Abstract: An electronic device including a driving circuit substrate, a plurality of light emitting units, and a first passivation layer is provided. The driving circuit substrate includes a plurality of active elements. The light emitting units are disposed on the driving circuit substrate and electrically connected to the driving circuit substrate, and each of the plurality of light emitting units is five surfaces light emitting type. The first passivation layer covers the light emitting units and the driving circuit substrate for protecting the light emitting units. One of the active elements provides a current to a corresponding one of the light emitting units, such that lighting efficiency of the corresponding one of the light emitting units is ranged from 70% to 100%. The current includes a plurality of pulse currents spaced apart from each other, and time widths of the pulse currents are the same.

Abstract: A manufacturing method includes providing a first substrate including a circuit layer and an electronic element disposed on the circuit layer, providing a second substrate, bonding the first substrate and the second substrate to form an electronic module, cutting the electronic module, forming a wire on a first surface exposed after cutting the electronic module and on a second surface of the electronic module, wherein the first surface is adjacent to the second surface and the wire is electrically connected to the circuit layer, and disposing a driving element on the second surface of the electronic module to be electrically connected to the wire.

Abstract: The display device includes a first substrate, a second substrate, a red filter layer, a green filter layer, a blue filter layer, a first light emitting diode and a second light emitting diode. The red filter layer, the green filter layer and the blue filter layer are disposed between the first substrate and the second substrate. A portion of the red filter layer, a portion of the green filter layer and a portion of the blue filter layer are stacked with each other to form a light blocking structure. The first light emitting diode and the second light emitting diode are disposed between the first substrate and the second substrate and adjacent to each other. An orthographic projection of the light blocking structure on the second substrate is located between orthographic projections of the first light emitting diode and the second light emitting diode on the second substrate.

Abstract: A method of manufacturing an electronic device includes the steps of providing a conductive carrier with at least one electronic element disposed thereon, picking up the at least one electronic element, setting the conductive carrier to have a ground voltage at least in the step of picking up the at least one electronic element, and transferring the at least one electronic element to a target substrate.

Abstract: The present disclosure provides a method for manufacturing an electronic device. First, a plurality of light-emitting elements is provided on a first substrate. Then, at least one of the plurality of light-emitting elements is transferred from the first substrate to a second substrate by a transferring head. The transferring head includes an electrode and a cantilever supporting the electrode, and the cantilever includes a U-shaped portion.

Abstract: The disclosure provides a display device and a manufacturing method thereof. The display device includes a substrate, a spacer layer, a light emitting element, and an optical layer. The spacer layer is disposed on the substrate and includes openings. The light emitting element and the optical layer are disposed in the opening.

Abstract: The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting dies, a transparent material layer, a sealing material, and a second substrate. The plurality of light-emitting dies are disposed on the first substrate. The transparent material layer is disposed on the first substrate. The sealing material is disposed on the first substrate and surrounds the transparent material layer. The second substrate is adhered to the first substrate through the transparent material layer and the sealing material.

Abstract: The display device includes a first unit, and a plurality of second units. The first unit includes a first substrate, and a light blocking structure disposed on the first substrate. The light blocking structure has a plurality of first openings. Each one of the second units includes a second substrate, and a plurality of light emitting diodes disposed on the second substrate. The light emitting diodes correspond to a portion of the first openings. The second units are adhered to the first unit.

Abstract: An electronic device is provided, which is for coupling to another electronic device in a side-by-side manner, and the electronic device includes a substrate, a first thermal dissipation sheet and a thermal dissipation element. The substrate includes a first surface and a second surface. The first thermal dissipation sheet is disposed on the first surface. The thermal dissipation element is disposed on the substrate. The first thermal dissipation sheet is disposed between the thermal dissipation element and the substrate, and the thermal dissipation element at least partially overlaps the first thermal dissipation sheet.

Abstract: A display panel including a first current source and a first pixel unit is provided. The first pixel unit includes a first switch and a first light-emitting diode. The first switch is coupled to the first current source and receives a first scan signal. When the first scan signal is enabled, the first switch is turned on and receives a first current provided by the first current source. The first light-emitting diode is coupled to the first switch. When the first switch is turned on, the first current passes through the first light-emitting diode to turn on the first light-emitting diode.

Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.

Abstract: A display device is provided. The display device includes an auxiliary substrate, a display substrate, and a circuit board. The auxiliary substrate includes an auxiliary circuit. The display substrate is disposed on the auxiliary substrate. The display substrate includes a circuit. The circuit board is electrically connected to the auxiliary substrate. The circuit of the display substrate is electrically connected to the auxiliary circuit through a first conductive via, and the circuit board provides a signal to the auxiliary circuit.

Abstract: A tiled display device is provided. The tiled display device includes a first panel and a second panel adjacent to the first panel. The first panel includes a first pixel unit, a second pixel unit and a third pixel unit. The second panel includes a fourth pixel unit, a fifth pixel unit, a sixth pixel unit, a seventh pixel unit, an eighth pixel unit and a ninth pixel unit. The second pixel unit, the fifth pixel unit, and the eighth pixel unit are arranged in a column and have a first color. The first pixel unit, the sixth pixel unit, and the seventh pixel unit are arranged in a column and have a second color. The third pixel unit, the fourth pixel unit and the ninth pixel unit are arranged in a column and have a third color.

Abstract: An optical substrate and a manufacturing method thereof are provided. The optical substrate includes a base layer, a bank layer, a wavelength conversion unit, and a first encapsulating layer. The bank layer is disposed on the base layer and includes a first bank portion separated from an edge of the base layer. The wavelength conversion unit is disposed on the base layer and is adjacent to a side of the first bank portion away from the edge. The first encapsulating layer is disposed on the bank layer, the wavelength conversion unit, and a portion of the base layer not covered by the bank layer and the wavelength conversion unit. In the optical substrate and the manufacturing method thereof provided by the embodiments of the disclosure, infiltration of water vapor may be reduced or reliability may be improved.

Abstract: A display device and a splicing display device are provided. The display device includes a substrate layer, a capping layer, and a light-emitting element. The capping layer is disposed on the substrate layer and has a light-exiting region. The light-emitting element is disposed on the substrate layer and emits light toward the light-exiting region of the capping layer. A distance from the light-exiting region to the side surface of the capping layer is defined as D. A thickness of the capping layer is defined as T. A refractive index of the capping layer is defined as n1. D, T, and n1 meet the following equation: Tan?1(D/T)>Sin?1(1/n1). The splicing display device includes a plurality of display devices, and the display devices are spliced together. In the display device and the splicing display device, optical defects such as a shining edge, a ghost image, or a shadow effect are reduced.

Abstract: A display device includes a substrate, a light-emitting element, and a transistor. The substrate has a top surface. The light-emitting element is disposed on the substrate, and includes a first electrode and a second electrode. The transistor is disposed on the substrate and electrically connected to the light-emitting element. The transistor includes a gate electrode and a semiconductor layer. The semiconductor layer includes an overlapping portion overlapped with the gate electrode. The first electrode and the second electrode of the light-emitting element do not overlap with the overlapping portion along a direction perpendicular to the top surface of the substrate.

Abstract: A display device is provided. The display device includes a substrate and a plurality of pixels disposed on the substrate. One of the pixels includes a first light filter layer. The display device also includes a first light shielding layer, a second light shielding layer, and a plurality of light emitting diodes. The first light shielding layer defines a plurality of openings, wherein the first light filter layer is disposed in one of the openings. The second light shielding layer is disposed on the substrate and at least partially overlapped with the first light shielding layer. The second light shielding layer defines another plurality of openings, and the light emitting diodes are disposed in the another plurality of openings. In a direction parallel to an upper surface of the substrate, the second light shielding layer overlaps the plurality of light emitting diodes.

Abstract: An electronic device includes multiple light-emitting boards, a second circuit board, a control board, and multiple conductive members. Each light-emitting board includes a first circuit board and multiple light-emitting elements. Multiple light-emitting elements are disposed on the first circuit board and are electrically connected to the first circuit board. Multiple light-emitting boards are disposed on the second circuit board and are electrically connected to the second circuit board. The control board is disposed on the second circuit board. Multiple conductive members are disposed on at least one side of the second circuit board. The control board is electrically connected to the second circuit board through multiple conductive members.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.