Patents by Inventor Tung Chen

Tung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10104545
    Abstract: An anonymity authentication method for wireless sensor networks is provided. A smart card carried by a user is used to provide two-factor verification protection. Moreover, a random factor and a hash function operation are introduced for participating an operation of the transmitted messages in all phases. Moreover, the operation of the transmitted messages uses only hash function and XOR operator.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: October 16, 2018
    Assignee: NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY
    Inventor: Chi-Tung Chen
  • Patent number: 10093646
    Abstract: The present invention relates to compounds of formula I: in which m, Y1, Y2, Y3, R1, R2a, R2b, R3a, R3b, R4a, R4b, R5a and R5b are defined in the Summary of the Invention; capable of inhibiting the activity of SHP2. The invention further provides a process for the preparation of compounds of the invention, pharmaceutical preparations comprising such compounds and methods of using such compounds and compositions in the management of diseases or disorders associated with the aberrant activity of SHP2.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: October 9, 2018
    Assignee: Novartis AG
    Inventors: Christine Hiu-Tung Chen, Zhuoliang Chen, Jorge Garcia Fortanet, Denise Grunenfelder, Rajesh Karki, Mitsunori Kato, Matthew J. LaMarche, Lawrence Blas Perez, Travis Matthew Stams, Sarah Williams
  • Publication number: 20180284327
    Abstract: An anti-glare wear-resistant cover plate including a cover plate body is provided. The cover plate body has a plurality of microstructures located at an anti-glare side of the cover plate body. The plurality of microstructures has a plurality of top surfaces, wherein a change in slope of a section line of each of the plurality of top surfaces on a reference plane perpendicular to the cover plate body is continuous. A manufacturing method of the anti-glare wear-resistant cover plate is also provided.
    Type: Application
    Filed: March 27, 2018
    Publication date: October 4, 2018
    Applicant: HENGHAO TECHNOLOGY CO., LTD
    Inventors: Chun-Jung Chen, Yu-Tung Chen, Chin-Chang Liu
  • Publication number: 20180269161
    Abstract: A hybrid-bonding structure and a method for forming a hybrid-bonding structure are provided. The hybrid-bonding structure includes a first semiconductor substrate, a first conductive line and a first dielectric dummy pattern. The first conductive line is formed over the first semiconductor substrate. A surface of the first conductive line is configured to hybrid-bond with a second conductive line over a second semiconductor substrate. The first dielectric dummy pattern is formed over the first semiconductor substrate and embedded in the first conductive line.
    Type: Application
    Filed: March 17, 2017
    Publication date: September 20, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kuo-Ming WU, Kuan-Liang LIU, Pao-Tung CHEN
  • Patent number: 10077276
    Abstract: The present invention relates to compounds of formula I: in which p, q, Y1, Y2, R1, R2a, R2b, R3a, R3b, R4a, R4b, R5a, R5b, R7 and R8 are defined in the Summary of the Invention; capable of inhibiting the activity of SHP2. The invention further provides a process for the preparation of compounds of the invention, pharmaceutical preparations comprising such compounds and methods of using such compounds and compositions in the management of diseases or disorders associated with the aberrant activity of SHP2.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: September 18, 2018
    Assignee: Novartis AG
    Inventors: Christine Hiu-Tung Chen, Zhuoliang Chen, Michael Dore, Jorge Garcia Fortanet, Rajesh Karki, Mitsunori Kato, Matthew J. LaMarche, Lawrence Blas Perez, Troy Douglas Smith, Sarah Williams, John William Giraldes, Martin Sendzik, Bakary-Barry Toure
  • Patent number: 10062721
    Abstract: A device includes an image sensor chip having formed therein an elevated photodiode, and a device chip underlying and bonded to the image sensor chip. The device chip has a read out circuit electrically connected to the elevated photodiode.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: August 28, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Pao-Tung Chen, Jen-Cheng Liu, Dun-Nian Yaung
  • Publication number: 20180233490
    Abstract: A three-dimensional (3D) integrated circuit (IC) die is provided. In some embodiments, a first IC die comprises a first semiconductor substrate, a first interconnect structure over the first semiconductor substrate, and a first hybrid bond (HB) structure over the first interconnect structure. The first HB structure comprises a HB link layer and a HB contact layer extending from the HB link layer to the first interconnect structure. A second IC die is over the first IC die, and comprises a second semiconductor substrate, a second HB structure, and a second interconnect structure between the second semiconductor substrate and the second HB structure. The second HB structure contacts the first HB structure. A seal-ring structure is in the first and second IC dies. Further, the seal-ring structure extends from the first semiconductor substrate to the second semiconductor substrate, and is defined in part by the HB contact layer.
    Type: Application
    Filed: April 17, 2018
    Publication date: August 16, 2018
    Inventors: Yi-Shin Chu, Kuan-Chieh Huang, Pao-Tung Chen, Shuang-Ji Tsai, Yi-Hao Chen, Feng-Kuei Chang
  • Publication number: 20180201623
    Abstract: The present invention relates to compounds of formula I: in which p, q, Y1, Y2, R1, R2a, R2b, R3a, R3b, R4a, R4b, R5a, R5b, R7 and R8 are defined in the Summary of the Invention; capable of inhibiting the activity of SHP2. The invention further provides a process for the preparation of compounds of the invention, pharmaceutical preparations comprising such compounds and methods of using such compounds and compositions in the management of diseases or disorders associated with the aberrant activity of SHP2.
    Type: Application
    Filed: February 20, 2018
    Publication date: July 19, 2018
    Inventors: Christine Hiu-Tung Chen, Zhuoliang Chen, Michael Dore, Jorge Garcia Fortanet, John William Giraldes, Rajesh Karki, Mitsunori Kato, Matthew J. LaMarche, Lawrence Blas Perez, Martin Sendzik, Troy Douglas Smith, Bakary-Barry Toure, Sarah Williams
  • Publication number: 20180188353
    Abstract: A tracking system includes a first device and a second device. The second device comprises an optical module, an ultrasonic module and a processor. The optical module is configured to capture image data in a first detection field. The ultrasonic module is configured to collect ultrasonic data in a second detection field different from the first detection field. The processor is configured to determine a relative position of a target device relative to the tracking device in a third detection field according to the image data and the ultrasonic data. The third detection field is larger than the first detection field and larger than the second detection field.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 5, 2018
    Inventor: Yuan-Tung CHEN
  • Publication number: 20180180711
    Abstract: A positioning system and method thereof are provided in this disclosure. The positioning method includes steps of: emitting a radiation from a first electronic apparatus to a second electronic apparatus and starting to accumulate a time count; sensing the radiation on the second electronic apparatus and sending a first ultrasonic signal from the second electronic apparatus to the first electronic apparatus; sensing the first ultrasonic signal by a plurality of ultrasound sensors on the first electronic apparatus and calculating a plurality of first time periods started from the radiation is emitted until the first ultrasonic signal is sensed by the ultrasound sensors; calculating a plurality of first relative distances between the ultrasound sensors and a first ultrasound emitter on the second electronic apparatus; and locating a first relative position of the second electronic apparatus relative to the first electronic apparatus according to the first relative distances.
    Type: Application
    Filed: December 26, 2017
    Publication date: June 28, 2018
    Inventors: Yuan-Tung CHEN, Tzu-Chieh YU
  • Publication number: 20180180712
    Abstract: A tracking system includes a first device and a second device. The first device includes plural ultrasonic sources and an inertial measurement unit configured to detect inertial data. The second device includes at least one ultrasonic receiver and a processor. The processor is configured to receive the inertial data, estimate an orientation of the first device according to the received inertial data, determine a first ultrasonic transmitter from the ultrasonic transmitters according to the orientation of the first device and a location of the first device, and send an enablement command about the first ultrasonic transmitter to the first device. The enabled transmitter of the ultrasonic transmitters sends ultrasounds according to the enablement command, the at least one ultrasonic receiver is configured to receive the ultrasounds from the first ultrasonic transmitter, and the processor determines the location of the first device according to the received ultrasounds.
    Type: Application
    Filed: December 26, 2017
    Publication date: June 28, 2018
    Inventors: Yuan-Tung CHEN, Kun-Chun TSAI
  • Patent number: 10008559
    Abstract: A method includes forming a capacitor, which includes depositing a bottom electrode layer, depositing a capacitor insulator layer over the bottom electrode layer, depositing a top electrode layer over the capacitor insulator layer, and depositing a dielectric layer over the top electrode layer. The dielectric layer is etched using a process gas until the top electrode layer is exposed. In the etching of the dielectric layer, the dielectric layer has a first etching rate, and the top electrode layer has a second etching rate, and a ratio of the first etching rate to the second etching rate is higher than about 5.0.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: June 26, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Hao Chen, Che-Cheng Chang, Wen-Tung Chen, Yu-Cheng Liu, Horng-Huei Tseng
  • Publication number: 20180174310
    Abstract: An object tracking method includes configuring a color of a first illuminating object to vary in a first pattern, capturing the first illuminating object according to a first color during a first time period, and capturing the first illuminating object according to a second color during a second time period after the first time period, wherein the second color is different from the first color.
    Type: Application
    Filed: November 26, 2017
    Publication date: June 21, 2018
    Inventors: Yuan-Tung CHEN, Tzu-Yin CHANG, Hsu-Hong FENG
  • Publication number: 20180148816
    Abstract: A copper alloy wire and a manufacturing method thereof are provided. The copper alloy wire includes: by weight percentage of components, 0.3 to 0.45 of argent, 0.01 to 0.02 of titanium, and a remaining part that is formed by copper and unavoidable impurities. The method for manufacturing the copper alloy wire is performing two-phase vacuum melting: first performing vacuum electric arc melting into a copper-titanium mother alloy, and then performing vacuum induction melting with remaining components into a copper alloy wire material by means of continuous casting; then drawing the copper alloy wire material into a copper alloy fine wire by a non-slip wire drawing device in a material even-flow wire drawing manner, and finally performing thermal treatment on the copper alloy fine wire by using argon as a protection gas, so as to complete a process of the copper alloy wire.
    Type: Application
    Filed: November 28, 2016
    Publication date: May 31, 2018
    Inventors: Tung-Chen CHENG, Chen-Hsueh CHIANG, Chia-Hao HSU
  • Patent number: 9983080
    Abstract: A high-temperature gas pressure measuring method includes a pressure measuring gas housing dividing step for dividing a pressure measuring gas housing into a pressure measuring room and a pressure referring room by a metal diaphragm; a gas introducing step for introducing high temperature gas into the pressure measuring room and introducing a reference pressure gas into the pressure referring room; a displacement measuring step for measuring a displacement of the metal diaphragm, wherein the displacement is caused by pressure difference between the two rooms in pressure measuring gas housing; and a pressure determining step for measuring the pressure of a high-temperature and/or corrosive to-measure pressure gas. The method dispenses with any corrosion-resistant and heat-resistant pressure sensing component and thus cuts costs.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: May 29, 2018
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yih-Hsing Wang, Wen-Chueh Pan, Ming-June Lin, Jen-Chieh Li, Tien-Fu Wu, Tsan-Tung Chen
  • Publication number: 20180143696
    Abstract: A body posture detection system includes an inertial measurement unit, at least two ultrasonic transceivers and a processor. The inertial measurement unit is configured to retrieve an orientation vector of a first portion of a human body. The ultrasonic transceivers are mounted on the first portion and a second portion of the human body respectively. The processor is configured to generate a candidate gesture range of the first portion according to the orientation vector. The processor is configured to measure a distance between the first portion and the second portion according to an ultrasound transmitted between the ultrasonic transceivers. The processor is further configured to determine a current gesture of the first portion from the candidate gesture range according to the distance.
    Type: Application
    Filed: November 21, 2017
    Publication date: May 24, 2018
    Inventor: Yuan-Tung CHEN
  • Publication number: 20180143317
    Abstract: A positioning device includes an optical sensor, an ultrasonic transceiver and a processor. The optical sensor is configured to obtain a depth image. The ultrasonic transceiver is configured to send an ultrasound and receive an ultrasound reflection. The processor is configured to target a reflective surface in the depth image, recognize a salient feature corresponding to the reflective surface in the ultrasound reflection, estimate a distance between the positioning device and reflective the surface according to a first response time of the salient feature in the ultrasound reflection.
    Type: Application
    Filed: November 21, 2017
    Publication date: May 24, 2018
    Inventor: Yuan-Tung Chen
  • Patent number: 9972603
    Abstract: A three-dimensional (3D) integrated circuit (IC) die is provided. In some embodiments, a first IC die comprises a first semiconductor substrate, a first interconnect structure over the first semiconductor substrate, and a first hybrid bond (HB) structure over the first interconnect structure. The first HB structure comprises a HB link layer and a HB contact layer extending from the HB link layer to the first interconnect structure. A second IC die is over the first IC die, and comprises a second semiconductor substrate, a second HB structure, and a second interconnect structure between the second semiconductor substrate and the second HB structure. The second HB structure contacts the first HB structure. A seal-ring structure is in the first and second IC dies. Further, the seal-ring structure extends from the first semiconductor substrate to the second semiconductor substrate, and is defined in part by the HB contact layer.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: May 15, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Shin Chu, Kuan-Chieh Huang, Pao-Tung Chen, Shuang-Ji Tsai, Yi-Hao Chen, Feng-Kuei Chang
  • Patent number: RE46942
    Abstract: The present invention provides for compounds of formula (I): wherein R1-R4 and n are defined herein. The present invention also provides for pharmaceutical compositions and combinations comprising a compound of formula (I) as well as for the use of such compounds as tankyrase inhibitors and in the treatment of Wnt signaling and tankyrase 1 and 2 signaling related disorders which include, but are not limited to, cancer.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: July 10, 2018
    Assignee: Novartis AG
    Inventors: Christine Hiu-Tung Chen, Donovan Noel Chin, Lucien V. DiPietro, Jianmei Fan, Mark G. Palermo, Michael David Shultz, Bakary-Barry Toure
  • Patent number: D826229
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: August 21, 2018
    Assignee: Dell Products, L.P.
    Inventors: Erene Teo, Chun Long Goh, Tung Chen Wu, Toshiyuki Tanaka, Joshua Y. Probst, Khang Chian Yong