Patents by Inventor Tzyy-Jang Tseng

Tzyy-Jang Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming thermal conductive structure on printed circuit board
    Patent number: 6032355
    Abstract: A method of manufacturing a thermal conductive structure on a printed circuit board comprises the steps of forming a thermal conductive layer having an embossed pattern on its surface, and then forming an adhesive glue layer over the thermal conductive layer. Next, a surface metallic layer is attached to the thermal conductive layer and the glue layer, wherein a portion of the surface metallic layer corresponding to the embossed portion of the heat spreader is in direct contact or almost direct contact with the thermal conductive layer. Furthermore, an additional external heat sink can be attached to thermal conductive structure for increasing the efficiency of heat dissipation.
    Type: Grant
    Filed: August 6, 1998
    Date of Patent: March 7, 2000
    Assignee: World Wiser Electronics, Inc.
    Inventors: Tzyy-Jang Tseng, David C. H. Cheng