Abstract: An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.

Abstract: Methods and systems for chemical vapor deposition (CVD) are disclosed. The methods and systems use a showerhead including a domed internal baffle plate. The domed internal baffle plate is perforated. The presence of the domed internal baffle plate improves the uniformity of gas distribution through the holes of the showerhead across the surface area of the showerhead. This improves deposition uniformity on the semiconducting wafer substrate upon which CVD is being performed, or improves the cleaning of the reaction chamber when a cleaning gas is pumped in through the showerhead.

Abstract: A method of fabricating semiconductor devices includes: loading one or more semiconductor wafers into a plurality of stations provided within a process chamber; applying a process to the semiconductor wafers which deposits a material on the one or more semiconductor wafers within the process chamber; and cleaning the process chamber. Suitably, cleaning the process chamber includes flowing a cleaning gas into the process chamber toward a deflector arranged in the process chamber, the deflector having a first surface upon which the flowed cleaning gas impinges, the first surface directing a first portion of the flowed cleaning gas impinging thereon in a first trajectory toward a first end of the process chamber and directing a second portion of the flowed cleaning gas impinging thereon in a second trajectory toward a second end of the process chamber, the second end being opposite the first end.

Abstract: Pumping liners for use in an apparatus for depositing a material on a work piece by chemical vapor deposition includes a plurality of unevenly spaced apertures are disclosed. Uneven spacing of the plurality of apertures produces a uniform flow of processing gases within a processing chamber with which the pumping liner is associated. Films of materials deposited onto a work piece by chemical vapor deposition techniques using disclosed pumping liners exhibit desirable properties such as uniform thickness and smooth and uniform surfaces.

Abstract: A method includes depositing a dielectric layer over a substrate, and etching the dielectric layer to form an opening and to expose a first conductive feature underlying the dielectric layer. The dielectric layer is formed using a precursor including nitrogen therein. The method further includes depositing a sacrificial spacer layer extending into the opening, and patterning the sacrificial spacer layer to remove a bottom portion of the sacrificial spacer layer. A vertical portion of the sacrificial spacer layer in the opening and on sidewalls of the dielectric layer is left to form a ring. A second conductive feature is formed in the opening. The second conductive feature is encircled by the ring, and is over and electrically coupled to the first conductive feature. At least a portion of the ring is removed to form an air spacer.

Abstract: The present invention provides a touch sensitive processing method for detecting a liquid line when a touch panel half submerged in conductive liquid, wherein the touch panel comprises multiple parallel first electrodes and multiple parallel second electrodes, the touch sensitive processing method comprising: determining whether a liquid line piece group touches two sides of the touch panel if the liquid line piece group does exists; calculating two averaged values of sensing information with regard to two parts of the touch panel separated by the liquid line piece group if it touches two sides of the touch panel; determining a part of the touch panel having a larger averaged value is above the conductive liquid and another part of the touch panel is below the conductive liquid; and determining a liquid line according to a surface between the part above the conductive liquid and the liquid line piece group.

Abstract: A heat dissipating mechanism is for heat dissipation of a display module and a heat generating module of a display apparatus and includes a frame structure, a first airflow generating device, and a conductive cover structure having first, second, and third covers. The first cover is connected to the frame structure for containing the display module. The second cover has an air inlet and an air outlet and is connected to the first cover to form a channel. The third cover is connected to the second cover for containing the heat generating module. The first airflow generating device is disposed in the air inlet to guide air into the channel and out of the air outlet, so as to form an airflow for heat dissipation of the display module and the heat generating module.

Abstract: The invention provides a voltage doubler switched capacitor circuit capable of detecting short circuit of flying capacitor and a detection method thereof. The voltage doubler switched capacitor circuit provides a way to connect the flying capacitor in parallel to the charging path, and calculate whether it is charged to a predetermined voltage in the designed charging time interval, and then it can effectively detect whether the flying capacitor is short-circuited.

Abstract: A chamber of a semiconductor fabrication facility may include a vent port diffuser. The vent port diffuser may include a first tube member configured to couple the vent port diffuser to a vent port of the chamber. The vent port diffuser may include a second tube member coupled to the first tube member. The second tube member may comprise a plurality of openings spaced along a length of the second tube member, with the plurality of openings configured to receive a fluid from the chamber. Based on the semiconductor fabrication facility including the vent port diffuser, the chamber may be configured to provide an improved flow field of a fluid within the chamber. In this way, the vent port diffuser may reduce defects of semiconductor devices transported through the chamber that might otherwise be caused by contaminants.

Abstract: A flexible device array substrate includes: a substrate, a metal-containing layer, and an electronic component layer. The metal-containing layer is disposed on the substrate. The metal-containing layer includes: a first layer and a second layer. The first layer is located on a side close to the substrate, and the first layer contains a first metal oxide to form a peeling interface in the first layer. The second layer is located on a side away from the substrate, and the second layer contains a second metal oxide. The oxidation number of the metal in the second metal oxide is smaller than the oxidation number of the metal in the first metal oxide. The electronic component layer is disposed above the metal-containing layer. A method of manufacturing the flexible device array substrate is also provided.

Abstract: A probe card device and a transmission structure are provided. The transmission structure includes a supporting layer, a plurality of metal conductors spaced apart from each other and slantingly inserted into the supporting layer, and an insulating resilient layer formed on the supporting layer. Each of the metal conductors includes a positioning segment held in the supporting layer, a connecting segment and an embedded segment respectively extending from two ends of the positioning segment, and an exposed segment extending from the embedded segment. Each of the embedded segments is embedded and fixed in the insulating resilient layer, and each of the exposed segments protrudes from the insulating resilient layer. When any one of the exposed segments is pressed by an external force, the insulating resilient layer is configured to absorb the external force through the corresponding embedded segment so as to have a deformation providing a stroke distance.

Abstract: A pupil tracking method includes: retrieving an external eye image of a subject, wherein the external eye image includes a pupil of the subject; performing an image preprocessing on the external eye image, wherein the image preprocessing includes performing a binary conversion on the external eye image to obtain a binary image; finding out a contour boundary of each feature in the binary image, and finding out a pupil feature based on a variance of a distance from the contour boundary of each feature to a corresponding reference point; fitting the contour boundary of the pupil feature by a boundary fitting method to find a center coordinate of the pupil feature. The abovementioned pupil tracking method can track the pupil of the subject's eyeball without using a stereo camera. An ophthalmology inspection device using the abovementioned pupil tracking method is also disclosed.

Abstract: The present invention provides a touch sensitive processing method for detecting a liquid line when a touch panel half submerged in conductive liquid, wherein the touch panel comprises multiple parallel first electrodes and multiple parallel second electrodes, the touch sensitive processing method comprising: determining whether a liquid line piece group touches two sides of the touch panel if the liquid line piece group does exists; calculating two averaged values of sensing information with regard to two parts of the touch panel separated by the liquid line piece group if it touches two sides of the touch panel; determining a part of the touch panel having a larger averaged value is above the conductive liquid and another part of the touch panel is below the conductive liquid; and determining a liquid line according to a surface between the part above the conductive liquid and the liquid line piece group.

Abstract: An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.

Abstract: A diaphragm position of a valve may be detected and/or determined such that operation of the diaphragm may be monitored. A sensor included in the valve may generate sensor data that may be used to monitor the position of the diaphragm, which in turn may be used to determine a flow of a fluid through the valve. In this way, the sensor may be used to determine whether the diaphragm is properly functioning, may be used to identify and detect failures of the diaphragm, and/or may be used to quickly terminate operation of an associated deposition tool. This may reduce semiconductor substrate scrap, may reduce device failures on semiconductor substrates that are processed by the deposition tool, may increase semiconductor processing quality of the deposition tool, and/or may increase semiconductor processing yields of the deposition tool.

Abstract: Pumping liners for use in an apparatus for depositing a material on a work piece by chemical vapor deposition includes a plurality of unevenly spaced apertures are disclosed. Uneven spacing of the plurality of apertures produces a uniform flow of processing gases within a processing chamber with which the pumping liner is associated. Films of materials deposited onto a work piece by chemical vapor deposition techniques using disclosed pumping liners exhibit desirable properties such as uniform thickness and smooth and uniform surfaces.

Abstract: A heat dissipating mechanism is for heat dissipation of a display module and a heat generating module of a display apparatus and includes a frame structure, a first airflow generating device, and a conductive cover structure having first, second, and third covers. The first cover is connected to the frame structure for containing the display module. The second cover has an air inlet and an air outlet and is connected to the first cover to form a channel. The third cover is connected to the second cover for containing the heat generating module. The first airflow generating device is disposed in the air inlet to guide air into the channel and out of the air outlet, so as to form an airflow for heat dissipation of the display module and the heat generating module.

Abstract: A chuck vacuum line of a semiconductor processing tool includes a first portion that penetrates a sidewall of a main pumping line of the semiconductor processing tool. The chuck vacuum line includes a second portion that is substantially parallel to the sidewall of the main pumping line and to a direction of flow in the main pumping line. A size of the second portion increases between an inlet end of the second portion and an outlet end of the second portion along the direction of flow in the main pumping line.

Abstract: A sealing mechanism is provided, including a housing, a groove, and a sealing element. The housing includes a first member and a second member, and the groove is formed between the first and second members. The sealing element is formed in the groove by Low Pressure Molding (LPM) and surrounds at least one of the first and second members.