temperature controlling member, the upstream inlet air unit being provided upstream of a contact location of the substrate with the temperature controlling member, in a conveying direction.

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.