Patents by Inventor Tsuyoshi Moriya

Tsuyoshi Moriya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190198051
    Abstract: A magnetic recording medium with a reduced average grain diameter and reduced grain diameter dispersion is provided. A magnetic recording medium having a magnetic property (magnetic anisotropy energy) applicable as a magnetic recording medium is provided. It is a magnetic recording medium containing a substrate, a grain diameter control layer, a first seed layer, a second seed layer, and a magnetic recording layer containing an ordered alloy in this order, in which the second seed layer is composed of crystal grains having TiN as a main component, and a grain boundary material having at least one or more selected from the group consisting of metal oxides and carbon as a main component.
    Type: Application
    Filed: February 27, 2019
    Publication date: June 27, 2019
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Hiroyasu KATAOKA, Tsuyoshi YOSHIZAWA, Tomohiro MORIYA, Shinji UCHIDA, Hirohisa OYAMA, Takehito SHIMATSU
  • Publication number: 20190191080
    Abstract: Provided are an imaging apparatus, an imaging method and a computer program product capable of reducing the deviation of an output image when imaging modules with different spectral sensitivities are replaced with each other, an imaging method, and a computer program product. The imaging apparatus includes a processor that selectively obtains one of the first captured image and the second captured image to be output as an output image based on a magnification characteristic of the output image; based on the first image being replaced with the second image as the output image, corrects image information of the second captured image based on first output image information of the first captured image and second output image information of the second captured image; and outputs the output image according to a correction to the second captured image based on the corrected image information of the second captured image.
    Type: Application
    Filed: December 13, 2018
    Publication date: June 20, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Tsuyoshi MORIYA
  • Publication number: 20190169381
    Abstract: A resin composition containing a thermoplastic resin, carbon fibers, glass fibers, a resin containing amide bonds and/or imide bonds, and a compatibilizer.
    Type: Application
    Filed: February 4, 2019
    Publication date: June 6, 2019
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Masayuki OKOSHI, Hiroyuki MORIYA, Tsuyoshi MIYAMOTO
  • Patent number: 10301461
    Abstract: Provided is a resin composition including: a thermoplastic resin; a carbon fiber; and a terminal modified resin including a main chain having at least one terminal modified with a long chain alkyl group having 8 or more carbon atoms, the main chain containing at least one of an amide bond and an imide bond.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: May 28, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi Miyamoto, Daisuke Nakayama, Hiroyuki Moriya, Masayuki Okoshi
  • Publication number: 20190153203
    Abstract: This resin composition includes: a polyolefin; carbon fibers having an average fiber length of 0.1 to 2.5 mm; a resin including at least one among an amide bond and an imide bond, the content of the resin with respect to 100 parts by mass of the polyolefin being greater than 20 parts by mass and less than or equal to 100 parts by mass; and a compatibilizer.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Yuko IWADATE, Masayuki OKOSHI, Hiroyuki MORIYA, Tsuyoshi MIYAMOTO, Daisuke NAKAYAMA
  • Publication number: 20190153222
    Abstract: Provided is a resin composition containing a thermoplastic resin, a carbon fiber, a polyamide, and a compatibilizer. The polyamide contains: a structural unit containing an aromatic ring other than an aramid structure; and a structural unit not containing an aromatic ring. Each of the structural unit is a structural unit in which a dicarboxylic acid and a diamine are condensation-polymerized, or a structural unit that is a ring-opened lactam.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi MIYAMOTO, Masayuki OKOSHI, Hiroyuki MORIYA
  • Publication number: 20190120703
    Abstract: A temperature measurement substrate according to an embodiment of the present disclosure includes: a substrate which is any one of a semiconductor wafer and a substrate for a flat panel display; and at least one optical fiber laid on a surface of the substrate and having a first pattern portion and a second pattern portion formed more densely than the first pattern portion.
    Type: Application
    Filed: April 6, 2017
    Publication date: April 25, 2019
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Tadashi MITSUNARI, Satoshi TANAKA, Tsuyoshi MORIYA, Toshiya MATSUDA, Masaaki MIYAGAWA, Kenya IWASAKI
  • Publication number: 20190088475
    Abstract: Disclosed is a film forming method including forming a metal oxide film on a base film by alternately supplying a metal-containing gas and a plasmatized oxidizing gas. The metal-containing gas is changed from a first metal-containing gas having no halogen to a second metal-containing gas different from the first metal-containing gas during the film forming of the metal oxide film.
    Type: Application
    Filed: September 17, 2018
    Publication date: March 21, 2019
    Inventors: Shinya Iwashita, Takamichi Kikuchi, Naotaka Noro, Toshio Hasegawa, Tsuyoshi Moriya
  • Patent number: 10121680
    Abstract: In a substrate processing apparatus, a mounting table and a gas supply part are provided in a processing container to face each other. The processing gas introduced from introduction ports formed in the gas supply part on the opposite side of the gas supply part from the mounting table is supplied to the substrate from gas supply holes formed in an end portion of the gas supply part on the side of the mounting table. The gas supply part includes a central region and one or more outer peripheral regions surrounding the central region. The gas supply holes and the introduction ports are provided for each of the central region and the outer peripheral regions. The processing gas whose gas supply conditions are adjusted for each of the regions is continuously and outwardly supplied in a circumferential direction around the center axis from the introduction ports.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: November 6, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Munehito Kagaya, Ayuta Suzuki, Kosuke Yamamoto, Tsuyoshi Moriya, Kazuyoshi Matsuzaki
  • Publication number: 20180249141
    Abstract: The image processing apparatus includes a shading estimation unit estimating a shading intensity of an image, a light source color estimation unit setting an achromatic color determination range corresponding to the estimated shading intensity, as a color space, a correction coefficient calculating unit calculating a white balance gain, and an image signal processing circuit correcting a white balance.
    Type: Application
    Filed: September 2, 2016
    Publication date: August 30, 2018
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Tsuyoshi MORIYA
  • Publication number: 20180166298
    Abstract: In a substrate processing apparatus, a mounting table and a gas supply part are provided in a processing container to face each other. The processing gas introduced from introduction ports formed in the gas supply part on the opposite side of the gas supply part from the mounting table is supplied to the substrate from gas supply holes formed in an end portion of the gas supply part on the side of the mounting table. The gas supply part includes a central region and one or more outer peripheral regions surrounding the central region. The gas supply holes and the introduction ports are provided for each of the central region and the outer peripheral regions. The processing gas whose gas supply conditions are adjusted for each of the regions is continuously and outwardly supplied in a circumferential direction around the center axis from the introduction ports.
    Type: Application
    Filed: December 5, 2017
    Publication date: June 14, 2018
    Inventors: Munehito KAGAYA, Ayuta SUZUKI, Kosuke YAMAMOTO, Tsuyoshi MORIYA, Kazuyoshi MATSUZAKI
  • Publication number: 20180158671
    Abstract: A film forming apparatus includes a gas injection unit having a shower plate provided with gas injection holes, and a plurality of partition regions through which gases are separately injected and which are defined by dividing an arrangement region of the gas injection holes into a plurality of concentric regions in a diametrical direction of the substrate. A supply amount of a raw material gas per unit time in a raw material gas supply period in a cycle of forming a monomolecular layer by supplying the raw material gas and a reactant gas multiple times, and per unit area of the shower plate, and/or a supply amount of the reactant gas per unit time in a reaction period of the raw material gas and the reactant gas in the cycle, and per unit area of the shower plate becomes different in at least two of the partition regions.
    Type: Application
    Filed: December 7, 2017
    Publication date: June 7, 2018
    Inventors: Ayuta SUZUKI, Kosuke YAMAMOTO, Kazuyoshi MATSUZAKI, Munehito KAGAYA, Tsuyoshi MORIYA, Tadashi MITSUNARI, Atsushi KUBO
  • Publication number: 20180155830
    Abstract: A gas supply and exhaust structure, for supplying and exhausting a raw material gas into and from a chamber having a substrate mounting surface at a position corresponding to a central portion of an inner top surface, includes a side gas supply unit having gas supply ports arranged circumferentially and vertically on an inner side surface of the chamber and configured to supply the raw material gas through the gas supply ports toward a central axis of the chamber, and an exhaust unit having a gas exhaust port formed at the central portion of the inner top surface of the chamber and configured to exhaust the raw material gas. The inner top surface has an inclined surface inclined such that a distance between the inner top surface and an inner bottom surface of the chamber becomes smaller from the inner side surface toward the central axis.
    Type: Application
    Filed: December 6, 2017
    Publication date: June 7, 2018
    Inventors: Ayuta SUZUKI, Kosuke Yamamoto, Kazuyoshi Matsuzaki, Munehito Kagaya, Tsuyoshi Moriya, Tadashi Mitsunari
  • Patent number: 9661290
    Abstract: An image processing method includes: receiving a captured image, determining block statistics which indicates image characteristics of each of a plurality of blocks by using the plurality of blocks obtained by dividing the captured image determining a shading estimation coefficient to be applied to the captured image by using the determined block statistics and an amount of infrared light included in a light source, and correcting shading of the captured image by using the determined shading estimation coefficient.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: May 23, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Tsuyoshi Moriya
  • Patent number: 9627184
    Abstract: A plasma processing apparatus includes a processing chamber, in which a wafer W is plasma-processed, and a CPU controlling an operation of each component. A processing gas is introduced into the processing chamber under a first condition defined by a flow rate and a molecular weight of the processing gas, specifically based on a magnitude of a product A1 (=Q1√óm1) of the flow rate Q1 and the molecular weight m1 of the processing gas, and a surface of the wafer W is physically or chemically etched. And then, a pre-purge gas which may be identical to or different from the processing gas is introduced into the processing chamber through a shower head under a second condition derived from the first condition.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: April 18, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Tsuyoshi Moriya, Hiroyuki Nakayama, Hiroshi Nagaike
  • Publication number: 20170032983
    Abstract: A thermal catalytic layer is formed on the inner surface of a processing container and heated. Thus, when a sublimate sublimated from a coating film on a wafer W and received within the processing container reaches the vicinity of the thermal catalytic layer, the sublimate is decomposed and removed by the thermal activation of the thermal catalytic layer. In removing a sublimate attached to a light transmission window, a cleaning substrate formed with the thermal catalytic layer on the surface thereof is carried into the processing container and caused to approach the light transmission window. Thereafter, the cleaning substrate is heated so that the sublimate attached to the surface of the light transmission window is removed.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 2, 2017
    Inventors: Koshi MUTA, Tsuyoshi MORIYA, Takuya MORI, Kazuhiro TAKESHITA, Tomonori ESAKI, Kouichi MIZUNAGA, Masataka TANAKA, Kouzou KANAGAWA, Keigo NAKANO
  • Patent number: 9441292
    Abstract: Etching is performed through the following process. A substrate is loaded into a processing chamber and mounted on a mounting table therein. Then, in the state where a ring member at least a surface of which is made of a same material as a main component of an etching target film is provided to surround the substrate, a processing gas is injected in a shower-like manner from a gas supply unit oppositely facing the substrate and the etching target film is etched by using a plasma of the processing gas; and evacuating the inside of the processing chamber through an exhaust path. Through this process, unbalanced distribution of plasma active species in the vicinity of a circumferential edge portion of the substrate can be suppressed.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: September 13, 2016
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Ayuta Suzuki, Songyun Kang, Tsuyoshi Moriya, Nobutoshi Terasawa, Yoshiaki Okabe
  • Publication number: 20160155217
    Abstract: An image processing method includes: receiving a captured image, determining block statistics which indicates image characteristics of each of a plurality of blocks by using the plurality of blocks obtained by dividing the captured image determining a shading estimation coefficient to be applied to the captured image by using the determined block statistics and an amount of infrared light included in a light source, and correcting shading of the captured image by using the determined shading estimation coefficient.
    Type: Application
    Filed: November 23, 2015
    Publication date: June 2, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Tsuyoshi MORIYA
  • Patent number: 9209010
    Abstract: A substrate cleaning method includes removing a foreign material attached to a substrate while preventing deterioration of the substrate and any film formed on or above the substrate. A cleaning gas at a pressure between 0.3 MPa and 2.0 MPa is sprayed towards a wafer W with attached foreign material 22 placed in a near-vacuum, producing clusters 21 made up of a multitude of gas molecules 20, and the clusters 21 collide with the wafer W without undergoing ionization.
    Type: Grant
    Filed: February 3, 2011
    Date of Patent: December 8, 2015
    Assignees: TOKYO ELECTRON LIMITED, IWATANI CORPORATION
    Inventors: Hidefumi Matsui, Tsuyoshi Moriya, Masaki Narushima
  • Publication number: 20150246317
    Abstract: Provided is a method for producing a filtration filter capable of purifying with high accuracy and largely improving filtration efficiency. A flow path forming film is formed on a substrate. A plurality of grooves is formed on the flow path forming film along a surface of the substrate by etching. The grooves are filled with a sacrificial film. The flow path forming film and the sacrificial film are planarized by polishing the sacrificial film. A flow path sealing film is formed on the planarized flow path forming film and sacrificial film. An inlet hole and an outlet hole are formed through the substrate and the flow path sealing film, respectively, so that parts of the sacrificial film are exposed through the inlet hole and the outlet hole. The sacrificial film is removed using the inlet hole and the outlet hole and the filtration flow paths are formed by the grooves.
    Type: Application
    Filed: September 11, 2013
    Publication date: September 3, 2015
    Inventors: Tsuyoshi Moriya, Sensho Kobayashi, Kenichi Kagawa, Tsutomu Sakurabayashi