Abstract: A pharmaceutical composition comprises a taxane (e.g., paclitaxel, docetaxel, cabazitaxel, larotaxel, ortataxel, and/or tesetaxel) in a mixture of first and second surfactants. The absorption of the taxane is increased from the pharmaceutical composition is greater than the sum of the absorption of docetaxel from either the first or the second surfactant. The increase in absorption is especially enhanced when the ratio of the first surfactant to the second surfactant in the pharmaceutical composition is between 60:40 and 85:15 by weight, and the total surfactant weight does not exceed 98% of the total weight. Polysorbate 80, polysorbate 20, and caprylocaproyl polyoxylglycerides serve as suitable first surfactants, and polysorbate 80 or polyethyoxylated castor oil serve as suitable second surfactants. The stability of the pharmaceutical composition may be enhanced by further including a stabilizer (e.g., citric acid and/or ascorbic acid).

Abstract: Systems and methods of generating a security key for an integrated circuit device include generating a plurality of key bits with a physically unclonable function (PUF) device. The PUF can include a random number generator that can create random bits. The random bits may be stored in a nonvolatile memory. The number of random bits stored in the nonvolatile memory allows for a plurality of challenge and response interactions to obtain a plurality of security keys from the PUF.

Abstract: An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.

Abstract: A reticle enclosure includes a base including a first surface, a cover including a second surface and coupled to the base with the first surface facing the second surface. The base and the cover form an internal space that includes a reticle. The reticle enclosure includes restraining mechanisms arranged in the internal space and for securing the reticle, and structures disposed adjacent the reticle in the internal space. The structures enclose the reticle at least partially, and limit passage of contaminants between the internal space and an external environment of the reticle enclosure. The structures include barriers disposed on the first and second surfaces. In other examples, a padding is installed in gaps between the barriers and the first and second surfaces. In other examples, the structures include wall structures disposed on the first and second surfaces and between the restraining mechanisms.

Abstract: A sealing mechanism is provided, including a housing, a groove, and a sealing element. The housing includes a first member and a second member, and the groove is formed between the first and second members. The sealing element is formed in the groove by Low Pressure Molding (LPM) and surrounds at least one of the first and second members.

Abstract: An integrated circuit (IC) die includes first through third adjacent rows of through-silicon vias (TSVs), and first and second adjacent rows of memory macros. TSVs of the first row of TSVs extend through and are electrically isolated from memory macros of the first row of memory macros. TSVs of the third row of TSVs extend through and are electrically isolated from memory macros of the second row of memory macros.

Abstract: A probe card device and a transmission structure are provided. The transmission structure includes a supporting layer, a plurality of metal conductors spaced apart from each other and slantingly inserted into the supporting layer, and an insulating resilient layer formed on the supporting layer. Each of the metal conductors includes a positioning segment held in the supporting layer, a connecting segment and an embedded segment respectively extending from two ends of the positioning segment, and an exposed segment extending from the embedded segment. Each of the embedded segments is embedded and fixed in the insulating resilient layer, and each of the exposed segments protrudes from the insulating resilient layer. When any one of the exposed segments is pressed by an external force, the insulating resilient layer is configured to absorb the external force through the corresponding embedded segment so as to have a deformation providing a stroke distance.

Abstract: A liquid-cooling device includes multiple water blocks and at least one connection tube. Each of the water blocks has a water incoming end, a water outgoing end and a water-receiving space in communication with the water incoming end and the water outgoing end. The connection tube is disposed between each two water blocks. Two ends of the connection tube are respectively connected with the water incoming end of one of the two water blocks and the water outgoing end of the other water block, whereby the water-receiving spaces of the two water blocks communicate with each other via the connection tube. The connection tube has at least one bellows section between two ends of the connection tube. The liquid-cooling device solves the problems of the conventional liquid-cooling device that when the water block is welded, thermal deformation is produced to cause tolerance and the manufacturing cost is higher.

Abstract: A chuck vacuum line of a semiconductor processing tool includes a first portion that penetrates a sidewall of a main pumping line of the semiconductor processing tool. The chuck vacuum line includes a second portion that is substantially parallel to the sidewall of the main pumping line and to a direction of flow in the main pumping line. A size of the second portion increases between an inlet end of the second portion and an outlet end of the second portion along the direction of flow in the main pumping line.

Abstract: A semiconductor device including a substrate, a low-k dielectric layer, a cap layer, and a conductive layer is provided. The low-k dielectric layer is disposed over the substrate. The cap layer is disposed on the low-k dielectric layer, wherein a carbon atom content of the cap layer is greater than a carbon atom content of the low-k dielectric layer. The conductive layer is disposed in the cap layer and the low-k dielectric layer.

Abstract: A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.

Abstract: Disclosed herein are related to an integrated circuit including a semiconductor layer. In one aspect, the semiconductor layer includes a first region, a second region, and a third region. The first region may include a circuit array, and the second region may include a set of interface circuits to operate the circuit array. A side of the first region may face a first side of the second region along a first direction. The third region may include a set of header circuits to provide power to the set of interface circuits through metal rails extending along a second direction. A side of the third region may face a second side of the second region along the second direction. In one aspect, the first side extending along the second direction is shorter than the second side extending along the first direction, and the metal rails are shorter than the first side.

Abstract: According to one embodiment of the present application, a touch sensitive processing method is provided. The touch sensitive processing method, comprising: mutual capacitance sensing via touch electrodes of a touch panel to get one or more continuous images of the touch panel; calculating a center of circle corresponding to a knob placed on the touch panel according to the one or more continuous images; and when the center of circle is detected, setting up a rejection area corresponding to the center of circle.

Abstract: The invention provides a voltage doubler switched capacitor circuit capable of detecting short circuit of flying capacitor and a detection method thereof. The voltage doubler switched capacitor circuit provides a way to connect the flying capacitor in parallel to the charging path, and calculate whether it is charged to a predetermined voltage in the designed charging time interval, and then it can effectively detect whether the flying capacitor is short-circuited.

Abstract: A color fixing combination for contact lens with pearlescent is provided, including a pearlescent powder and an adjuvant. The adjuvant includes at least two of the following: alcohols, amines, ketones, alkenes, esters, resins, polyamides, celluloses, polyacids, ammonium salts, phosphoric acids, alkene acids, or silanes, so that the pearlescent powder stably adheres to the lens to form a pattern layer.

Abstract: A chuck vacuum line of a semiconductor processing tool includes a first portion that penetrates a sidewall of a main pumping line of the semiconductor processing tool. The chuck vacuum line includes a second portion that is substantially parallel to the sidewall of the main pumping line and to a direction of flow in the main pumping line. A size of the second portion increases between an inlet end of the second portion and an outlet end of the second portion along the direction of flow in the main pumping line.

Abstract: A display, including a carrying main body, a flexible carrier film, a double-sided tape, and an adhesive layer, is provided. The flexible carrier film includes a first bonding section and a second bonding section respectively disposed on two opposite sides of the carrying main body, and a bending section connected between the first bonding section and the second bonding section. The flexible carrier film has an inner surface and an outer surface opposite to each other. The inner surface has at least one first groove at the bending section. The flexible carrier film has a display layer thereon. At least a part of the display layer is connected to the outer surface at the second bonding section. The double-sided tape is disposed between the first bonding section and the carrying main body. The adhesive layer is disposed between the inner surface and the carrying main body at the bending section.

Abstract: Methods for improving bioavailability and solubility of taxanes provided as solids in compressed tablet form are described. Compressed tablets containing a high proportion of a taxane are prepared using an amorphous solid dispersion in combination with a polymer carrier and a surfactant. Oral bioavailability of taxanes following ingestion is high, and supersaturating concentrations of the taxane are maintained in gastric fluids for an extended period of time.

Abstract: A spherical display device includes an arc substrate and a plurality of display units. The arc substrate has a convex surface and a concave surface opposite to the convex surface. The plurality of display units is disposed on the concave surface of the arc substrate, and a perpendicular distance from the display unit to a central axis of the arc substrate ranges between 1.345 mm and 4.3 mm.

Abstract: An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.