Abstract: A probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, an impedance adjusting member, and conductive probes. The upper die unit includes a first die and a second die spaced apart from the first die. The first die has a penetrating hole, and the second die has a circuit layer. The impedance adjusting member is disposed on the second die and is electrically coupled to the circuit layer. Each of the conductive probes passes through the upper die unit, the spacer, and the lower die unit. At least one of the conductive probes includes an upper contacting segment protruding from the upper die unit and an extending arm connected to the upper contacting segment. The extending arm is abutted against the circuit layer by passing through the penetrating hole.

Abstract: A probe card device is provided, and includes a plurality of conductive probes and a flat signal transfer structure that includes a transfer plate and a retaining cover. The transfer plate has a first surface and a second surface that is opposite to the first surface. The transfer plate includes a receiving slot recessed from the first surface and a plurality of signal circuits each having a signal contact arranged at a bottom of the receiving slot. A portion of the transfer plate arranged around and adjacent to the receiving slot is defined as a supporting portion. The retaining cover has a plurality of thru-holes and is disposed on the supporting portion. The retaining cover and the receiving slot of the transfer plate jointly and surroundingly define a receiving space, and the signal contacts of the transfer plate are arranged in the receiving space.

Abstract: An automatic wire arranging device includes a controller, at least one driving device electrically connected with the controller, a first wire clamping jig connected with the at least one driving device, a second wire clamping jig disposed to the first wire clamping jig, at least one charge-coupled device camera connected with the controller, and at least one puncher pin connected with the at least one driving device. The first wire clamping jig opens a plurality of first clamping slots. Each of the plurality of the first clamping slots opens a through-hole. The second wire clamping jig opens a plurality of second clamping slots. The at least one puncher pin is capable of penetrating through the through-hole and pushing against a core wire to be away from one of the plurality of the first clamping slots and be blocked in one of the plurality of the second clamping slots.

Abstract: A pharmaceutical composition comprises a taxane (e.g., paclitaxel, docetaxel, cabazitaxel, larotaxel, ortataxel, and/or tesetaxel) in a mixture of first and second surfactants. The absorption of the taxane is increased from the pharmaceutical composition is greater than the sum of the absorption of docetaxel from either the first or the second surfactant. The increase in absorption is especially enhanced when the ratio of the first surfactant to the second surfactant in the pharmaceutical composition is between 60:40 and 85:15 by weight, and the total surfactant weight does not exceed 98% of the total weight. Polysorbate 80, polysorbate 20, and caprylocaproyl polyoxylglycerides serve as suitable first surfactants, and polysorbate 80 or polyethyoxylated castor oil serve as suitable second surfactants. The stability of the pharmaceutical composition may be enhanced by further including a stabilizer (e.g., citric acid and/or ascorbic acid).

Abstract: A fluid delivery system is revealed. A double diaphragm pump provided with two inlets and two outlets is mounted in the fluid delivery system. An introducing pipeline is connected to one set of inlet and outlet while a return pipeline is connected to the other set of inlet and outlet. Thereby a pneumatic mechanism in the double diaphragm pump drives two diaphragms therein to draw in and expel fluid in the system so that the fluid flows in and out through the two sets of inlets and outlets. Thus the pressure remains constant and the volume flow rate is uniform during delivery and returning of the fluid. A drain-back tube provided with a control valve is arranged between the introducing pipeline and the return pipeline. The fluid is returned and delivered under control of the control valve while changing fluids or cleaning pipelines of the system.

Abstract: A method for forming a semiconductor device structure is provided. The method includes disposing a semiconductor substrate in a physical vapor deposition (PVD) chamber and introducing a plasma-forming gas into the PVD chamber. The plasma-forming gas is an oxygen-containing gas. The method also includes applying a radio frequency (RF) power by a power source to a metal target in the PVD chamber to excite the plasma-forming gas to generate plasma. The metal target is directly electrically coupled to the power source. The method further includes directing the plasma towards the metal target positioned in the PVD chamber such that an etch stop layer is formed over the semiconductor substrate.

Abstract: The present disclosure provides a probe card device and a conductive probe thereof. The conductive probe includes a metallic pin, an outer electrode, and a dielectric layer. The metallic pin includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, and a first contacting segment and a second contacting segment respectively extending from the first connecting segment and second contacting segment along two opposite directions away from the middle segment. At least part of the outer electrode corresponds in position to the middle segment and is arranged adjacent to the first connecting segment. The dielectric layer is sandwiched between and entirely separates the metallic pin and the outer electrode, so that the outer electrode, the dielectric layer, and the metallic pin are jointly configured to generate a capacitance effect.

Abstract: A probe card testing device includes a testing circuit board, a signal transmission board, an electrical connecting module, and a probe head. The testing circuit board has metal pads spaced apart from each other. The signal transmission board has internal pads arranged on a bottom surface thereof and spaced apart from each other. The electrical connecting module includes a spacer having thru-holes and elastic arms positioned on the spacer. The spacer is sandwiched between the testing circuit board and the signal transmission board. The metal pads respectively face the internal pads through the thru-holes. A part of each elastic arm is arranged in one of the thru-holes, and is detachably compressed by one of the metal pads and the corresponding internal pad so as to be elastically deformed to establish an electrical transmission path. The probe head is disposed on a top surface of the signal transmission board.

Abstract: A rectangular probe includes two broad side surfaces and two narrow side surfaces each parallel to a longitudinal direction of the rectangular probe. The rectangular probe includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, a first contacting segment and a second contacting segment respectively extending from the first and second connecting segments, and a stroke structure arranged on the middle segment, the first contacting segment, or the second contacting segment. A longitudinal thru-hole of the stroke structure is formed by penetrating through the two broad side surfaces. Two transverse grooves of the stroke structure are respectively recessed in the two broad side surfaces. The two transverse grooves are configured to move in two directions away from each other so as to reduce a length of the rectangular probe.

Abstract: A display apparatus includes a substrate, an element layer, a protective film, a mechanical member, a first adhesive layer and a second adhesive layer. An opening of the protective film is located between a first portion of the protective film and a second portion of the protective film. The first portion of the protective film, the second portion of the protective film and the opening of the protective film are respectively overlapped with a first portion of the substrate, a second portion of the substrate and a third portion of the substrate. The first adhesive layer and the second adhesive layer are respectively disposed on a first surface and a second surface of the mechanical member. The third portion of the substrate is connected between the first portion of the substrate and the second portion of the substrate, and the third portion of the substrate is bent.

Abstract: A probe component and a probe structure thereof are provided. The probe structure includes a first contacting segment, a first connecting segment, a second connecting segment and a second contacting segment. The first contacting segment has an abutting portion and a first end portion connected to the abutting portion. The first connecting segment is connected to the first contacting segment. The second connecting segment is connected to the first connecting segment. The second contacting segment is connected to the second connecting segment and has a second end portion.

Abstract: A probe carrier of a probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, and an impedance adjusting member. The upper die unit includes a first die, a second die spaced apart from the first die, and a flexible board disposed on the second die and arranged away from the first die. The flexible board includes a plurality of penetrating holes and a circuit layer. The impedance adjusting member is disposed on the flexible board and is electrically coupled to the circuit layer. The circuit layer includes at least one plated wall arranged in at least one of the penetrating holes, a part of the flexible board having the at least one plated wall is separable from the second die by receiving an internal force.

Abstract: A probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, an impedance adjusting member, and conductive probes. The upper die unit includes a first die and a second die spaced apart from the first die. The first die has a penetrating hole, and the second die has a circuit layer. The impedance adjusting member is disposed on the second die and is electrically coupled to the circuit layer. Each of the conductive probes passes through the upper die unit, the spacer, and the lower die unit. At least one of the conductive probes includes an upper contacting segment protruding from the upper die unit and an extending arm connected to the upper contacting segment. The extending arm is abutted against the circuit layer by passing through the penetrating hole.

Abstract: A method for forming a semiconductor device structure is provided. The method includes disposing a semiconductor substrate in a physical vapor deposition (PVD) chamber and introducing a plasma-forming gas into the PVD chamber. The plasma-forming gas is an oxygen-containing gas. The method also includes applying a radio frequency (RF) power by a power source to a metal target in the PVD chamber to excite the plasma-forming gas to generate plasma. The metal target is directly electrically coupled to the power source. The method further includes directing the plasma towards the metal target positioned in the PVD chamber such that an etch stop layer is formed over the semiconductor substrate.

Abstract: A fundus camera displays guide information on a display panel which can be viewed by a testee to guide the testee to adjust a relative position of the fundus camera and a tested eyeball of the testee to a determined position. Therefore, the testee can use the above-mentioned fundus camera to self-shoot fundus images with better image quality. A method for self-shooting fundus is also disclosed.

Abstract: A probe card testing device includes a testing circuit board, a signal transmission board, an electrical connecting module, and a probe head. The testing circuit board has metal pads spaced apart from each other. The signal transmission board has internal pads arranged on a bottom surface thereof and spaced apart from each other. The electrical connecting module includes a spacer having thru-holes and elastic arms positioned on the spacer. The spacer is sandwiched between the testing circuit board and the signal transmission board. The metal pads respectively face the internal pads through the thru-holes. A part of each elastic arm is arranged in one of the thru-holes, and is detachably compressed by one of the metal pads and the corresponding internal pad so as to be elastically deformed to establish an electrical transmission path. The probe head is disposed on a top surface of the signal transmission board.

Abstract: The present disclosure discloses an electronic device including an electronic apparatus and an electric connector. The electronic apparatus includes an electric connection port. The electric connection port includes a concave trench, a first and second conductive strips are disposed in the concave trench. The first conductive strip and the second conductive strip respectively extend along an extending direction of the concave trench. The electric connector includes a first and second elastic contacts which are exposed and protruded outward. When the electric connector is plugged into the electric connection port, the first elastic contact is in contact with the first conductive strip, and the second elastic contact is in contact with the second conductive strip. The electric connection port may accommodate the electric connector, so that the electric connector may be selectively plugged to any position on the electric connection port along the extending direction of the concave trench.

Abstract: A method for forming a semiconductor device structure is provided. The method includes disposing a semiconductor substrate in a physical vapor deposition (PVD) chamber. The method also includes introducing a plasma-forming gas into the PVD chamber, and the plasma-forming gas contains an oxygen-containing gas. The method further includes applying a radio frequency (RF) power to a metal target in the PVD chamber to excite the plasma-forming gas to generate plasma. In addition, the method includes directing the plasma towards the metal target positioned in the PVD chamber such that an etch stop layer is formed over the semiconductor substrate.

Abstract: A projector device includes an illumination module and an imaging module. The imaging module is connected to the illumination module and includes a housing, a relay optical system, and a projection optical system. The housing has a first annular receiving groove and a second annular receiving groove. The first annular receiving groove is closer to the illumination module than the second annular receiving groove. A center axis line of the first annular receiving groove and a center axis line of the second annular receiving groove are on the same axis line. The relay optical system includes a lens received in the first annular receiving groove. The projection optical system includes a lens and a reflecting mirror received in the second annular receiving groove. Mirror centers of the lenses and a mirror center the reflecting mirror are located on the same axis line.