Patents by Inventor Tsuyoshi Moriya
Tsuyoshi Moriya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10805526Abstract: Provided are an imaging apparatus, an imaging method and a computer program product capable of reducing the deviation of an output image when imaging modules with different spectral sensitivities are replaced with each other, an imaging method, and a computer program product. The imaging apparatus includes a processor that selectively obtains one of the first captured image and the second captured image to be output as an output image based on a magnification characteristic of the output image; based on the first image being replaced with the second image as the output image, corrects image information of the second captured image based on first output image information of the first captured image and second output image information of the second captured image; and outputs the output image according to a correction to the second captured image based on the corrected image information of the second captured image.Type: GrantFiled: December 13, 2018Date of Patent: October 13, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventor: Tsuyoshi Moriya
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Patent number: 10771754Abstract: Provided is a method of correcting a white balance (WB) of an image includes obtaining a first image captured by photographing a subject when a flash emits light, and a second image captured by photographing the subject when the flash emits no light; obtaining a WB gain of the first image and a WB gain of the second image; obtaining a color balance (CB) of flash light, based on at least one of the obtained WB gains of the first and second images; and correcting a WB of the first image, based on the CB of the flash light.Type: GrantFiled: December 6, 2017Date of Patent: September 8, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventor: Tsuyoshi Moriya
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Patent number: 10643839Abstract: A film forming apparatus includes a gas injection unit having a shower plate provided with gas injection holes, and a plurality of partition regions through which gases are separately injected and which are defined by dividing an arrangement region of the gas injection holes into a plurality of concentric regions in a diametrical direction of the substrate. A supply amount of a raw material gas per unit time in a raw material gas supply period in a cycle of forming a monomolecular layer by supplying the raw material gas and a reactant gas multiple times, and per unit area of the shower plate, and/or a supply amount of the reactant gas per unit time in a reaction period of the raw material gas and the reactant gas in the cycle, and per unit area of the shower plate becomes different in at least two of the partition regions.Type: GrantFiled: December 7, 2017Date of Patent: May 5, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Ayuta Suzuki, Kosuke Yamamoto, Kazuyoshi Matsuzaki, Munehito Kagaya, Tsuyoshi Moriya, Tadashi Mitsunari, Atsushi Kubo
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Publication number: 20190385815Abstract: A film forming apparatus includes a vacuum-evacuable processing chamber, a lower electrode for mounting thereon a target substrate, an upper electrode disposed to face the lower electrode, a gas supply unit, a voltage application unit and a switching unit. The gas supply unit supplies a film forming source gas to be formed into plasma to a processing space between the upper and the lower electrode. The voltage application unit applies to the upper electrode a voltage outputted from at least one of a high frequency power supply and a DC power supply included therein. The switching unit selectively switches the voltage to be applied to the upper electrode among a high frequency voltage outputted from the high frequency power supply, a DC voltage outputted from the DC power supply, and a superimposed voltage in which the DC voltage is superimposed with the high frequency voltage.Type: ApplicationFiled: June 4, 2019Publication date: December 19, 2019Inventors: Shinya IWASHITA, Ayuta SUZUKI, Takahiro SHINDO, Kazuki DEMPOH, Tatsuo MATSUDO, Yasushi MORITA, Takamichi KIKUCHI, Tsuyoshi MORIYA
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Patent number: 10491875Abstract: The image processing apparatus includes a shading estimation unit estimating a shading intensity of an image, a light source color estimation unit setting an achromatic color determination range corresponding to the estimated shading intensity, as a color space, a correction coefficient calculating unit calculating a white balance gain, and an image signal processing circuit correcting a white balance.Type: GrantFiled: September 2, 2016Date of Patent: November 26, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventor: Tsuyoshi Moriya
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Publication number: 20190289269Abstract: Provided is a method of correcting a white balance (WB) of an image includes obtaining a first image captured by photographing a subject when a flash emits light, and a second image captured by photographing the subject when the flash emits no light; obtaining a WB gain of the first image and a WB gain of the second image; obtaining a color balance (CB) of flash light, based on at least one of the obtained WB gains of the first and second images; and correcting a WB of the first image, based on the CB of the flash light.Type: ApplicationFiled: December 6, 2017Publication date: September 19, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Tsuyoshi MORIYA
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Publication number: 20190191080Abstract: Provided are an imaging apparatus, an imaging method and a computer program product capable of reducing the deviation of an output image when imaging modules with different spectral sensitivities are replaced with each other, an imaging method, and a computer program product. The imaging apparatus includes a processor that selectively obtains one of the first captured image and the second captured image to be output as an output image based on a magnification characteristic of the output image; based on the first image being replaced with the second image as the output image, corrects image information of the second captured image based on first output image information of the first captured image and second output image information of the second captured image; and outputs the output image according to a correction to the second captured image based on the corrected image information of the second captured image.Type: ApplicationFiled: December 13, 2018Publication date: June 20, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Tsuyoshi MORIYA
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Publication number: 20190120703Abstract: A temperature measurement substrate according to an embodiment of the present disclosure includes: a substrate which is any one of a semiconductor wafer and a substrate for a flat panel display; and at least one optical fiber laid on a surface of the substrate and having a first pattern portion and a second pattern portion formed more densely than the first pattern portion.Type: ApplicationFiled: April 6, 2017Publication date: April 25, 2019Applicant: TOKYO ELECTRON LIMITEDInventors: Tadashi MITSUNARI, Satoshi TANAKA, Tsuyoshi MORIYA, Toshiya MATSUDA, Masaaki MIYAGAWA, Kenya IWASAKI
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Publication number: 20190088475Abstract: Disclosed is a film forming method including forming a metal oxide film on a base film by alternately supplying a metal-containing gas and a plasmatized oxidizing gas. The metal-containing gas is changed from a first metal-containing gas having no halogen to a second metal-containing gas different from the first metal-containing gas during the film forming of the metal oxide film.Type: ApplicationFiled: September 17, 2018Publication date: March 21, 2019Inventors: Shinya Iwashita, Takamichi Kikuchi, Naotaka Noro, Toshio Hasegawa, Tsuyoshi Moriya
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Patent number: 10121680Abstract: In a substrate processing apparatus, a mounting table and a gas supply part are provided in a processing container to face each other. The processing gas introduced from introduction ports formed in the gas supply part on the opposite side of the gas supply part from the mounting table is supplied to the substrate from gas supply holes formed in an end portion of the gas supply part on the side of the mounting table. The gas supply part includes a central region and one or more outer peripheral regions surrounding the central region. The gas supply holes and the introduction ports are provided for each of the central region and the outer peripheral regions. The processing gas whose gas supply conditions are adjusted for each of the regions is continuously and outwardly supplied in a circumferential direction around the center axis from the introduction ports.Type: GrantFiled: December 5, 2017Date of Patent: November 6, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Munehito Kagaya, Ayuta Suzuki, Kosuke Yamamoto, Tsuyoshi Moriya, Kazuyoshi Matsuzaki
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Publication number: 20180249141Abstract: The image processing apparatus includes a shading estimation unit estimating a shading intensity of an image, a light source color estimation unit setting an achromatic color determination range corresponding to the estimated shading intensity, as a color space, a correction coefficient calculating unit calculating a white balance gain, and an image signal processing circuit correcting a white balance.Type: ApplicationFiled: September 2, 2016Publication date: August 30, 2018Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Tsuyoshi MORIYA
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Publication number: 20180166298Abstract: In a substrate processing apparatus, a mounting table and a gas supply part are provided in a processing container to face each other. The processing gas introduced from introduction ports formed in the gas supply part on the opposite side of the gas supply part from the mounting table is supplied to the substrate from gas supply holes formed in an end portion of the gas supply part on the side of the mounting table. The gas supply part includes a central region and one or more outer peripheral regions surrounding the central region. The gas supply holes and the introduction ports are provided for each of the central region and the outer peripheral regions. The processing gas whose gas supply conditions are adjusted for each of the regions is continuously and outwardly supplied in a circumferential direction around the center axis from the introduction ports.Type: ApplicationFiled: December 5, 2017Publication date: June 14, 2018Inventors: Munehito KAGAYA, Ayuta SUZUKI, Kosuke YAMAMOTO, Tsuyoshi MORIYA, Kazuyoshi MATSUZAKI
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Publication number: 20180158671Abstract: A film forming apparatus includes a gas injection unit having a shower plate provided with gas injection holes, and a plurality of partition regions through which gases are separately injected and which are defined by dividing an arrangement region of the gas injection holes into a plurality of concentric regions in a diametrical direction of the substrate. A supply amount of a raw material gas per unit time in a raw material gas supply period in a cycle of forming a monomolecular layer by supplying the raw material gas and a reactant gas multiple times, and per unit area of the shower plate, and/or a supply amount of the reactant gas per unit time in a reaction period of the raw material gas and the reactant gas in the cycle, and per unit area of the shower plate becomes different in at least two of the partition regions.Type: ApplicationFiled: December 7, 2017Publication date: June 7, 2018Inventors: Ayuta SUZUKI, Kosuke YAMAMOTO, Kazuyoshi MATSUZAKI, Munehito KAGAYA, Tsuyoshi MORIYA, Tadashi MITSUNARI, Atsushi KUBO
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Publication number: 20180155830Abstract: A gas supply and exhaust structure, for supplying and exhausting a raw material gas into and from a chamber having a substrate mounting surface at a position corresponding to a central portion of an inner top surface, includes a side gas supply unit having gas supply ports arranged circumferentially and vertically on an inner side surface of the chamber and configured to supply the raw material gas through the gas supply ports toward a central axis of the chamber, and an exhaust unit having a gas exhaust port formed at the central portion of the inner top surface of the chamber and configured to exhaust the raw material gas. The inner top surface has an inclined surface inclined such that a distance between the inner top surface and an inner bottom surface of the chamber becomes smaller from the inner side surface toward the central axis.Type: ApplicationFiled: December 6, 2017Publication date: June 7, 2018Inventors: Ayuta SUZUKI, Kosuke Yamamoto, Kazuyoshi Matsuzaki, Munehito Kagaya, Tsuyoshi Moriya, Tadashi Mitsunari
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Patent number: 9661290Abstract: An image processing method includes: receiving a captured image, determining block statistics which indicates image characteristics of each of a plurality of blocks by using the plurality of blocks obtained by dividing the captured image determining a shading estimation coefficient to be applied to the captured image by using the determined block statistics and an amount of infrared light included in a light source, and correcting shading of the captured image by using the determined shading estimation coefficient.Type: GrantFiled: November 23, 2015Date of Patent: May 23, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventor: Tsuyoshi Moriya
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Patent number: 9627184Abstract: A plasma processing apparatus includes a processing chamber, in which a wafer W is plasma-processed, and a CPU controlling an operation of each component. A processing gas is introduced into the processing chamber under a first condition defined by a flow rate and a molecular weight of the processing gas, specifically based on a magnitude of a product A1 (=Q1×m1) of the flow rate Q1 and the molecular weight m1 of the processing gas, and a surface of the wafer W is physically or chemically etched. And then, a pre-purge gas which may be identical to or different from the processing gas is introduced into the processing chamber through a shower head under a second condition derived from the first condition.Type: GrantFiled: December 3, 2010Date of Patent: April 18, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Tsuyoshi Moriya, Hiroyuki Nakayama, Hiroshi Nagaike
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Publication number: 20170032983Abstract: A thermal catalytic layer is formed on the inner surface of a processing container and heated. Thus, when a sublimate sublimated from a coating film on a wafer W and received within the processing container reaches the vicinity of the thermal catalytic layer, the sublimate is decomposed and removed by the thermal activation of the thermal catalytic layer. In removing a sublimate attached to a light transmission window, a cleaning substrate formed with the thermal catalytic layer on the surface thereof is carried into the processing container and caused to approach the light transmission window. Thereafter, the cleaning substrate is heated so that the sublimate attached to the surface of the light transmission window is removed.Type: ApplicationFiled: July 27, 2016Publication date: February 2, 2017Inventors: Koshi MUTA, Tsuyoshi MORIYA, Takuya MORI, Kazuhiro TAKESHITA, Tomonori ESAKI, Kouichi MIZUNAGA, Masataka TANAKA, Kouzou KANAGAWA, Keigo NAKANO
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Patent number: 9441292Abstract: Etching is performed through the following process. A substrate is loaded into a processing chamber and mounted on a mounting table therein. Then, in the state where a ring member at least a surface of which is made of a same material as a main component of an etching target film is provided to surround the substrate, a processing gas is injected in a shower-like manner from a gas supply unit oppositely facing the substrate and the etching target film is etched by using a plasma of the processing gas; and evacuating the inside of the processing chamber through an exhaust path. Through this process, unbalanced distribution of plasma active species in the vicinity of a circumferential edge portion of the substrate can be suppressed.Type: GrantFiled: January 14, 2015Date of Patent: September 13, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Ayuta Suzuki, Songyun Kang, Tsuyoshi Moriya, Nobutoshi Terasawa, Yoshiaki Okabe
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Publication number: 20160155217Abstract: An image processing method includes: receiving a captured image, determining block statistics which indicates image characteristics of each of a plurality of blocks by using the plurality of blocks obtained by dividing the captured image determining a shading estimation coefficient to be applied to the captured image by using the determined block statistics and an amount of infrared light included in a light source, and correcting shading of the captured image by using the determined shading estimation coefficient.Type: ApplicationFiled: November 23, 2015Publication date: June 2, 2016Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Tsuyoshi MORIYA
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Patent number: 9209010Abstract: A substrate cleaning method includes removing a foreign material attached to a substrate while preventing deterioration of the substrate and any film formed on or above the substrate. A cleaning gas at a pressure between 0.3 MPa and 2.0 MPa is sprayed towards a wafer W with attached foreign material 22 placed in a near-vacuum, producing clusters 21 made up of a multitude of gas molecules 20, and the clusters 21 collide with the wafer W without undergoing ionization.Type: GrantFiled: February 3, 2011Date of Patent: December 8, 2015Assignees: TOKYO ELECTRON LIMITED, IWATANI CORPORATIONInventors: Hidefumi Matsui, Tsuyoshi Moriya, Masaki Narushima