Abstract: A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.

Abstract: A method of manufacturing an electronic device including the following steps is provided herein. Providing a plurality of first electronic components on a first structure. Providing a plurality of receiving sites on a second structure. Performing a first transferring, including transferring at least portion of the plurality of first electronic components onto at least portion of the plurality of receiving sites on the second structure. Figuring out an empty receiving site from the plurality of receiving sites, wherein the plurality of first electronic components is absent at the empty receiving site. Performing a second transferring, including transferring a second electronic component onto the empty receiving site on the second structure. Providing a target substrate, and transferring the at least portion of the plurality of first electronic components and the second electronic component on the second structure onto the target substrate.

Abstract: An electronic device includes a substrate, a first organic portion, a first opening, a second organic portion, a second opening, a third organic portion and a first element. In a cross-section view, the first organic portion, the first opening, the second organic portion, the second opening and the third organic portion are disposed on the substrate and arranged in a first direction, the first opening is located between the first organic portion and the second organic portion, the second opening is located between the second organic portion and the third organic portion, the second organic portion is located between the first organic portion and the third organic portion, and a width of the first organic portion and a width of the third organic portion are less than a width of the second organic portion in the first direction. The first element is overlapped with the first opening.

Abstract: A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a plurality of semiconductor elements; performing a packaging process on the plurality of semiconductor elements to form a plurality of packaged semiconductor elements, wherein the packaging process includes disposing a plurality of filling material layers respectively on a sidewall of each of the plurality of semiconductor elements; providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes at least one first recess; and disposing the plurality of packaged semiconductor elements in the at least one first recess of each of the plurality of working areas through fluid transfer.

Abstract: An electronic device includes a first substrate, a second substrate, a circuit layer, a diode element, and a conductive wire. The first substrate has a first surface, a second surface opposite to the first surface, and a first side surface connected between the first surface and the second surface. The second substrate has a third surface, a fourth surface opposite to the third surface, and a second side surface connected between the third surface and the fourth surface, wherein the fourth surface is disposed away from the first surface. The circuit layer and the diode element are disposed on the first surface. The diode element and the conductive wire are electrically connected to the circuit layer. A first portion of the conductive wire is disposed on the first side surface, and a second portion of the conductive wire is disposed on the second side surface.

Abstract: A display device is provided, and includes a substrate and a first light shielding layer disposed on the substrate and defining a plurality of first openings. The display device includes a first light filter layer disposed in one of the first openings and a plurality of light-emitting diodes disposed on the substrate. The display device includes a second light shielding layer disposed between the substrate and the first light shielding layer, and having a plurality of second openings. The at least part of the light-emitting diodes are disposed in the second openings respectively. The display device also includes a spacer element disposed between the first light shielding layer and the second light shielding layer, wherein from a cross-section view, a shape of the spacer element is arc-shaped, and a shape of the second light shielding layer is arc-shaped.

Abstract: The present disclosure provides a display device and a method for operating the display device. The display device includes a night vision mode and a normal mode, and the display device includes a plurality of visible light display units and a plurality of invisible light display units. The method includes driving the visible light display units and turning off the invisible light display units in the normal mode, and driving the invisible light display units and turning off the visible light display units in the night vision mode.

Abstract: A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.

Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

Abstract: An electronic device includes a substrate, a spacer, a first element and a second element. The spacer is disposed on the substrate and has a first portion, a second portion, a first opening, a second opening and a third opening arranged in a first direction. In a cross-section view, the second opening is located between the first opening and the third opening, the first portion is located between the first opening and the second opening, and the second portion is located between the second opening and the third opening. A width of the first portion is less than a width of the second portion in the first direction, and an area of the second opening is different from an area of the first opening. The first element is overlapped with the first opening. The second element is overlapped with the third opening.

Abstract: An electronic device is provided. The electronic device includes a substrate and a first light-emitting element disposed on the substrate and configured to emit a first light of a first color. The first light-emitting element includes a first p-type semiconductor layer and a first ohmic contact electrode disposed between the substrate and the first p-type semiconductor layer. The electronic device also includes a second light-emitting element disposed on the substrate and configured to emit a second light of a second color different from the first color. The second light-emitting element includes a second p-type semiconductor layer and a second ohmic contact electrode disposed between the substrate and the second p-type semiconductor layer. The area of the first ohmic contact electrode and the area of the second ohmic contact electrode are different.

Abstract: An electronic device includes a first substrate, a circuit layer, a conductive wire, and an adhesive layer. The first substrate has a first surface, a second surface and a first side surface. The second surface is opposite to the first surface, the first side surface is located between the first surface and the second surface, and the first side surface connects the first surface and the second surface. The circuit layer is disposed on the first surface of the first substrate. The conductive wire is electrically connected to the circuit layer. The adhesive layer is disposed on the first surface and the circuit layer. The adhesive layer has a second side surface, and a first portion of the conductive wire is disposed on the first side surface of the first substrate and the second side surface of the adhesive layer.

Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

Abstract: A method for manufacturing an electronic device and a transferring head are provided. The method includes providing a plurality of microcomponents on a first substrate; providing a transferring head, wherein the transferring head includes a substrate and a head unit disposed on a side of the substrate, the head unit includes a layer, and the layer has a first portion and a second portion, wherein a thickness of the first portion is greater than a thickness of the second portion, and a difference between the thickness of the first portion and the thickness of the second portion is greater than or equal to 20 ?m and less than or equal to 70 ?m; contacting at least one microcomponent by a picking surface of the first portion; and transferring the microcomponent from the first substrate to a second substrate by the transferring head.

Abstract: The electronic device includes a first substrate, a second substrate, a first light emitting diode, a second light emitting diode, a first optical structure and a second optical structure. The second substrate is disposed opposite to the first substrate. The first light emitting diode and the second light emitting diode are disposed between the first substrate and the second substrate and adjacent to each other. The first optical structure and the second optical structure are disposed between the first substrate and the second substrate. A light emitted from the first light emitting diode passes through the first optical structure to provide a blue light, a light emitted from the second light emitting diode passes through the second optical structure to provide a light having a color different from blue, and the first optical structure comprises a scattering element.

Abstract: An electronic device is provided. The electronic device includes a substrate and another substrate disposed opposite to the substrate. The electronic device includes a first light-emitting element disposed on the substrate and configured to emit blue light under a first current density when the substrate provides a first current to the first light-emitting element. The electronic device includes a second light-emitting element disposed on the substrate and configured to emit green light or red light under a second current density when the substrate provides a second current to the second light-emitting element. The electronic device includes a protective layer disposed between the substrate and the another substrate and covering the first light-emitting element and the second light-emitting element. The electronic device includes an adhesive layer disposed between the protective layer and the another substrate.

Abstract: An electronic device including a first substrate body, a plurality of light-emitting diodes, a second substrate body, a first polymer element, and a second polymer element is provided. The first substrate body has a light-emitting region and a non-light-emitting region adjacent to the light-emitting region. The plurality of light-emitting diodes are disposed on the first substrate body. The second substrate body is disposed opposite to the first substrate body. The first polymer element is disposed between the plurality of light-emitting diodes and the second substrate body, and disposed in the light-emitting region. The second polymer element is disposed between the first substrate body and the second substrate body, and disposed in the non-light-emitting region. There is a distance between a top surface of the second polymer element and a bottom surface of the second substrate body, and the distance is greater than 0.

Abstract: Methods for manufacturing an electronic device and a transfer device are provided. The method for manufacturing the electronic device includes the following steps. A plurality of elements are provided, wherein each of the elements includes a first bonding pad. A substrate including a plurality of second bonding pads is provided. The plurality of elements are transferred to a transfer head. A portion of the elements is selectively transferred to the substrate, wherein the step of selectively transferring includes projecting a laser-light onto the portion of the elements so that the first bonding pad of the portion of the elements is bonded to at least one of the second bonding pads on the substrate.

Abstract: A light-emitting device includes a substrate, a light-emitting diode, a first layer, a color filter layer, and a second layer. The light-emitting diode is disposed on the substrate. The first layer is disposed on the substrate and has an opening. At least a portion of the light-emitting diode is disposed in the opening of the first layer. The color filter layer is disposed on the light-emitting diode. The second layer is disposed on the first layer and has an opening overlapped with the opening of the first layer. The second layer is configured to shield light emitted from the light-emitting diode. In the cross-sectional view of the light-emitting device, the minimum width of the opening of the first layer is less than the minimum width of the opening of the second layer.

Abstract: A manufacturing method of an electronic device includes: providing a first substrate, which has a base layer and a plurality of electronic components disposed on the base layer; adhering adhesive material to each of the plurality of electronic components; providing a target substrate, wherein the target substrate and the first substrate are separated from each other by a distance; and transferring at least part of the plurality of electronic components adhered with the adhesive material to the target substrate through a laser process, wherein at least part of the plurality of electronic components are attached to the target substrate via the adhesive material.