Abstract: A headphone comprises: a headphone main body and an ear supporting wrapped on the headphone main body, wherein the ear supporting includes a sleeve section which includes a main body portion, a lateral bulge portion, an inner bulge portion, and a circumferential bulge portion, and an ear hanging section which includes a first extension end extended toward the bottom, the front end and the inner side of the ear supporting from the top of the lateral bulge portion for fitting in the concha cymba, a bending end arranged to connect the first extension end and the second extension end and then bended toward the top of the ear supporting for fitting in the front surface of the antihelix, and a second extension end extended toward the top, the front end and the outer side of the ear supporting for fitting in the inner side of the helix.

Abstract: The present invention provides a touch sensitive processing method for detecting a liquid line when a touch panel half submerged in conductive liquid, comprising: driving at least one of the first electrodes and sensing the first electrodes for determining which first electrodes are being covered by the conductive liquid; driving at least one of the second electrodes and sensing the second electrodes for determining which second electrodes are being covered by the conductive liquid; determining a liquid line according to the second electrodes which are not covered by the conductive liquid when all of the first electrodes and some of the conductive electrodes are covered by the conductive liquid; and determining the liquid line according to the first electrodes and the second electrodes which are not covered by the conductive liquid when some of the first electrodes and some of the second electrodes are covered by the conductive liquid.

Abstract: A headphone comprises: a headphone main body and an ear supporting wrapped on the headphone main body, wherein the ear supporting includes a sleeve section which includes a main body portion, a lateral bulge portion, an inner bulge portion, and a circumferential bulge portion, and an ear hanging section which includes a first extension end extended toward the bottom, the front end and the inner side of the ear supporting from the top of the lateral bulge portion for fitting in the concha cymba, a bending end arranged to connect the first extension end and the second extension end and then bended toward the top of the ear supporting for fitting in the front surface of the antihelix, and a second extension end extended toward the top, the front end and the outer side of the ear supporting for fitting in the inner side of the helix.

Abstract: The present invention provides a touch sensitive processing method for detecting a liquid line when a touch panel half submerged in conductive liquid, wherein the touch panel comprises multiple parallel first electrodes and multiple parallel second electrodes, the touch sensitive processing method comprising: determining whether a liquid line piece group touches two sides of the touch panel if the liquid line piece group does exists; calculating two averaged values of sensing information with regard to two parts of the touch panel separated by the liquid line piece group if it touches two sides of the touch panel; determining a part of the touch panel having a larger averaged value is above the conductive liquid and another part of the touch panel is below the conductive liquid; and determining a liquid line according to a surface between the part above the conductive liquid and the liquid line piece group.

Abstract: An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.

Abstract: A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.

Abstract: The present invention provides a touch sensitive method applicable when a touch panel is half submerged in conductive liquid, wherein the touch panel comprises multiple parallel first electrodes and multiple parallel second electrodes, the touch sensitive processing method comprising: performing a step for acquiring a liquid line with respect to the touch panel for receiving a covered area of the touch panel below the liquid line; detecting in the covered area; reporting no touching or approximating events to a host if there are more than two first touching or approximating events or no event are detected; and reporting a first touching or approximating event to the host if there is only one first touching or approximating event is detected

Abstract: A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

Abstract: A probe card device and a fence-like probe thereof are provided. The fence-like probe includes a stroke segment, a fan-out segment, and a testing segment. The stroke segment is in an elongated shape defining a longitudinal direction, and the stroke segment has two end portions and a plurality of penetrating slots that are arranged along a fan-out direction perpendicular to the longitudinal direction, so that the stroke segment is deformable to store an elastic force by being applied with a force. The fan-out segment and the testing segment are respectively connected to the two end portions of the stroke segment. The fan-out segment has a fixing point arranged away from the stroke segment, and the testing segment has an abutting point arranged away from the stroke segment. Along the fan-out direction, the fixing point is spaced apart from the abutting point by a fan-out distance.

Abstract: A probe card device and a fence-like probe thereof are provided. The fence-like probe includes a stroke segment, a fan-out segment, and a testing segment. The stroke segment is in an elongated shape defining a longitudinal direction, and the stroke segment has two end portions and a plurality of penetrating slots that are arranged along a fan-out direction perpendicular to the longitudinal direction, so that the stroke segment is deformable to store an elastic force by being applied with a force. The fan-out segment and the testing segment are respectively connected to the two end portions of the stroke segment. The fan-out segment has a fixing point arranged away from the stroke segment, and the testing segment has an abutting point arranged away from the stroke segment. Along the fan-out direction, the fixing point is spaced apart from the abutting point by a fan-out distance.

Abstract: A probe card device and a fan-out probe thereof are provided. The fan-out probe includes a stroke segment, a fan-out segment, and a testing segment. The stroke segment is in a straight shape defining a longitudinal direction, and the stroke segment has two end portions. The stroke segment is bendable when the two end portions are respectively applied with forces along two opposite directions. The fan-out segment and the testing segment are respectively connected to the two end portions of the stroke segment. The fan-out segment has a fixing point arranged away from the stroke segment, and the testing segment has an abutting point arranged away from the stroke segment. Along a fan-out direction perpendicular to the longitudinal direction, the fixing point is spaced apart from the abutting point by a fan-out distance.

Abstract: A probe card device and a neck-like probe thereof are provided. The neck-like probe includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and each of the broad side surfaces has a long slot extending from one of the narrow side surfaces to the other one. The two long slots have a minimum distance therebetween that is 75%-95% of a maximum distance between the two broad side surfaces. The ring-shaped insulator surrounds a portion of the conductive pin having the two long slots, and a portion of the neck-like probe corresponding in position to a part of the ring-shaped insulator on the two broad side surfaces has a thickness that is 85%-115% of the maximum distance.

Abstract: A probe card device and a directivity probe thereof are provided. The directivity probe having an elongated shape includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments respectively extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and has only one transverse slot that is recessed in one of the two broad side surfaces and that extends from one of the two narrow side surfaces to the other narrow side surface. The transverse groove has a maximum depth that is 1%-10% of a maximum distance between the two broad side surfaces. The stroke segment of the directivity probe can be bent by applying a force to the two end segments, and an inflection point of the bent stroke segment is located in the transverse slot.

Abstract: A semiconductor device including a substrate, a low-k dielectric layer, a cap layer, and a conductive layer is provided. The low-k dielectric layer is disposed over the substrate. The cap layer is disposed on the low-k dielectric layer, wherein a carbon atom content of the cap layer is greater than a carbon atom content of the low-k dielectric layer. The conductive layer is disposed in the cap layer and the low-k dielectric layer.

Abstract: A display apparatus includes a substrate, an element layer, a protective film, a mechanical member, a first adhesive layer and a second adhesive layer. An opening of the protective film is located between a first portion of the protective film and a second portion of the protective film. The first portion of the protective film, the second portion of the protective film and the opening of the protective film are respectively overlapped with a first portion of the substrate, a second portion of the substrate and a third portion of the substrate. The first adhesive layer and the second adhesive layer are respectively disposed on a first surface and a second surface of the mechanical member. The third portion of the substrate is connected between the first portion of the substrate and the second portion of the substrate, and the third portion of the substrate is bent.

Abstract: A thin-film probe card and a test module thereof are provided. The test module includes a carrying unit, a plurality of vertical probes fixed in position by the carrying unit, an elastic cushion disposed on the carrying unit, and a thin sheet. The thin sheet includes a carrier partially disposed on the elastic cushion, a plurality of signal circuits disposed on the carrier, and a plurality of electrically conductive protrusions that are respectively formed on the signal circuits. An end of the vertical probes is arranged at an inner side of the electrically conductive protrusions and is coplanar with free ends of the electrically conductive protrusions.

Abstract: A thin-film probe card and a test module thereof are provided. The test module includes a carrying unit, a plurality of vertical probes fixed in position by the carrying unit, an elastic cushion disposed on the carrying unit, and a thin sheet. The thin sheet includes a carrier partially disposed on the elastic cushion, a plurality of signal circuits disposed on the carrier, and a plurality of electrically conductive protrusions that are respectively formed on the signal circuits. An end of the vertical probes is arranged at an inner side of the electrically conductive protrusions and is coplanar with free ends of the electrically conductive protrusions.

Abstract: The present invention provides a method for detecting whether a component is under conductive liquid, comprising: receiving a first liquid line and a second liquid line representing a line where the conductive liquid surface touches a first touch panel of an electronic device and another line where the conductive liquid surface touches a second touch panel of the electronic device when the electronic device submerged in the conductive liquid, respectively; acquiring position data of the first touch panel, the second touch panel and the component; and determining whether the component is under the conductive liquid according to the position data of the first touch panel, the second touch panel and the component as well as the first liquid line and the second liquid line.

Abstract: A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

Abstract: A display, including a supporting layer and a flexible display panel, is provided. The supporting layer has at least two extending sections and at least one bending section, connected therebetween and adapted to be bent along an axis as a rotation axis. The supporting layer has at least one groove at the bending section and at least one indentation at a bottom surface of the groove. An extending direction of the groove is parallel to the axis. An extending direction of the indentation is not parallel to the axis. The supporting layer has a first thickness at each extending section, a second thickness at the groove, and a third thickness at the indentation. The first, second, and third thicknesses are different from one another. The flexible display is disposed on the supporting layer. The groove and the flexible display are respectively located on two opposite sides of the supporting layer.