Abstract: An electronic device is provided. The electronic device includes a substrate and another substrate disposed opposite to the substrate. The electronic device includes a first light-emitting element disposed on the substrate and configured to emit blue light under a first current density when the substrate provides a first current to the first light-emitting element. The electronic device includes a second light-emitting element disposed on the substrate and configured to emit green light or red light under a second current density when the substrate provides a second current to the second light-emitting element. The electronic device includes a protective layer disposed between the substrate and the another substrate and covering the first light-emitting element and the second light-emitting element. The electronic device includes an adhesive layer disposed between the protective layer and the another substrate.

Abstract: A method of manufacturing an electronic device is disclosed. An electronic unit is provided. The electronic unit has a chip and at least one bonding pin. The electronic unit is mounted on the substrate through the at least one bonding pin, and an adhesive material is applied to a space between the chip and the substrate.

Abstract: The disclosure discloses a method for manufacturing light-emitting diode (LED) chips. The manufacturing method includes: providing a plurality of LED elements; randomly mixing the plurality of LED elements; performing a mesa process on the plurality of LED elements; and forming at least one pair of electrodes on the plurality of LED elements. An electronic device includes the LED chips.

Abstract: A display device includes a substrate, a first light-emitting unit, a first band-pass filter, and a first light conversion layer. The first light-emitting unit is disposed on the substrate and configured to emit a first light beam. The first band-pass filter is disposed on the first light-emitting unit and has a first cut-off wavelength. The first light conversion layer is disposed on the first band-pass filter and configured to convert the first light beam into a first conversion light beam. The first conversion light beam has a first peak wavelength. A difference between the first cut-off wavelength and the first peak wavelength is less than 10% of the first peak wavelength.

Abstract: An electronic device includes a first substrate, a circuit layer, a conductive wire, and an adhesive layer. The first substrate has a first surface, a second surface and a first side surface. The second surface is opposite to the first surface, the first side surface is located between the first surface and the second surface, and the first side surface connects the first surface and the second surface. The circuit layer is disposed on the first surface of the first substrate. The conductive wire is electrically connected to the circuit layer. The adhesive layer is disposed on the first surface and the circuit layer. The adhesive layer has a second side surface, and a first portion of the conductive wire is disposed on the first side surface of the first substrate and the second side surface of the adhesive layer.

Abstract: A method of manufacturing a display device is disclosed. A light emitting unit is provided. The light emitting unit has a chip and at least one bonding pin. The light emitting unit is mounted on the substrate through the at least one bonding pin, and an adhesive material is applied to a space between the chip and the substrate.

Abstract: A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.

Abstract: A method for driving an active-matrix pixel array is provided. The method includes the following steps: during a first period, inputting a data signal into a control terminal of a second transistor of the each of pixel circuits from a first terminal of a first transistor of the each of the pixel circuits; during a second period, turning-on a third transistor of the each of the pixel circuits, so that a current generated by according to the data signal flows through the light emitting unit of the each of the pixel circuits; and during a third period, inputting a reset signal into the control terminal of the second transistor of the each of the pixel circuits from the first terminal of the first transistor of the each of the pixel circuits.

Abstract: An electronic device is provided in this disclosure. In some embodiments, the electronic device includes a first substrate and a second substrate adjacent to the first substrate. In some embodiments, the electronic device includes a plurality of organic light emitting diodes, a filter layer, and a third substrate. At least a part of the plurality of organic light emitting diodes are disposed on the first substrate. The filter layer is disposed at least on the second substrate. The third substrate is disposed corresponding to the first substrate and the second substrate. The plurality of organic light emitting diodes and the filter layer are disposed under the third substrate.

Abstract: The present disclosure provides an electronic device including a driving circuit substrate, a plurality of chips, and a passivation layer. The driving circuit substrate includes a plurality of active elements. The chips are disposed on the driving circuit substrate and electrically connected to the driving circuit substrate. The passivation layer covers the plurality of chips and the driving circuit substrate. The passivation layer has a first part on one of the plurality of chips and a second part on a part of the driving circuit substrate, the second part is not overlapped with the plurality of chips, and a first thickness of the first part is less than a second thickness of the second part. The first space between adjacent two of the plurality of chips is different from a second space between another adjacent two of the plurality of chips.

Abstract: A display device is provided in an embodiment in the disclosure, including a subpixel region, a spacer, a light-emitting element, and a driving circuit. The spacer separates the subpixel region into a first region and a second region. The light-emitting element is located in at least one of the first region or the second region. The driving circuit is electrically connected to the first region and the second region, so as to drive the light-emitting element. A manufacturing method of the display device is also disclosed.

Abstract: The present disclosure provides a transferring head and a method for manufacturing an electronic device. The transferring head includes a substrate, a head unit, and a plurality of connecting elements. The head unit includes an electrode and a cantilever supporting the electrode. Two adjacent ones of the connecting elements are disposed between the substrate and the head unit. The electrode and a part of the cantilever are suspended over the substrate, and the cantilever is connected between one of the plurality of connecting elements and the electrode. The electrode is spaced apart from the plurality of connecting elements when viewed along a normal direction of the substrate.

Abstract: An electronic device includes a substrate, at least one light-emitting element, at least one first pad and at least one second pad. The light-emitting element is disposed on the substrate and includes a first light-emitting diode, a second light-emitting diode, a conductive layer, an organic layer and an insulation layer. The first light-emitting diode includes a first p-type electrode and a first n-type electrode. The second light-emitting diode includes a second p-type electrode and a second n-type electrode. The first pad and the second pad are respectively disposed on the substrate. The first pad is electrically connected to the first n-type electrode, and the second pad is electrically connected to the second p-type electrode. The conductive layer is electrically connected to the first p-type electrode and the second n-type electrode. One light emitting element only corresponds to one first pad and one second pad.

Abstract: A display device is provided. The display device includes a substrate and a plurality of pixels disposed on the substrate. One of the pixels includes a first light filter layer. The display device also includes a first light shielding layer, a second light shielding layer, and a plurality of light emitting diodes. The first light shielding layer defines a plurality of openings, wherein the first light filter layer is disposed in one of the openings. The second light shielding layer is disposed on the substrate and at least partially overlapped with the first light shielding layer. The second light shielding layer defines another plurality of openings, and the light emitting diodes are disposed in the another plurality of openings. In a direction parallel to an upper surface of the substrate, the second light shielding layer overlaps the plurality of light emitting diodes.

Abstract: An electronic device is provided. The electronic device includes: a substrate, a first light-emitting element, and a second light-emitting element. The first light-emitting element is disposed on the substrate and configured to emit a first color light under a first current density when the substrate provides a first current to the first light-emitting element. The second light-emitting element is disposed on the substrate and configured to emit a second color light under a second current density when the substrate provides a second current to the second light-emitting element. The first current is equal to the second current, and the first current density is different from the second current density.

Abstract: An electronic device and a manufacturing method thereof are disclosed. The electronic device includes a substrate, an electronic element, a barrier layer, a light absorbing layer, and a filter layer. The electronic element is disposed on the substrate. The barrier layer is disposed on the substrate and surrounds a side surface of the electronic element. The light absorbing layer is disposed on the barrier layer. The filter layer is disposed on the electronic element.

Abstract: An electronic device is provided in this disclosure. In some embodiments, the electronic device includes two display panels, a first filling element, and a second filling element. The two display panels adjoin each other. The first filling element and the second filling element are disposed between the two display panels, and a material of the first filling element is different from a material of the second filling element. In some embodiments, the electronic device includes a protection substrate, two light emitting plates, and a filling element. The two light emitting plates adjoin each other. The protection substrate is disposed corresponding to the two light emitting plates, and the two light emitting plates emit light towards the protection substrate. The filling element is disposed between the two light emitting plates.

Abstract: A method for manufacturing a light emitting device is provided. The method for manufacturing the light emitting device includes: providing a substrate with light emitting units disposed thereon; attaching the light emitting units to a carrier; removing the substrate; and transferring a portion of the light emitting units from the carrier to a driving substrate.

Abstract: An electronic device including a light emitting element, a wavelength conversion layer, a conductive wire and a wavelength selection layer is provided by the present disclosure. The light emitting element is configured to emit a light. The wavelength conversion layer is configured to convert the light. The conductive wire is electrically connected to the light emitting element. The wavelength selection layer is disposed between the conductive wire and the wavelength conversion layer, wherein the conductive wire is cured by an energy beam, and the wavelength selection layer is configured to block the energy beam.

Abstract: The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting diodes, a second substrate, a transparent material layer, and a sealing material. The first substrate comprises a first substrate body. The plurality of light-emitting diodes are disposed on the first substrate body. The second substrate is disposed opposite to the first substrate, and comprises a second substrate body. The transparent material layer is disposed between the first substrate and the second substrate. The sealing material is disposed between the first substrate and the second substrate and surrounds the transparent material layer. A distance between a bottom surface of the sealing material and a top surface of the first substrate body is less than a distance between a top surface of the sealing material and a bottom surface of the second substrate body.