Abstract: Provided are a work content analysis apparatus, method, and program for analyzing a state of congestion or proximity of persons such as workers in an analysis target region such as a factory, for each area in the analysis target region. According to an embodiment a work content analysis apparatus includes a first database, an accumulation unit, and a classification unit. The database stores position information indicative of a position of a person in the analysis target region together with time information, in association with identification information of the person. The accumulation unit acquires a cumulative value in a predetermined item based on the position information and the time information stored in the first database in association with the identification information of the person. The classification unit classifies the each area based on the cumulative value acquired by the accumulation unit.

Abstract: A work content analyzing apparatus of the present embodiment includes a first database storing state information indicating a state of each of one or a plurality of workers in association with time information and identification information of the worker, an estimation unit estimating the work content executed by the worker on the basis of at least two pieces of state information associated with same time in the state information stored in the first database, a specification unit specifying work time spent for the estimated work content on the basis of the state information stored in the first database and the time information associated with the state information, and an analysis unit analyzing the work content on the basis of the estimated work content and the specified work time.

Abstract: An electron source capable of suppressing consumption of an electron emission material is provide. The present invention provides an electron source including: an electron emission material; and, an electron emission-suppressing material covering a side surface of the electron emission material, wherein a work function of the electron emission-suppressing material is higher than that of the electron emission material, and a thermal emissivity of the electron emission-suppressing material is lower than that of the electron emission material.

Abstract: An electron source capable of suppressing consumption of an electron emission material is provide. The present invention provides an electron source including: an electron emission material; and, an electron emission-suppressing material covering a side surface of the electron emission material, wherein a work function of the electron emission-suppressing material is higher than that of the electron emission material, and a thermal emissivity of the electron emission-suppressing material is lower than that of the electron emission material.

Abstract: An electron source capable of suppressing consumption of an electron emission material is provide. The present invention provides an electron source including: an electron emission material; and, an electron emission-suppressing material covering a side surface of the electron emission material, wherein a work function of the electron emission-suppressing material is higher than that of the electron emission material, and a thermal emissivity of the electron emission-suppressing material is lower than that of the electron emission material.

Abstract: An electron source capable of suppressing consumption of an electron emission material is provide. The present invention provides an electron source including: an electron emission material; and, an electron emission-suppressing material covering a side surface of the electron emission material, wherein a work function of the electron emission-suppressing material is higher than that of the electron emission material, and a thermal emissivity of the electron emission-suppressing material is lower than that of the electron emission material.

Abstract: An electron source capable of suppressing consumption of an electron emission material is provide. The present invention provides an electron source including: an electron emission material; and, an electron emission-suppressing material covering a side surface of the electron emission material, wherein a work function of the electron emission-suppressing material is higher than that of the electron emission material, and a thermal emissivity of the electron emission-suppressing material is lower than that of the electron emission material.

Abstract: An electron source capable of suppressing consumption of an electron emission material is provide. The present invention provides an electron source including: an electron emission material; and, an electron emission-suppressing material covering a side surface of the electron emission material, wherein a work function of the electron emission-suppressing material is higher than that of the electron emission material, and a thermal emissivity of the electron emission-suppressing material is lower than that of the electron emission material.

Abstract: The present invention is a charged-particle gun (EG) in which a negative electrode (1) and a positive electrode (9) are integrated and assembled in advance, and which can be stored and transported in a state in which the negative electrode and the positive electrode are integrated, wherein the negative electrode and the positive electrode are connected by a conductor (11) during storage and transportation of the charged-particle gun. It is thereby possible to prevent an electrode tip of the charged-particle gun from being damaged by electrical discharge caused by static electricity during storage and transportation.

Abstract: A semiconductor substrate is provided in which an alignment mark is formed that can be used for an alignment even after the formation of an impurity diffused layer by the planarization of an epitaxial film. A trench is formed in an alignment region of an N?-type layer formed on an N+-type substrate. This trench is used to leave voids after the formation of a P?-type epitaxial film on the N?-type layer. Then, the voids formed in the N?-type layer can be used as an alignment mark. Thus, such a semiconductor substrate can be used to provide an alignment in the subsequent step of manufacturing the semiconductor apparatus. Thus, the respective components constituting the semiconductor apparatus can be formed at desired positions accurately.

Abstract: A semiconductor substrate is provided in which an alignment mark is formed that can be used for an alignment even after the formation of an impurity diffused layer by the planarization of an epitaxial film. A trench is formed in an alignment region of an N?-type layer formed on an N+-type substrate. This trench is used to leave voids after the formation of a P?-type epitaxial film on the N?-type layer. Then, the voids formed in the N?-type layer can be used as an alignment mark. Thus, such a semiconductor substrate can be used to provide an alignment in the subsequent step of manufacturing the semiconductor apparatus. Thus, the respective components constituting the semiconductor apparatus can be formed at desired positions accurately.

Abstract: A noble metal adsorption agent includes algae or residue of algae having an amino group as a functional group. A noble metal is retrieved by a method including: adsorbing the noble metal on the noble metal adsorption agent; and retrieving the noble metal. The noble metal is solved in a liquid. Thus, by using the noble metal adsorption agent, the noble metal is selectively retrieved.

Abstract: A semiconductor substrate is provided in which an alignment mark is formed that can be used for an alignment even after the formation of an impurity diffused layer by the planarization of an epitaxial film. A trench is formed in an alignment region of an N?-type layer formed on an N+-type substrate. This trench is used to leave voids after the formation of a P?-type epitaxial film on the N?-type layer. Then, the voids formed in the N?-type layer can be used as an alignment mark. Thus, such a semiconductor substrate can be used to provide an alignment in the subsequent step of manufacturing the semiconductor apparatus. Thus, the respective components constituting the semiconductor apparatus can be formed at desired positions accurately.

Abstract: A semiconductor substrate is provided in which an alignment mark is formed that can be used for an alignment even after the formation of an impurity diffused layer by the planarization of an epitaxial film. A trench is formed in an alignment region of an N?-type layer formed on an N+-type substrate. This trench is used to leave voids after the formation of a P?-type epitaxial film on the N?-type layer. Then, the voids formed in the N?-type layer can be used as an alignment mark. Thus, such a semiconductor substrate can be used to provide an alignment in the subsequent step of manufacturing the semiconductor apparatus. Thus, the respective components constituting the semiconductor apparatus can be formed at desired positions accurately.

Abstract: A semiconductor substrate preventing a void from being generated in an epitaxial film buried in a trench. An N-type first epitaxial film and first trenches are formed on an N+-type substrate body. A P-type second epitaxial film is buried in the first trenches. An N+-type third epitaxial film having the same composition as the first epitaxial film is formed on the first and second epitaxial films to form second trenches. A fourth epitaxial film is grown on the entire interior of the second trenches. The formation of the first and second trenches and the burying of the second and fourth epitaxial films are performed in a plurality of steps. Thus, the aspect ratio of the first and second trenches when the second and fourth epitaxial films are buried can be reduced. As a result, the second and fourth epitaxial films can be buried in the first and second trenches without causing a void.

Abstract: A semiconductor substrate is provided in which an alignment mark is formed that can be used for an alignment even after the formation of an impurity diffused layer by the planarization of an epitaxial film. A trench is formed in an alignment region of an N+-type substrate. This trench is used to leave voids after the formation of an N?-type layer. Then, the voids formed in the N+-type substrate can be used as an alignment mark. Thus, such a semiconductor substrate can be used to provide an alignment in the subsequent step of manufacturing the semiconductor apparatus. Thus, the respective components constituting the semiconductor apparatus can be formed at desired positions accurately.

Abstract: The present invention is a charged-particle gun (EG) in which a negative electrode (1) and a positive electrode (9) are integrated and assembled in advance, and which can be stored and transported in a state in which the negative electrode and the positive electrode are integrated, wherein the negative electrode and the positive electrode are connected by a conductor (11) during storage and transportation of the charged-particle gun. It is thereby possible to prevent an electrode tip of the charged-particle gun from being damaged by electrical discharge caused by static electricity during storage and transportation.

Abstract: Provided are an electron source which allows a high-angle current density operation even at a low extraction voltage, and reduces excess current that causes vacuum deterioration; and an electronic device using the electron source. The electron source has a cathode composed of single-crystal tungsten, and a diffusion source provided in the intermediate portion of the cathode. In the cathode, the angle between the axial direction of the cathode and <100> orientation of the cathode is adjusted so that electrons to be emitted from the vicinity of the boundary between surface and surface formed on the tip of the cathode, are emitted substantially parallel to the axis of the cathode. The electronic device is provided with the electron source.

Abstract: An electron emitting source capable of preventing increase in an inter-terminal resistance and a manufacturing method of the electron emitting source. The electron emitting source comprises an electron emitting chip made of rare-earth hexaboride, and a heater constituted by a carbonaceous member for holding and heating the electron emitting chip, wherein an electrically conductive substance is provided in a gap between the electron emitting chip and the heater.

Abstract: Provided are an electron source which allows a high-angle current density operation even at a low extraction voltage, and reduces excess current that causes vacuum deterioration; and an electronic device using the electron source. The electron source has a cathode composed of single-crystal tungsten, and a diffusion source provided in the intermediate portion of the cathode. In the cathode, the angle between the axial direction of the cathode and <100> orientation of the cathode is adjusted so that electrons to be emitted from the vicinity of the boundary between surface and surface formed on the tip of the cathode, are emitted substantially parallel to the axis of the cathode. The electronic device is provided with the electron source.