Abstract: A display device and a splicing display device are provided. The display device includes a substrate layer, a capping layer, and a light-emitting element. The capping layer is disposed on the substrate layer and has a light-exiting region. The light-emitting element is disposed on the substrate layer and emits light toward the light-exiting region of the capping layer. A distance from the light-exiting region to the side surface of the capping layer is defined as D. A thickness of the capping layer is defined as T. A refractive index of the capping layer is defined as n1. D, T, and n1 meet the following equation: Tan?1(D/T)>Sin?1(1/n1). The splicing display device includes a plurality of display devices, and the display devices are spliced together. In the display device and the splicing display device, optical defects such as a shining edge, a ghost image, or a shadow effect are reduced.

Abstract: A display device includes a substrate, a light-emitting element, and a transistor. The substrate has a top surface. The light-emitting element is disposed on the substrate, and includes a first electrode and a second electrode. The transistor is disposed on the substrate and electrically connected to the light-emitting element. The transistor includes a gate electrode and a semiconductor layer. The semiconductor layer includes an overlapping portion overlapped with the gate electrode. The first electrode and the second electrode of the light-emitting element do not overlap with the overlapping portion along a direction perpendicular to the top surface of the substrate.

Abstract: A display device is provided. The display device includes a substrate and a plurality of pixels disposed on the substrate. One of the pixels includes a first light filter layer. The display device also includes a first light shielding layer, a second light shielding layer, and a plurality of light emitting diodes. The first light shielding layer defines a plurality of openings, wherein the first light filter layer is disposed in one of the openings. The second light shielding layer is disposed on the substrate and at least partially overlapped with the first light shielding layer. The second light shielding layer defines another plurality of openings, and the light emitting diodes are disposed in the another plurality of openings. In a direction parallel to an upper surface of the substrate, the second light shielding layer overlaps the plurality of light emitting diodes.

Abstract: An electronic device includes multiple light-emitting boards, a second circuit board, a control board, and multiple conductive members. Each light-emitting board includes a first circuit board and multiple light-emitting elements. Multiple light-emitting elements are disposed on the first circuit board and are electrically connected to the first circuit board. Multiple light-emitting boards are disposed on the second circuit board and are electrically connected to the second circuit board. The control board is disposed on the second circuit board. Multiple conductive members are disposed on at least one side of the second circuit board. The control board is electrically connected to the second circuit board through multiple conductive members.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: The disclosure discloses a method for manufacturing light-emitting diode (LED) chips. The manufacturing method includes: providing a plurality of LED elements; randomly mixing the plurality of LED elements; performing a mesa process on the plurality of LED elements; and forming at least one pair of electrodes on the plurality of LED elements. An electronic device includes the LED chips.

Abstract: A display device is provided. The display device includes a substrate and a plurality of pixels disposed on the substrate. One of the pixels includes a color conversion layer, a dielectric layer disposed on the color conversion layer, and a light filter layer disposed on the dielectric layer. The display device also includes a first light shielding layer, a second light shielding layer, and a plurality of light emitting diodes. The first light shielding layer defines a plurality of openings, wherein at least one of the color conversion layer, the dielectric layer and the light filter layer is disposed in the openings. The second light shielding layer is disposed on the substrate and at least partially overlapped with the first light shielding layer. The second light shielding layer defines another plurality of openings, and the light emitting diodes are disposed in the another openings.

Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

Abstract: A display device includes a substrate, a first signal line disposed on the substrate, and a first pixel including a first transistor having a gate electrode, a source electrode and a drain electrode, wherein the source electrode is electrically connected to the first signal line. The display device includes a fan-out line electrically connected to the first signal line, wherein the fan-out line partially overlaps the first pixel and is formed in a layer different from layers of the gate electrode, the source electrode and the drain electrode.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: The disclosure discloses a method for manufacturing light-emitting diode (LED) chips. The manufacturing method includes: providing a plurality of LED elements; randomly mixing the plurality of LED elements; performing a mesa process on the plurality of LED elements; and forming at least one pair of electrodes on the plurality of LED elements. An electronic device includes the LED chips.

Abstract: A method of manufacturing an electronic device is disclosed. An electronic unit is provided. The electronic unit has a chip and at least one bonding pin. The electronic unit is mounted on the substrate through the at least one bonding pin, and an adhesive material is applied to a space between the chip and the substrate.

Abstract: A method of manufacturing a display device is disclosed. A light emitting unit is provided. The light emitting unit has a chip and at least one bonding pin. The light emitting unit is mounted on the substrate through the at least one bonding pin, and an adhesive material is applied to a space between the chip and the substrate.

Abstract: A tiled display device includes a first panel. The first panel includes a first lower substrate and a first upper substrate disposed opposite to the first lower substrate. The first upper substrate includes a first upper surface, a first lower surface and a first side surface located between the first upper surface and the first lower surface. The tiled display device further includes a second panel disposed adjacent to the first panel. The second panel includes a second lower substrate and a second upper substrate disposed opposite to the second lower substrate. The second upper substrate includes a second upper surface, a second lower surface and a second side surface located between the second upper surface and the second lower surface. The second side surface is disposed adjacent to the first side surface.

Abstract: The disclosure provides a method for manufacturing a light-emitting element, including the following steps. A light-emitting diode is provided. An energy beam is applied to process a surface of the light-emitting diode, where a power density of the energy beam is greater than 0 mJ/cm2 and less than or equal to 2000 mJ/cm2. The light-emitting element manufactured using the method for manufacturing a light-emitting element disclosed in embodiments of the disclosure may improve light extraction efficiency, may have a relatively good light-emitting effect, and may be electrically connected to a drive circuit to constitute an electronic device.

Abstract: An electronic device including a driving circuit substrate, a plurality of light emitting units, and a first passivation layer is provided. The driving circuit substrate includes a plurality of active elements. The light emitting units are disposed on the driving circuit substrate and electrically connected to the driving circuit substrate, and each of the plurality of light emitting units is five surfaces light emitting type. The first passivation layer covers the light emitting units and the driving circuit substrate for protecting the light emitting units. One of the active elements provides a current to a corresponding one of the light emitting units, such that lighting efficiency of the corresponding one of the light emitting units is ranged from 70% to 100%. The current includes a plurality of pulse currents spaced apart from each other, and time widths of the pulse currents are the same.

Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: 0 ? ? ? T ? ? 1 T ? ? 2 ? A ? ( T ) ? dT - ? T ? ? 1 T ? ? 3 ? E ? ( T ) ? dT ? ? < 0.01 wherein A(T) is the coefficient of thermal expansion of the transfer head, E(T) is the coefficient of thermal expansion of the substrate, T1 is room temperature, T2 is the temperature of the transfer head, and T3 is the temperature of the substrate.

Abstract: An optical device includes two substrates disposed opposite to each other. Each of the substrates has a surrounding edge and a side surface at the surrounding edge. A wavelength conversion layer is disposed between the two substrates. A light emitting unit corresponding to the wavelength conversion layer is disposed between the corresponding wavelength conversion layer and one of the two substrates. A sealing element is disposed along the edges and in contact with the side surfaces of the two substrates, and seals the wavelength conversion layer and the light emitting unit located between the two substrates.

Abstract: An electronic device is provided in this disclosure. In some embodiments, the electronic device includes two display panels, a first filling element, and a second filling element. The two display panels adjoin each other. The first filling element and the second filling element are disposed between the two display panels, and a material of the first filling element is different from a material of the second filling element. In some embodiments, the electronic device includes a protection substrate, two light emitting plates, and a filling element. The two light emitting plates adjoin each other. The protection substrate is disposed corresponding to the two light emitting plates, and the two light emitting plates emit light towards the protection substrate. The filling element is disposed between the two light emitting plates.