Abstract: A method of detecting and preventing over current induced system failure is provided. An OC protect controller monitors a CPU total power consumption based on received CPU activity information. In response to the monitoring, if the CPU power consumption is over a threshold, then the OC protect controller outputs a frequency dithering control signal to reduce the CPU clock frequency such that the CPU does not reach an OC limit. The OC protect controller also outputs a PLL frequency control signal to reduce the PLL clock frequency to improve system efficiency.

Abstract: A portable device is provided. A first processor performs an initial procedure according to an operation clock with a first frequency value and an operation voltage with a first voltage value, and performs a calibration procedure according to the operation clock with a second frequency value and the operation voltage with a second voltage value when the initial procedure has been performed and a self-calibration event is present. A second processor detects whether a specific function of the calibration procedure is being performed by the first processor. The second processor stores the second frequency value and the second voltage value into a storage unit after the calibration procedure is performed. The second voltage value is lower than the first voltage value, and the second frequency value is lower than the first frequency value.

Abstract: A processing device performs dual-rail power equalization for its memory cell array and logic circuitry. The memory cell array is coupled to a first power rail through a first switch to receive a first voltage level. The logic circuitry is coupled to a second power rail through a second switch to receive a second voltage level that is different from the first voltage level. The processing device also includes a power switch coupled to at least the second power rail and operative to be enabled to equalize voltage supplied to the memory cell array and the logic circuitry.

Abstract: According to an embodiment of the present invention, a chip package is provided. The chip package includes a substrate. A chip is disposed on the substrate. A stiffener is disposed on the substrate. The thermal conductivity of the stiffener is higher than the thermal conductivity of the substrate.

Abstract: A control method for a clock signal for a CPU contained in a CMOS circuit includes: when a load current for the CMOS circuit is enabled, generating a first clock signal; in a first period, selectively gating certain cycles of the first clock signal to generate a second clock signal which has a clock rate less than a clock rate of the first clock signal; and in a second period, dithering in the gated cycles to increase the clock rate of the second clock signal to be equal to that of the first clock signal. The second clock signal is continuously input to the CMOS circuit during the first period and the second period.

Abstract: A method of detecting and preventing over current induced system failure is provided. An OC protect controller monitors a CPU total power consumption based on received CPU activity information. In response to the monitoring, if the CPU power consumption is over a threshold, then the OC protect controller outputs a frequency dithering control signal to reduce the CPU clock frequency such that the CPU does not reach an OC limit. The OC protect controller also outputs a PLL frequency control signal to reduce the PLL clock frequency to improve system efficiency.

Abstract: A portable device is provided. A first processor performs an initial procedure according to an operation clock with a first frequency value and an operation voltage with a first voltage value, and performs a calibration procedure according to the operation clock with a second frequency value and the operation voltage with a second voltage value when the initial procedure has been performed and a self-calibration event is present. A second processor detects whether a specific function of the calibration procedure is being performed by the first processor. The second processor stores the second frequency value and the second voltage value into a storage unit after the calibration procedure is performed. The second voltage value is lower than the first voltage value, and the second frequency value is lower than the first frequency value.

Abstract: A processing device performs dual-rail power equalization for its memory cell array and logic circuitry. The memory cell array is coupled to a first power rail through a first switch to receive a first voltage level. The logic circuitry is coupled to a second power rail through a second switch to receive a second voltage level that is different from the first voltage level. The processing device also includes a power switch coupled to at least the second power rail and operative to be enabled to equalize voltage supplied to the memory cell array and the logic circuitry.

Abstract: The performance, thermal and power management system is configured to perform DVFS calibration, temperature compensation adjustment, aging calibration, and DC offset calibration in an IC. The initial voltage supplied to the IC maybe set to an initial value which takes chip-to-chip process variations into account and then dynamically adjusted according to temperature variations, DC offset and/or aging effects. Therefore, the performance, thermal and power management system may achieve optimized thermal and power performance of the IC.

Abstract: The performance, thermal and power management system is configured to perform DVFS calibration, temperature compensation adjustment, aging calibration, and DC offset calibration in an IC. The initial voltage supplied to the IC may be set to an initial value which takes chip-to-chip process variations into account and then dynamically adjusted according to temperature variations, DC offset and/or aging effects. Therefore, the performance, thermal and power management system may achieve optimized thermal and power performance of the IC.

Abstract: The performance, thermal and power management system is configured to perform DVFS calibration, temperature compensation adjustment, aging calibration, and DC offset calibration in an IC. The initial voltage supplied to the IC may be set to an initial value which takes chip-to-chip process variations into account and then dynamically adjusted according to temperature variations, DC offset and/or aging effects. Therefore, the performance, thermal and power management system may achieve optimized thermal and power performance of the IC.

Abstract: The performance, thermal and power management system is configured to perform DVFS calibration, temperature compensation adjustment, aging calibration, and DC offset calibration in an IC. The initial voltage supplied to the IC may be set to an initial value which takes chip-to-chip process variations into account and then dynamically adjusted according to temperature variations, DC offset and/or aging effects. Therefore, the performance, thermal and power management system may achieve optimized thermal and power performance of the IC.

Abstract: According to an embodiment of the present invention, a chip package is provided. The chip package includes a substrate. A chip is disposed on the substrate. A stiffener is disposed on the substrate. The thermal conductivity of the stiffener is higher than the thermal conductivity of the substrate.

Abstract: The performance, thermal and power management system is configured to perform DVFS calibration, temperature compensation adjustment, aging calibration, and DC offset calibration in an IC. The initial voltage supplied to the IC maybe set to an initial value which takes chip-to-chip process variations into account and then dynamically adjusted according to temperature variations, DC offset and/or aging effects. Therefore, the performance, thermal and power management system may achieve optimized thermal and power performance of the IC.

Abstract: The performance, thermal and power management system is configured to perform DVFS calibration, temperature compensation adjustment, aging calibration, and DC offset calibration in an IC. The initial voltage supplied to the IC may be set to an initial value which takes chip-to-chip process variations into account and then dynamically adjusted according to temperature variations, DC offset and/or aging effects. Therefore, the performance, thermal and power management system may achieve optimized thermal and power performance of the IC.

Abstract: The performance, thermal and power management system is configured to perform DVFS calibration, temperature compensation adjustment, aging calibration, and DC offset calibration in an IC. The initial voltage supplied to the IC may be set to an initial value which takes chip-to-chip process variations into account and then dynamically adjusted according to temperature variations, DC offset and/or aging effects. Therefore, the performance, thermal and power management system may achieve optimized thermal and power performance of the IC.

Abstract: A control method for a clock signal for a CPU contained in a CMOS circuit includes: when a load current for the CMOS circuit is enabled, generating a first clock signal; in a first period, selectively gating certain cycles of the first clock signal to generate a second clock signal which has a clock rate less than a clock rate of the first clock signal; and in a second period, dithering in the gated cycles to increase the clock rate of the second clock signal to be equal to that of the first clock signal. The second clock signal is continuously input to the CMOS circuit during the first period and the second period.

Abstract: An apparatus, system and method for asynchronously reducing power in a power domain. In one embodiment, the method includes: (1) receiving a sleep command for the power domain, (2) receiving, upon receiving the sleep command, an affirmative retention status signal denoting that a retention area in the power domain has stored data, (3) receiving, upon receiving the sleep command, an affirmative isolation status signal that denotes that an isolation of the power domain has occurred and (4) providing a power domain off command to the power domain upon receiving at least the sleep command, the affirmative status retention signal and the affirmative status isolation signal. In another embodiment, multiple enable signals are employed to generate a “glitch-free” control for a power switch.

Abstract: Memory power management systems and methods are provided. One embodiment of the present invention includes a memory power management system. The system comprises a first low dropout (LDO) regulator that provides an active operating voltage that is derived from a first supply voltage to power a memory array during an active mode. The system further comprises a second LDO regulator that provides a minimum memory retention voltage that is derived from a second supply voltage to power the memory array in a standby mode, wherein the second supply voltage also powers at least one peripheral circuit for reading from and/or writing to the memory array.

Abstract: Memory power management systems and methods are provided. One embodiment of the present invention includes a memory power management system. The system comprises a first low dropout (LDO) regulator that provides an active operating voltage that is derived from a first supply voltage to power a memory array during an active mode. The system further comprises a second LDO regulator that provides a minimum memory retention voltage that is derived from a second supply voltage to power the memory array in a standby mode, wherein the second supply voltage also powers at least one peripheral circuit for reading from and/or writing to the memory array.