Abstract: An apparatus for performing a selenization and sulfurization process on a glass substrate is introduced. A low-cost, non-toxic selenization and sulfurization process is performed on a large-area glass substrate in a normal-pressure environment with the apparatus to turn element selenium or sulfur into small molecules of high activity at high temperature by pyrolysis or by plasma, especially linear atmospheric pressure plasma. The process is finalized by dispersing the selenium or sulfur molecules uniformly and allowing the glass substrate to undergo reciprocating motion precisely, thereby achieving large-area, uniform selenization and sulfurization of the one-piece glass substrate.

Abstract: An anonymity authentication method for wireless sensor networks is provided. A smart card carried by a user is used to provide two-factor verification protection. Moreover, a random factor and a hash function operation are introduced for participating an operation of the transmitted messages in all phases. Moreover, the operation of the transmitted messages uses only hash function and XOR operator.

Abstract: The present invention relates to compounds of formula I: in which p, q, Y1, Y2, R1, R2a, R2b, R3a, R3b, R4a, R4b, R5a, R5b, R7 and R8 are defined in the Summary of the Invention; capable of inhibiting the activity of SHP2. The invention further provides a process for the preparation of compounds of the invention, pharmaceutical preparations comprising such compounds and methods of using such compounds and compositions in the management of diseases or disorders associated with the aberrant activity of SHP2.

Abstract: A light mask type optical device includes an optical element. The optical element is formed by a light inlet face, a light outlet face opposite to the light inlet face, and a plurality of grating structures of micro meter (?m) scale disposed on the light outlet face. The grating structure includes a first slant face, a second slant face, and a plane surface between the first slant face and the second slant face. In application, a direct downward light emitted by a light source is reflected by the first slant face and the second slant face, to form a circulating light in the grating structure, and that is combined with the direct downward light to output from the light outlet face in achieving reduced glare and increased lumen in application.

Abstract: An image sensor includes a substrate, dual-waveband photosensitive devices, at least one infrared photosensitive device, a transparent dielectric layer, at least one infrared band-pass filter, a color filter layer and a micro-lens layer. The dual-waveband photosensitive devices are disposed in the substrate, and each dual-waveband photosensitive device is configured to sense an infrared light and one visible light. The infrared photosensitive device is disposed in the substrate, in which the dual-waveband photosensitive devices and the infrared photosensitive device are arranged in an array. The transparent dielectric layer is disposed over the dual-waveband photosensitive devices and the infrared photosensitive device. The infrared band-pass filter is disposed in the transparent dielectric layer and corresponds to the infrared photosensitive device. The color filter layer is disposed to cover the transparent dielectric layer and the infrared band-pass filter.

Abstract: A positioning signal receiver that includes an electromagnetic wave receiver, a mechanical wave receiver and a processing circuit is provided. The electromagnetic wave receiver receives electromagnetic wave signals for indicating positions of positioning signal transmitters and for triggering the positioning signal transmitters to generate mechanical wave signals. The mechanical wave receiver receives the mechanical wave signals. The processing circuit is coupled to the electromagnetic wave receiver and the mechanical wave receiver and determines the positions of the positioning signal transmitters according to the first electromagnetic wave signals, determines signal transmission times of the mechanical wave signals and determines distances each between one of the positioning signal transmitters and the positioning signal receiver according to the signal transmission times.

Abstract: The instant disclosure relates to a chassis structure for industrial uninterruptible power supply system including: a chassis having a frame and a front side panel, left side panel, right side panel, rear side panel and top panel installed on the frame; the chassis has a plurality of spacer on the bottom thereof for lifting the chassis from the ground for a distance to forming a gas-intake space; a plurality of protective plates disposed around the gas-intake space, each protective plate has a plurality of gas-intake hole; a bottom plate structure disposed between the bottom of the chassis and the gas-intake space and has at least a gas-intake gap; at least a venting hole disposed on the top panel of the chassis, each venting hole has at least an exhaust fan for outputting a gas from the chassis.

Abstract: A semiconductor device includes a first semiconductor chip including a first substrate, a plurality of first dielectric layers and a plurality of conductive lines formed in the first dielectric layers over the first substrate. The semiconductor device further includes a second semiconductor chip having a surface bonded to a first surface of the first semiconductor chip, the second semiconductor chip including a second substrate, a plurality of second dielectric layers and a plurality of second conductive lines formed in the second dielectric layers over the second substrate. The semiconductor device further includes a first conductive feature extending from the first semiconductor chip to one of the plurality of second conductive lines, and a first seal ring structure extending from the first semiconductor chip to the second semiconductor chip.

Abstract: A positional stop device includes a base body, a lever, a driving element, and a retaining member. The lever is rotatablely arranged on the base body, a first end of the lever couples to the driving element, and a second end of the lever couples to the retaining member. The driving element is partially exposed out of the base body. The retaining member is moveablely received in the base body. When the slider of a pneumatic rodless cylinder slides along a first direction, the driving element is driven by the slider to move along a second direction and be fully received in the base body. The lever is driven by the driving element to rotate around the base body. The retaining member is driven by the lever to move along a third direction and to be partially exposed out of the base body to stops the slider from sliding.

Abstract: A personal wearable headband having far infrared and temperature measurement functions includes a headband body defining a headband receiving space and having a plurality of far infrared particles blended in the headband body, a window communicating with the headband receiving space, and a through hole communicating with the headband receiving space and opposite to the window. A temperature measuring unit is disposed in the headband receiving space and includes a temperature measuring element configured to contact the forehead of a user for detecting a temperature thereof, and a display screen corresponding in position to the window and configured to display the temperature detected by the temperature measuring element.

Abstract: Methods for glass removal while forming CMOS image sensors. A method for forming a device is provided that includes forming a plurality of pixel arrays on a device wafer; bonding a carrier wafer to a first side of the device wafer; bonding a substrate over a second side of the device wafer; thinning the carrier wafer; forming electrical connections to the first side of the device wafer; subsequently de-bonding the substrate from the second side of the device wafer; and subsequently singulating individuals ones of the plurality of pixel arrays from the device wafer. An apparatus is disclosed.

Abstract: A wearable step-counting shoe includes a shoe body and a pedometer. The shoe body includes a shoe sole having opposite inner and outer sides, and a groove surface defining amounting groove. The pedometer is removably disposed in the mounting groove and includes a pedometer body having opposite first and second faces and configured to detect and record the number of steps taken by a user, and a screen disposed on the second face and configured to display the detected number of steps. An engaging unit is provided to fix the pedometer on the shoe body, and includes a first engaging portion provided on the groove surface, and a second engaging portion provided on the pedometer and releasably engageable with the first engaging portion.

Abstract: A testing apparatus for testing a circuit board is disclosed, which includes an upper plate, a lower plate, and an adaptor circuit board. A plurality of positioning units is received in the lower plate. Each positioning unit has a plurality of length-variable test probes secured therein. Each test probe has a shell and upper and lower probe ends at opposite ends of the shell. In test, the circuit board is put on the lower plate and the upper plate is lowered to push the circuit board and the lower plate toward the adaptor circuit board. The upper ends of the test probes engage with electrical connectors of the circuit board and the lower ends thereof engage with the adaptor circuit board whereby test of the circuit board can be automatically performed by the testing apparatus.

Abstract: The present disclosure discloses a chemical mechanical polishing apparatus including a polishing machine platform, an electrode film, a polishing pad and a wafer carrier. The electrode film has a first single electrode structure and is disposed on the polishing machine platform. The polishing pad is disposed on the electrode film. The wafer carrier is disposed on the polishing machine platform. In particular, the first single electrode structure generates a first homopolar electric field on the polishing pad.

Abstract: A semiconductor device and method of manufacture are provided in which a passivation layer is patterned. In embodiments, by-products from the patterning process are removed using the same etching chamber and at the same time as the removal of a photoresist utilized in the patterning process. Such processes may be used during the manufacturing of FinFET devices.

Abstract: A semiconductor device includes a first semiconductor chip including a first substrate, a plurality of first dielectric layers and a plurality of conductive lines formed in the first dielectric layers over the first substrate. The semiconductor device further includes a second semiconductor chip having a surface bonded to a first surface of the first semiconductor chip, the second semiconductor chip including a second substrate, a plurality of second dielectric layers and a plurality of second conductive lines formed in the second dielectric layers over the second substrate. The semiconductor device further includes a first conductive feature extending from the first semiconductor chip to one of the plurality of second conductive lines, and a first seal ring structure extending from the first semiconductor chip to the second semiconductor chip.

Abstract: This invention is related to a method for producing polymer latex particle coated with silver nanoparticles. First, a polymer latex particle suspension is mixed with a silver nitrate solution in a weight ratio of 10:1 to 1:10 at 50° C. to 90° C. for 10 to 120 minutes to form a mixed solution. After the temperature of the mix solution is cooled to 50° C. to 85° C., a sodium citrate solution is added to react with the mixed solution for 10 to 240 minutes to form a polymer latex particle coated with silver nanoparticles, which has antibacterial activity.

Abstract: In some embodiments in accordance with the present disclosure, an image sensor is provided. The image sensor includes a substrate having a body. The body includes a first surface and a second surface opposite to the first surface. A through via is configured to extend from the first surface to the second surface. An intermediate layer is disposed over the body and configured to cover the through via. An image sensing device is disposed over the intermediate layer. In addition, a lens structure is disposed over the substrate, the intermediate layer and the image sensing device. In certain embodiments, the image sensing device is curved. In some embodiments, the image sensing device includes a semiconductor chip having a CMOS image sensing array.

Abstract: A method includes forming a capacitor, which includes depositing a bottom electrode layer, depositing a capacitor insulator layer over the bottom electrode layer, depositing a top electrode layer over the capacitor insulator layer, and depositing a dielectric layer over the top electrode layer. The dielectric layer is etched using a process gas until the top electrode layer is exposed. In the etching of the dielectric layer, the dielectric layer has a first etching rate, and the top electrode layer has a second etching rate, and a ratio of the first etching rate to the second etching rate is higher than about 5.0.

Abstract: A method includes depositing a mask layer over a dielectric layer, patterning the mask layer to form a trench, applying a patterned photo resist having a portion over the mask layer, and etching the dielectric layer using the patterned photo resist as an etching mask to form a via opening, which is in a top portion of the dielectric layer. The method further includes removing the patterned photo resist, and etching the dielectric layer to form a trench and a via opening underlying and connected to the trench. The dielectric layer is etched using the mask layer as an additional etching mask. A polymer formed in at least one of the trench and the via opening is removed using nitrogen and argon as a process gas. The trench and the via opening are filled to form a metal line and a via, respectively.