Abstract: A display device is provided. The display device includes a substrate and a plurality of pixels disposed on the substrate. One of the pixels includes a color conversion layer, a dielectric layer disposed on the color conversion layer, and a light filter layer disposed on the dielectric layer. The display device also includes a first light shielding layer, a second light shielding layer, and a plurality of light emitting diodes. The first light shielding layer defines a plurality of openings, wherein at least one of the color conversion layer, the dielectric layer and the light filter layer is disposed in the openings. The second light shielding layer is disposed on the substrate and at least partially overlapped with the first light shielding layer. The second light shielding layer defines another plurality of openings, and the light emitting diodes are disposed in the another openings.

Abstract: A method for expressing a grey level of a sub-pixel in a display device includes providing at least one light emitting unit in the sub-pixel, the light emitting unit including a plurality of illumination portions, and illuminating at least one of the plurality of illumination portions to express the grey level of the sub-pixel, and each illumination portion is illuminated independently.

Abstract: An optical device includes two substrates disposed opposite to each other. Each of the substrates has a surrounding edge and a side surface at the surrounding edge. A wavelength conversion layer is disposed between the two substrates. A light emitting unit corresponding to the wavelength conversion layer is disposed between the corresponding wavelength conversion layer and one of the two substrates. A sealing element is disposed along the edges and in contact with the side surfaces of the two substrates, and seals the wavelength conversion layer and the light emitting unit located between the two substrates.

Abstract: The disclosure provides an electronic device and a light-emitting element. The electronic device includes a substrate and at least one light-emitting element. The at least one light-emitting element is disposed on the substrate. The at least one light-emitting element includes a first light-emitting diode, a second light-emitting diode, an organic layer, and a conductive layer. The organic layer is disposed between the first light-emitting diode and the conductive layer. The organic layer includes at least two through holes. The conductive layer is electrically connected to the first light-emitting diode and the second light-emitting diode through the at least two through holes.

Abstract: The disclosure provides a method for manufacturing a light-emitting element, including the following steps. A light-emitting diode is provided. An energy beam is applied to process a surface of the light-emitting diode, where a power density of the energy beam is greater than 0 mJ/cm2 and less than or equal to 2000 mJ/cm2. The light-emitting element manufactured using the method for manufacturing a light-emitting element disclosed in embodiments of the disclosure may improve light extraction efficiency, may have a relatively good light-emitting effect, and may be electrically connected to a drive circuit to constitute an electronic device.

Abstract: The present disclosure provides a method for manufacturing an electronic device. First, a plurality of light-emitting elements is provided on a first substrate. Then, at least one of the plurality of light-emitting elements is transferred from the first substrate to a second substrate by a transferring head. The transferring head includes an electrode and a cantilever supporting the electrode, and the cantilever includes a U-shaped portion.

Abstract: An electronic device is provided. The electronic device includes: a substrate, a first light-emitting element, and a second light-emitting element. The first light-emitting element is disposed on the substrate and configured to emit a first color light under a first current density when the substrate provides a first current to the first light-emitting element. The second light-emitting element is disposed on the substrate and configured to emit a second color light under a second current density when the substrate provides a second current to the second light-emitting element. The first current is equal to the second current, and the first current density is different from the second current density.

Abstract: A tiled display device includes a first panel. The first panel includes a first lower substrate and a first upper substrate disposed opposite to the first lower substrate. The first upper substrate includes a first upper surface, a first lower surface and a first side surface located between the first upper surface and the first lower surface. The tiled display device further includes a second panel disposed adjacent to the first panel. The second panel includes a second lower substrate and a second upper substrate disposed opposite to the second lower substrate. The second upper substrate includes a second upper surface, a second lower surface and a second side surface located between the second upper surface and the second lower surface. The second side surface is disposed adjacent to the first side surface.

Abstract: A display device is provided. The display device includes a light-emitting unit. The light-emitting unit includes a light-emitting part, wherein a light extraction structure is disposed on a first surface of the light-emitting part. The light-emitting unit also includes a connective part disposed on a second surface opposite to the first surface of the light-emitting part. The light-emitting unit further includes a protective part surrounding the light-emitting part and the connective part. In addition, the display device includes a substrate having a plurality of active elements and at least one bonding pad, wherein the bonding pad is electrically connected to the corresponding connective part of the light-emitting unit. The roughness of the light extraction structure is greater than or equal to 0.2 ?m and less than or equal to 5 ?m.

Abstract: A fabricating method for a display apparatus is provided. The fabricating method for the display apparatus includes the following steps. An array substrate having a first electrode and a second electrode is provided. A first light emitting diode is heated to soften a first bump between the first electrode and the first light emitting diode, the first light emitting diode is bonded onto the first electrode by the first bump. The first light emitting diode and a second light emitting diode are heated to soften the first bump and a second bump between the second electrode and the second light emitting diode, the second light emitting diode is bonded onto the second electrode by the second bump, and the first light emitting diode and the second light emitting diode are pressed.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: Q?|?T1T2A(T)dT??T1T3E(T)dT|<0.01, wherein A(T) is the coefficient of thermal expansion of the transfer head, E(T) is the coefficient of thermal expansion of the substrate, T1 is room temperature, T2 is the temperature of the transfer head, and T3 is the temperature of the substrate.

Abstract: A display device is provided. The display device includes a thin-film transistor substrate, a conductive pad disposed on the thin-film transistor substrate, and an adhesion film disposed on the conductive pad. The adhesion film includes a plurality of conductive particles. The display device also includes a light-emitting component disposed on the adhesion film. The light-emitting component includes a connection feature. The display device also includes a protection layer partially surrounding the light-emitting component. The connection feature of the light-emitting component has a lower portion not surrounded by the protection layer. The adhesion film has a thickness of T, one of the plurality of conductive particles has a diameter of d, the lower portion of the connection feature has a thickness of t, and 0<t?T?d.

Abstract: An electronic device has a light emitting unit driving circuit. The driving circuit has a first driving transistor, a second driving transistor, and a light emitting unit. The first driving transistor has a first channel width and a first channel length and is used to provide a first current. The second driving transistor has a second channel width and a second channel length and is used to provide a second current. The light emitting unit is coupled to the first driving transistor and the second driving transistor for receiving at least one of the first current and the second current to emit light. A ratio of the first channel width to the first channel length is greater than a ratio of the second channel width to the second channel length.

Abstract: A display device is provided. The display device includes a light-emitting unit. The light-emitting unit includes a light-emitting part, wherein a light extraction structure is disposed on a first surface of the light-emitting part. The light-emitting unit also includes a connective part disposed on a second surface opposite to the first surface of the light-emitting part. The light-emitting unit further includes a protective part surrounding the light-emitting part and the connective part. In addition, the display device includes a substrate having a plurality of active elements and at least one bonding pad, wherein the bonding pad is electrically connected to the corresponding connective part of the light-emitting unit. The roughness of the light extraction structure is greater than or equal to 0.2 ?m and less than or equal to 5 ?m.

Abstract: The disclosure provides a display apparatus. The display apparatus of the disclosure includes a substrate having a plurality of pixel regions, a plurality of active elements, a plurality of first signal lines and second signal lines, a plurality of ground signal lines and a plurality of light emitting diodes (LEDs). The plurality of ground signal lines are disposed on the substrate and arranged to alternate with the first signal lines. At least one LED has first and second electrodes. The first electrode of at least one LED is electrically connected with a corresponding active element. A second electrode of at least one LED is electrically connected with a corresponding ground signal line. At least two LEDs disposed in an identical pixel region is electrically connected with an identical ground signal line between two first signal lines adjacent to each other. The display apparatus of the disclosure has high resolution.

Abstract: A display device is provided. The display device includes a plurality of pixels. At least one of the pixels includes a semiconductor device having a light-emitting area, a first light conversion layer disposed on the semiconductor device and a first scattering layer disposed on the semiconductor device. The first scattering layer is disposed on the first light conversion layer.

Abstract: A display device is provided that includes a plurality of sub-pixels. Each sub-pixel includes a light-emitting unit having an illumination area, wherein the illumination area is divided into a plurality of illumination regions, and each illumination region is configured to be illuminated independently. The light-emitting unit emits a light, and a gray level of the light is determined according to the total area of the illumination regions being illuminated.

Abstract: A display panel including a first substrate, a second substrate and a display medium is provided. The first substrate includes a base substrate, a gate, an active layer, a source, a drain, and a shielding structure. The gate is disposed on the base substrate. The active layer is electrically insulated from and disposed correspondingly to the gate. The source and the drain are electrically connected to the active layer. The shielding structure is disposed on the active layer and overlaps with at least part of the active layer. The shielding structure includes a metal layer and a metal oxide or metal nitride layer. The shielding structure is electrically insulated from the source. The display medium is disposed between the first substrate and the second substrate.

Abstract: An electronic device including a driving circuit substrate and a plurality of light emitting units is provided. The driving circuit substrate includes a plurality of active elements, the light emitting units are disposed on the driving circuit substrate, each of the light emitting units is electrically connected to the corresponding active element, wherein one of the active elements provides a first current to the corresponding light emitting unit, such that lighting efficiency of the light emitting units are ranged from 70% to 100%.