Abstract: A power conversion device for a vehicle includes: a power module that includes a switching device and, upon operation of the switching device, converts DC power into AC power to be supplied to an electric machine for driving a vehicle; a capacitor module that includes a smoothing capacitor element, an input-side power source terminal for receiving DC power, and an output-side power source terminal for supplying DC power to the power module; and a noise removal capacitor for removing noise, wherein: the noise removal capacitor is built in the capacitor module, and the noise removal capacitor is electrically connected to the input-side power source terminal in a position where a distance between a connection position of the noise removal capacitor and the input-side power source terminal is less than a distance between a connection position of the noise removal capacitor and the output-side power source terminal of the capacitor module.

Abstract: An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: A lubricant applicator includes a solid mold lubricant, a lubricant application roller, and a flicker member. The lubricant application roller scrapes and applies the lubricant to an image bearing member. The flicker member removes a powder substance adhered to the surface of the lubricant application roller and is disposed upstream of the solid mold lubricant in a direction of rotation of the lubricant application roller. The lubricant application roller, the flicker member, and the solid mold lubricant define a sealed space therebetween. A lubricant applicator includes the solid mold lubricant, the lubricant application roller, the flicker member, and an adherence prevention member that prevents the substance removed by the flicker member from adhering again to the lubricant application roller. A lubricant applicator includes the solid mold lubricant, the lubricant application roller, and a lubricant receiver that receives the scraped lubricant from the lubricant application roller.

Abstract: An image forming apparatus includes an image carrier, a developing device that forms a toner image on the surface of the image carrier, a transfer unit that transfers the toner image formed on the image carrier onto a transfer material such as paper, a neutralizing unit that neutralizes an electrostatic latent image on the surface of the image carrier by light radiation, a cleaning unit that cleans toner remaining on the surface of the image carrier after the toner image is transferred. The image carrier, the developing device, the transfer unit, the neutralizing unit, and the cleaning unit are provided to the main body of the image forming apparatus. The image forming apparatus further includes a withdrawal mechanism that withdraws at least the image carrier, the cleaning unit, and the neutralizing unit integrally from the main body of the image forming apparatus.

Abstract: An imaging device includes an image carrying member; a developing unit for forming a toner image by developing an electrostatic latent image that has been formed on the image carrying member in a charged state; a cleaning unit for cleaning a toner that remains on the image carrying member after the toner image has been transferred from the image carrying member onto a transfer material; a lubricant applying unit for applying a lubricant on the image carrying member; and a control unit for performing drive control of the image carrying member, the developing unit, the cleaning unit, and the lubricant applying unit. Before the imaging device starts an imaging operation, the control unit controls the image carrying member, the developing unit, and the cleaning unit to perform respective operations; while controls the lubricant applying unit to repeat performing and suspending the operation in an intermittent manner.

Abstract: An image forming apparatus including an image carrier; a charger to charge a surface of the image carrier; an irradiating device to form a latent image; a developing device to form a toner image; a transfer device to transfer the toner image onto a recording medium; a cleaning device to remove residual toner from the surface of the image carrier; a temperature and humidity detector to measure temperature and humidity within the image forming apparatus; a stop time clock to measure a period of time for which the image carrier is not driven; a removal unit to remove discharge products adhering to the surface of the image carrier; and a control unit to drive the removal unit to remove the discharge products for a period of time determined by the control unit based on measurements obtained by the temperature and humidity detector and the stop time clock.

Abstract: A lubricant applicator includes a solid mold lubricant, a lubricant application roller, and a flicker member. The lubricant application roller scrapes and applies the lubricant to an image bearing member. The flicker member removes a powder substance adhered to the surface of the lubricant application roller and is disposed upstream of the solid mold lubricant in a direction of rotation of the lubricant application roller. The lubricant application roller, the flicker member, and the solid mold lubricant define a sealed space therebetween. A lubricant applicator includes the solid mold lubricant, the lubricant application roller, the flicker member, and an adherence prevention member that prevents the substance removed by the flicker member from adhering again to the lubricant application roller. A lubricant applicator includes the solid mold lubricant, the lubricant application roller, and a lubricant receiver that receives the scraped lubricant from the lubricant application roller.

Abstract: An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small sized electronic circuit component which permits to integrate a variety of electronic parts such as capacitors, inductors and resistors in a high density with low cost. The electronic circuit component comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.

Abstract: The power conversion apparatus uses the semiconductor device. Said semiconductor device includes a first group of power semiconductor elements at least one of which is electrically connected between a first potential and a third potential, a second group of power semiconductor elements at least one of which is electrically connected between a second potential and the third potential, and a third group of power semiconductor elements at least one of which is electrically connected between the first potential and the third potential. The second group is disposed between the first group and third group. Thereby, a low-loss semiconductor device having both inductance reducibility and heat generation balancing capability and also an electric power conversion apparatus using the same is provided.

Abstract: A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon and electrically connecting a plurality of connection terminals arranged in intervals different from intervals of the holes to the conductive material. The shape of the conductive material is porous and porous electrodes are bonded to the inner wall surfaces of the holes by an anchor effect to increase the strength of the glass substrate.

Abstract: Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small sized electronic circuit component which permits to integrate a variety of electronic parts such as capacitors, inductors and resistors in a high density with low cost. The electronic circuit component comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.

Abstract: The present invention is a semiconductor device having the semiconductor element obtained by cutting a semiconductor wafer with the electrode pad formed on one side along a scribe line, a semiconductor element protective layer on the semiconductor element which has a opening on the pad, a stress cushioning layer on the layer which has the opening on the pad, a lead wire portion reaching the layer from the electrode pad via the openings, external electrodes on the lead wire portion, and the conductor protective layer on the layers, the layer and the conductor protective layer forming the respective end faces on the end surface of the semiconductor element inside the scribe line and exposing the range from the end face of the end surface to the inside of the scribe line.

Abstract: In order to provide a low-cost and high heat-radiating electronic circuit device featuring high compactness, little warpage, high air tightness, high moldability, high mass productivity, high reliability against thermal shocks, and high oil-proof reliability, a module structure made by packing a whole multi-layer circuit board which connects a semiconductor operating element, semiconductor memory elements, and passive elements thereon and part of a supporting material on which said multi-layer circuit board is placed into a single package by transfer-molding; wherein said multi-layer circuit board and said supporting material are bonded together with a compound metallic material made up from copper oxide and at least one metal selected from a set of gold, silver, and copper.

Abstract: A thin film capacitor comprising a lower electrode formed on a predetermined surface, a dielectric layer formed on the lower electrode, and an upper electrode formed on the dielectric layer, wherein the end portion of the lower electrode is further covered by an insulator other than the dielectric layer.

Abstract: Semiconductor devices,-semiconductor wafers, and semiconductor modules are provided: wherein the semiconductor device has a small warp; damages at chip edge and cracks in a dropping test are scarcely generated; and the semiconductor device is superior in mounting reliability and mass producibility. The semiconductor device 17 comprising: a semiconductor chip 64; a porous stress relaxing layer 3 provided on the plane, whereon circuits and electrodes are formed, of the semiconductor chip; a circuit layer 2 provided on the stress relaxing layer and connected to the electrodes; and external terminals 10 provided on the circuit layer; wherein an organic protecting film 7 is formed on the plane, opposite to the stress relaxing layer, of the semiconductor chip, and respective side planes of the stress relaxing layer, the semiconductor chip 6, and the protecting film 7 are exposed outside on a same plane.

Abstract: The power conversion apparatus uses the semiconductor device. Said semiconductor device includes a first group of power semiconductor elements at least one of which is electrically connected between a first potential and a third potential, a second group of power semiconductor elements at least one of which is electrically connected between a second potential and the third potential, and a third group of power semiconductor elements at least one of which is electrically connected between the first potential and the third potential. The second group is disposed between the first group and third group. Thereby, a low-loss semiconductor device having both inductance reducibility and heat generation balancing capability and also an electric power conversion apparatus using the same is provided.