Patents by Inventor Ung Lee

Ung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SALTCORE FOR DIE-CASTING WITH ALUMINUM AND MANUFACTURING METHOD THEREFOR
    Publication number: 20180178271
    Abstract: Provided herein are a saltcore for casting with aluminum and a manufacturing method thereof, and more particularly, a saltcore and a manufacturing method thereof capable of reducing shrinkage while satisfying strength during die-casting by including at least one cation of K+, Na+ and Mg2+ and at least one anion of Cl? and C032?, wherein a saltcore for casting with aluminum may include at least one cation of K+, Na+ and Mg2+ and at least one anion of Cl? and C032?.
    Type: Application
    Filed: April 28, 2017
    Publication date: June 28, 2018
    Applicant: Hyundai Motor Company
    Inventors: Ji-Yong LEE, Cheol-Ung LEE
  • SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20180138155
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package.
    Type: Application
    Filed: January 15, 2018
    Publication date: May 17, 2018
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Semiconductor package and manufacturing method thereof
    Patent number: 9935083
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Grant
    Filed: May 8, 2016
    Date of Patent: April 3, 2018
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi, Jin Seong Kim
  • SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20180057353
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.
    Type: Application
    Filed: November 7, 2017
    Publication date: March 1, 2018
    Inventors: Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang
  • DIFFERENTIAL CARRIER CASE WITH INSERTED PIPE FOR HIGH PRESSURE CASTING
    Publication number: 20170370464
    Abstract: A differential carrier case with an inserted pipe for high pressure casting may include a mold core into which a first end of a pipe is inserted, a mold core pin fixed to the mold core to fix the mold core and the first end of the pipe, a drive core pin inserted into a second end of the pipe, and a thick portion surrounding an outer portion of the pipe.
    Type: Application
    Filed: November 15, 2016
    Publication date: December 28, 2017
    Applicants: Hyundai Motor Company, Kia Motors Corporation, INZI AMT.co., ltd., Hyundai Dymos Incorporated
    Inventors: Mun-Gu Kang, Cheol-Ung Lee, Kwang-Min Yoon, Hyung-Sop Yoon, Jung-Hwan Jang, Kyui-Joo Park, Sung-Yong Jang, Yo-Sub Han, Hoon-Gab Choi, Seung-Un Lim
  • SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20170320723
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.
    Type: Application
    Filed: May 9, 2016
    Publication date: November 9, 2017
    Inventors: Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang
  • Semiconductor package and manufacturing method thereof
    Patent number: 9809446
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: November 7, 2017
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang
  • WASHING MACHINE
    Publication number: 20170211223
    Abstract: Disclosed herein are a washing machine including an air-stream guide configured to guide a rotating air-stream generated by rotation of the drum toward the spray opening. The washing machine having the circulation apparatus can prevent water or bubbles remaining in the tub and the pump room from flowing into the inside of the drum along the circulation path of the circulation apparatus, due to a pressure difference made between the center area and the outer area of the tub during spin-drying in which the drum rotates at high speed.
    Type: Application
    Filed: January 26, 2017
    Publication date: July 27, 2017
    Inventors: Hwang Mook Cho, Seung Youp Lee, In Cheol Jang, Geon Ung Lee, Doo Young Rou, Eung Ryeol Seo
  • SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20170141081
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Application
    Filed: May 8, 2016
    Publication date: May 18, 2017
    Inventors: Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi, Jin Seong Kim
  • SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20170018493
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Application
    Filed: May 8, 2016
    Publication date: January 19, 2017
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Microfluidic sensor package structure and method
    Patent number: 9513254
    Abstract: In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: December 6, 2016
    Assignee: Amkor Technology, Inc.
    Inventors: Hyung II Jeon, Ji Young Chung, Chan Ha Hwang, Byong Jin Kim, Yung Woo Lee, Do Hyun Na, Jae Ung Lee
  • DISH WASHING MACHINE
    Publication number: 20160095498
    Abstract: A dish washing machine having a structure improved to increase washing efficiency is provided. The dish washing machine includes a washing tub for washing dishes, an injection unit to inject washing water into the washing tub, and a deflection unit to move inside the washing tub to deflect the washing water injected from the injection unit toward the dishes. The deflection unit includes a first vane to be linearly movable in a direction in which the washing water is injected and a second vane to interwork with the first vane.
    Type: Application
    Filed: September 30, 2015
    Publication date: April 7, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwang Mook CHO, Jun Hong PARK, Eung Ryeol SEO, Gun Ung LEE, Seung-Mok LEE, Chang Wook LEE, Nam Soo PARK
  • RAPID SYNC METHOD FOR CLOUD FILE SYSTEM AND CLOUD FILE SYSTEM USING THE SAME
    Publication number: 20160063025
    Abstract: Disclosed is a synchronization method of a cloud file system that enables a portable terminal to not consume excessive amount of battery power for data synchronization with the portable terminal such as a smart phone, enables a portable terminal and a stationary user terminal such as a personal computer to upload and download data in an appropriate time, and prevents time delay caused by the excessive traffic, during the data synchronization.
    Type: Application
    Filed: October 22, 2014
    Publication date: March 3, 2016
    Inventor: Sun Ung LEE
  • METHOD OF SURFACE-TREATING ALUMINUM MATERIAL FOR DISSIPATING HEAT
    Publication number: 20150361575
    Abstract: The present application relates to a method of surface-treating an aluminum material for dissipating heat, which is capable of increasing the radiation heat flux to thus enhance heat dissipation performance, and includes anodizing an aluminum material using an electrolyte composed of oxalic acid, and forming cobalt sulfide (CoS) in surface pores of the aluminum material thus sealing the surface of the aluminum material.
    Type: Application
    Filed: November 4, 2014
    Publication date: December 17, 2015
    Inventors: Ji Yong LEE, Cheol Ung LEE, Kwang Min YOON, Tae Ho JEONG, Dong Hyun KIM, Jung Hoon LEE, Won Sub CHUNG
  • SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20150130054
    Abstract: A semiconductor package and a method for manufacturing a semiconductor package that comprises a unit substrate, for example to which a semiconductor chip is attached, embedded in a base substrate on which a semiconductor device may be mounted. The base substrate may, for example, comprise vias between top and bottom surfaces thereof and/or vias between the top surface of the base substrate and a top surface of the unit substrate embedded within the base substrate.
    Type: Application
    Filed: November 11, 2014
    Publication date: May 14, 2015
    Inventors: Jae Ung Lee, Byong Jin Kim, Yoon Ki Namkung, Se Man Oh
  • Semiconductor package and manufacturing method thereof
    Patent number: 9018741
    Abstract: A semiconductor package is presented which has a suitable structure for effectively shielding electromagnetic wave interference (EMI) in a cavity area to which a semiconductor chip is attached. The semiconductor package is assembled such that a lower substrate to which the semiconductor chip is attached is adhered to an EMI shielding & electric I/O body having various types of EMI shielding & electric I/O metal patterns by soldering. Further, the EMI shielding & electric I/O body is adhered to an upper substrate by soldering thereby simplifying assembling of the semiconductor package.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: April 28, 2015
    Inventors: Dong In Kim, Jae Ung Lee, Eunnara Cho, Min Ju Kim
  • MICROFLUIDIC SENSOR PACKAGE STRUCTURE AND METHOD
    Publication number: 20150041324
    Abstract: In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.
    Type: Application
    Filed: August 11, 2014
    Publication date: February 12, 2015
    Inventors: Hyung Il Jeon, Ji Young Chung, Chan Ha Hwang, Byong Jin Kim, Yung Woo Lee, Do Hyun Na, Jae Ung Lee
  • Semiconductor device with micro electromechanical system die
    Patent number: 8921955
    Abstract: In one embodiment, a miniaturized, multi-function, highly integrated and high performance semiconductor device or package includes a microphone implemented using a MEMS (Micro Electro Mechanical System) die. The semiconductor device includes a leadframe and a body collectively defining a port hole. The port hole facilitates the exposure of a diaphragm of the MEMS die in the semiconductor device.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: December 30, 2014
    Assignee: Amkor Technology, Inc.
    Inventors: Jae Ung Lee, Byong Jin Kim, Hyung Il Jeon, Eun Jung Jo, Koo Woong Jeong
  • Semiconductor memory apparatus and test circuit therefor
    Patent number: 8873272
    Abstract: Disclosed is a semiconductor memory apparatus, including: a memory cell array configured to include a plurality of memory cells; a switching unit configured to be coupled to data input and output pads and control a data transfer path of data applied to the data input and output pads in response to a test mode signal; a write driver configured to drive data transferred from the switching unit and write the data in the memory cell array at a normal mode; and a controller configured to transfer the data from the switching unit to the memory cell at a test mode.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: October 28, 2014
    Assignee: SK Hynix Inc.
    Inventor: Jae Ung Lee
  • Connecting molding for automation of three-phase motor winding
    Patent number: 8829748
    Abstract: The present invention relates to a connection molding for automation of a three-phase motor winding, which specifically comprises: a fixed coil part fixed inside of a main body, a coil part installed within the fixed coil part, a central shaft fixed to the main body and passing through the coil part, and a connector part coupled to the top of the coil part so that the coil of the coil part is connected thereto and the central shaft passes and is coupled therethrough.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: September 9, 2014
    Assignee: Hyundam Industrial Co., Ltd.
    Inventors: Jin Wook Jang, Yong Taek Hang, Jong Ung Lee, Il Kyu Choi