Patents by Inventor Toshiya Satoh

Toshiya Satoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10177676
    Abstract: An object of the present invention is to reduce wire inductance without damaging manufacturability of a power converter. A power converter according to the present invention includes a power semiconductor module, a capacitor, and DC bus bars and. The capacitor smooths a DC power. The DC bus bars and transmit the DC power. The DC bus bars and include a first terminal and a second terminal. The first terminal connects to the power semiconductor module. The second terminal connects to the capacitor. The DC bus bars and form a module opening portion to insert the power semiconductor module. The DC bus bars and form a closed circuit such that a DC current flowing between the first terminal and the second terminal flows to an outer periphery of the module opening portion.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: January 8, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Takeshi Tokuyama, Morio Kuwano, Toshiya Satoh, Akihiro Namba
  • Patent number: 10128164
    Abstract: An electronic component has a semiconductor element and a thermally conductive support member. A heat sink is disposed on one surface of the circuit body, and a thermally conductive insulating member is interposed between the heat sink and the support member. Input and output terminals and a ground terminal are also provided. A sealing resin is formed to expose a part of each of the input and output terminals and the ground terminal and one surface of the heat sink, and to cover a periphery of the electronic component structure. A main body conductor layer is formed to be insulated from the input and output terminals and cover an immersion region of the sealing resin and one surface of the heat sink immersed in a cooling medium. A ground conductor layer covers at least a part of the ground terminal and is electrically connected with the main body conductor layer.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: November 13, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hiroyuki Temmei, Mina Amo, Nobutake Tsuyuno, Takeshi Tokuyama, Toshiaki Ishii, Toshiya Satoh
  • Patent number: 10027246
    Abstract: An object of the present invention is to achieve both low height and miniaturization of a double side cooling type electric power conversion device.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: July 17, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Takeshi Tokuyama, Takahiro Shimura, Toshiya Satoh
  • Patent number: 9999150
    Abstract: An object of the invention is to improve the cooling performance for a bus bar and a smoothing capacitor in an electric power converter. The electric power converter of the present invention includes a power semiconductor module including a power semiconductor element that converts a DC current to an AC current, a capacitor cell that smooths a DC voltage, a bus bar that electrically connects the power semiconductor module and the capacitor cell, a base plate that is disposed between the bus bar and the capacitor cell, and a sealing material that seals the capacitor cell, the bus bar, and the base plate. The base plate forms an opening through which a capacitor terminal extending from the capacitor cell passes.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: June 12, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Ken Maeda, Toshiya Satoh
  • Publication number: 20180041136
    Abstract: An object of the present invention is to achieve both low height and miniaturization of a double side cooling type electric power conversion device.
    Type: Application
    Filed: February 26, 2016
    Publication date: February 8, 2018
    Inventors: Takeshi TOKUYAMA, Takahiro SHIMURA, Toshiya SATOH
  • Publication number: 20180013355
    Abstract: An object of the present invention is to reduce wire inductance without damaging manufacturability of a power converter. A power converter according to the present invention includes a power semiconductor module, a capacitor, and DC bus bars and. The capacitor smooths a DC power. The DC bus bars and transmit the DC power. The DC bus bars and include a first terminal and a second terminal. The first terminal connects to the power semiconductor module. The second terminal connects to the capacitor. The DC bus bars and form a module opening portion to insert the power semiconductor module. The DC bus bars and form a closed circuit such that a DC current flowing between the first terminal and the second terminal flows to an outer periphery of the module opening portion.
    Type: Application
    Filed: February 26, 2016
    Publication date: January 11, 2018
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Takeshi TOKUYAMA, Morio KUWANO, Toshiya SATOH, Akihiro NAMBA
  • Patent number: 9852962
    Abstract: A waterproof electronic device includes: an electronic component module having an electronic component including a semiconductor element, a heat dissipating member provided on the electronic component in a thermally conductive manner, and an insulating material that surrounds the electronic component in such a manner that one surface of the heat dissipating member is exposed; and a waterproof film that is formed at least on whole surfaces in regions of the electronic component module that are to be immersed in a coolant.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: December 26, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hiroyuki Temmei, Mina Amo, Nobutake Tsuyuno, Eiichi Ide, Takeshi Tokuyama, Toshiya Satoh, Toshiaki Ishii, Kazuaki Naoe
  • Publication number: 20170365536
    Abstract: An electronic device includes electronic components and an epoxy resin portion which seals the electronic components. The electronic device is disposed in a refrigerant which cools the electronic components. A first layer having a three-dimensional crosslinking structure is formed on a surface or inside of the epoxy resin portion. The first layer is formed such that a length calculated by cube root of an average free volume in the three-dimensional crosslinking structure of the first layer is shorter than a length of the longest side of molecules forming the refrigerant.
    Type: Application
    Filed: January 8, 2016
    Publication date: December 21, 2017
    Inventors: Mina AMO, Nobutake TSUYUNO, Takeshi TOKUYAMA, Toshiya SATOH
  • Publication number: 20170309540
    Abstract: An electronic component has a semiconductor element and a thermally conductive support member. A heat sink is disposed on one surface of the circuit body, and a thermally conductive insulating member is interposed between the heat sink and the support member. Input and output terminals and a ground terminal are also provided. A sealing resin is formed to expose a part of each of the input and output terminals and the ground terminal and one surface of the heat sink, and to cover a periphery of the electronic component structure. A main body conductor layer is formed to be insulated from the input and output terminals and cover an immersion region of the sealing resin and one surface of the heat sink immersed in a cooling medium. A ground conductor layer covers at least a part of the ground terminal and is electrically connected with the main body conductor layer.
    Type: Application
    Filed: October 15, 2015
    Publication date: October 26, 2017
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Hiroyuki TEMMEI, Mina AMO, Nobutake TSUYUNO, Takeshi TOKUYAMA, Toshiaki ISHII, Toshiya SATOH
  • Publication number: 20170302191
    Abstract: A power converter device includes a double-sided electrode module in which an electrical wiring board and a power semiconductor element are molded with a resin material. The power converter device also includes a heat dissipating base disposed on both sides of the double-sided electrode module and directly contacting cooling medium. The power converter device also includes a module fixture which presses the heat dissipating base in a state of contact with the heat dissipating base. The module fixture is configured to support a circuit board.
    Type: Application
    Filed: June 28, 2017
    Publication date: October 19, 2017
    Inventors: Kinya NAKATSU, Hiroshi HOZOJI, Takeshi TOKUYAMA, Yusuke TAKAGI, Toshiya SATOH, Taku OYAMA, Takanori NINOMIYA
  • Patent number: 9729076
    Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base, and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: August 8, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Kinya Nakatsu, Hiroshi Hozoji, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama, Takanori Ninomiya
  • Publication number: 20170215304
    Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.
    Type: Application
    Filed: April 10, 2017
    Publication date: July 27, 2017
    Inventors: Takeshi TOKUYAMA, Kinya NAKATSU, Ryuichi SAITO, Keisuke HORIUCHI, Toshiya SATOH, Hideki MIYAZAKI
  • Patent number: 9703253
    Abstract: A toner conveyance device includes a toner conveyance path through which toner is transported. The toner conveyance path includes a flexible portion, a toner conveyor inside the conveyance path to convey the toner, and a restrictor outside the toner conveyance path to restrict deformation of the toner conveyance path.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: July 11, 2017
    Assignee: RICOH COMPANY, LTD.
    Inventors: Daisuke Tomita, Toshiya Satoh, Satoshi Hatori, Takeshi Fukao, Hajime Teraji, Norio Kudoh, Hiroyuki Uenishi
  • Patent number: 9690250
    Abstract: An image forming apparatus includes an image bearer; a charger to charge a surface of the image bearer; an exposure device to expose the surface of the image bearer and form an electrostatic latent image on the image bearer; a developing device to adhere electrically charged toner to the electrostatic latent image on the image bearer, to thereby form a toner image; a microprocessor to control rotation of the image bearer; and a sensor to detect temperature and humidity. In a state of suspended rotation of the image bearer, the microprocessor controls the image bearer to rotate a predetermined amount at a predetermined interval and determines whether a rotation operation of the image bearer is to be performed, based on a detection result of the sensor.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: June 27, 2017
    Assignee: Ricoh Company, Ltd.
    Inventors: Tomohiko Saito, Toshiya Satoh, Norio Kudoh, Hiroyuki Uenishi, Daisuke Tomita
  • Patent number: 9648791
    Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.
    Type: Grant
    Filed: August 10, 2015
    Date of Patent: May 9, 2017
    Assignee: Hitachi, Ltd.
    Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Keisuke Horiuchi, Toshiya Satoh, Hideki Miyazaki
  • Patent number: 9591789
    Abstract: An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided. An insulation layer 700 is provided between a power semiconductor module 302 and a heat dissipation portion 307B. The power semiconductor module 302 includes a resin sealer 348, which covers a circumferential side surface of a conductor plate 315, and a plurality of recesses 348D are provided in the resin sealer 348. The insulation layer 700 is formed of a spray coated film 710, an insulation film 720, and a resin layer 730, and the spray coated film 710 is formed on the surface of the resin sealer 348 including recesses 348D to form a seamless flat surface. The planar size of each of the recesses 348D is greater than the planar size of each flat portion 711, which forms the spray coated film 710.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: March 7, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Eiichi Ide, Eiji Nishioka, Toshiaki Ishii, Junpei Kusukawa, Kinya Nakatsu, Nobutake Tsuyuno, Toshiya Satoh, Masahiko Asano
  • Patent number: 9563167
    Abstract: An image forming apparatus includes an image bearer; a charger to charge a surface of the image bear; a developing device to develop a toner image on the surface of the image bearer; an image bearer cleaner to remove residual toner remaining on the surface of the image bearer after a transfer process; and a controller to cause the image forming apparatus to perform, before a start of printing operation, a corona products removal mode. In the image forming apparatus further including a temperature and humidity sensor to measure temperature and humidity of an ambient environment of the image bearer, the controller to cause the image forming apparatus to perform, before a start of an image forming operation, a corona products removal mode based on an absolute humidity obtained by the temperature and humidity detected by the temperature and humidity sensor.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: February 7, 2017
    Assignee: Ricoh Company, Ltd.
    Inventors: Daisuke Tomita, Toshiya Satoh, Norio Kudoh, Hiroyuki Uenishi, Tomohiko Saito
  • Publication number: 20160343636
    Abstract: A waterproof electronic device includes: an electronic component module having an electronic component including a semiconductor element, a heat dissipating member provided on the electronic component in a thermally conductive manner, and an insulating material that surrounds the electronic component in such a manner that one surface of the heat dissipating member is exposed; and a waterproof film that is formed at least on whole surfaces in regions of the electronic component module that are to be immersed in a coolant.
    Type: Application
    Filed: February 4, 2015
    Publication date: November 24, 2016
    Inventors: Hiroyuki TEMMEI, Mina AMO, Nobutake TSUYUNO, Eiichi IDE, Takeshi TOKUYAMA, Toshiya SATOH, Toshiaki ISHII, Kazuaki NAOE
  • Publication number: 20160308456
    Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base, and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.
    Type: Application
    Filed: June 28, 2016
    Publication date: October 20, 2016
    Inventors: Kinya NAKATSU, Hiroshi HOZOJI, Takeshi TOKUYAMA, Yusuke TAKAGI, Toshiya SATOH, Taku OYAMA, Takanori NINOMIYA
  • Publication number: 20160306318
    Abstract: A toner conveyance device includes a toner conveyance path through which toner is transported. The toner conveyance path includes a flexible portion, a toner conveyor inside the conveyance path to convey the toner, and a restrictor outside the toner conveyance path to restrict deformation of the toner conveyance path.
    Type: Application
    Filed: April 18, 2016
    Publication date: October 20, 2016
    Inventors: Daisuke TOMITA, Toshiya SATOH, Satoshi HATORI, Takeshi FUKAO, Hajime TERAJI, Norio KUDOH, Hiroyuki UENISHI