Abstract: A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.

Abstract: An image forming apparatus includes an image bearer; a charger to charge a surface of the image bearer; an exposure device to expose the surface of the image bearer and form an electrostatic latent image on the image bearer; a developing device to adhere electrically charged toner to the electrostatic latent image on the image bearer, to thereby form a toner image; a microprocessor to control rotation of the image bearer; and a sensor to detect temperature and humidity. In a state of suspended rotation of the image bearer, the microprocessor controls the image bearer to rotate a predetermined amount at a predetermined interval and determines whether a rotation operation of the image bearer is to be performed, based on a detection result of the sensor.

Abstract: An image forming apparatus includes an image bearer; a charger to charge a surface of the image bear; a developing device to develop a toner image on the surface of the image bearer; an image bearer cleaner to remove residual toner remaining on the surface of the image bearer after a transfer process; and a controller to cause the image forming apparatus to perform, before a start of printing operation, a corona products removal mode. In the image forming apparatus further including a temperature and humidity sensor to measure temperature and humidity of an ambient environment of the image bearer, the controller to cause the image forming apparatus to perform, before a start of an image forming operation, a corona products removal mode based on an absolute humidity obtained by the temperature and humidity detected by the temperature and humidity sensor.

Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.

Abstract: The purpose of the present invention is to reduce the wiring inductance of a power semiconductor module.

Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.

Abstract: An image forming apparatus includes a first image forming device, a plurality of second image forming devices, a first bias voltage supply device, and a second bias voltage supply device. The first image forming device and the second image forming device form a toner image. The first bias voltage supply device applies a bias voltage to a first component of the first image forming device. The second bias voltage supply device applies a bias voltage to a second component of each of the plurality of second image forming devices.

Abstract: The power conversion apparatus includes an inverter circuit which converts a DC current into an AC current and have a U-phase, V-phase, and w-phase power semiconductor modules, and a capacitor module for smoothing the DC current. Each of the power semiconductor modules is configured separately and connected to a first bus bar. The first bus bar is configured with a first positive side bus bar, a first negative side bus bar, and a first insulation member arranged between the first positive side bus bar and the first negative side bus bar. The first bus bar includes a first to third terminals to which the U-phase, V-phase, and W-phase power semiconductor modules are connected, respectively, and a fourth terminal connected to a terminal of the second bus bar protruding from a surface of sealing material of a second bus bar.

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: A cleaning device includes a brush to contact a photoconductive member, a roller to contact the brush, and a blade. The blade is located along the roller in a longitudinal direction. The blade has a first portion, a second portion, and a bent portion between the first portion and the second portion. A contact surface or edge of the first portion contacts a surface of the roller to remove toner therefrom.

Abstract: An object of the invention is to improve the cooling performance for a bus bar and a smoothing capacitor in an electric power converter. The electric power converter of the present invention includes a power semiconductor module including a power semiconductor element that converts a DC current to an AC current, a capacitor cell that smooths a DC voltage, a bus bar that electrically connects the power semiconductor module and the capacitor cell, a base plate that is disposed between the bus bar and the capacitor cell, and a sealing material that seals the capacitor cell, the bus bar, and the base plate. The base plate forms an opening through which a capacitor terminal extending from the capacitor cell passes.

Abstract: A power conversion device for a vehicle includes: a power module that includes a switching device and, upon operation of the switching device, converts DC power into AC power to be supplied to an electric machine for driving a vehicle; a capacitor module that includes a smoothing capacitor element, an input-side power source terminal for receiving DC power, and an output-side power source terminal for supplying DC power to the power module; and a noise removal capacitor for removing noise, wherein: the noise removal capacitor is built in the capacitor module, and the noise removal capacitor is electrically connected to the input-side power source terminal in a position where a distance between a connection position of the noise removal capacitor and the input-side power source terminal is less than a distance between a connection position of the noise removal capacitor and the output-side power source terminal of the capacitor module.

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: The purpose of the present invention is to reduce the wiring inductance of a power semiconductor module.

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: A power module includes a semiconductor chip, a first coupling conductor with one main surface coupled to one main surface of the semiconductor chip, a second coupling conductor with one main surface coupled to the other main surface of the semiconductor chip, a coupling terminal supplied with electrical power from the direct current power source, and resin material to seal the semiconductor chip, and in which the resin member has a protruding section that protrudes from the space where the first and second coupling conductors are formed opposite each other, and the coupling terminal is clamped on the protruding section, and at least one of the first or second coupling conductors is coupled to a coupling terminal by way of a metallic material that melts at a specified temperature.

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit is housed; and an insulating member that is placed between the base plate and the semiconductor circuit unit and secures electrical insulation of the base plate and the semiconductor circuit unit. A rigidity or thickness of the connecting member is less than a rigidity or thickness of the base plate.

Abstract: An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided. An insulation layer 700 is provided between a power semiconductor module 302 and a heat dissipation portion 307B. The power semiconductor module 302 includes a resin sealer 348, which covers a circumferential side surface of a conductor plate 315, and a plurality of recesses 348D are provided in the resin sealer 348. The insulation layer 700 is formed of a spray coated film 710, an insulation film 720, and a resin layer 730, and the spray coated film 710 is formed on the surface of the resin sealer 348 including recesses 348D to form a seamless flat surface. The planar size of each of the recesses 348D is greater than the planar size of each flat portion 711, which forms the spray coated film 710.