Abstract: A semiconductor package may include a substrate. A conductive bump may be provided on a bottom surface of the substrate. A semiconductor chip may be provided on a top surface of the substrate. A sealing material may seal the semiconductor chip on the top of the substrate. A first conductive adhesive may be provided on a top surface of the sealing material. A second conductive adhesive may be provided on a side surface of the substrate and a side surface of the sealing material.

Abstract: Disclosed is an organic light-emitting display device in which the substrate and the encapsulation substrate are attached to each other by using a frit. The organic light-emitting display device includes a first substrate including a pixel region in which an organic light-emitting diode is formed, and a non-pixel region. The organic light-emitting diode includes an organic light-emitting layer between a first electrode and a second electrode. A second substrate attached to the first substrate. A frit is provided between the non-pixel region of the first substrate and the second substrate to attach the first substrate and the second substrate. A reinforcement material of resin is formed outside the frit.

Abstract: Disclosed is an organic light-emitting display device in which a substrate and an encapsulation substrate are completely sealed using a frit; and the preparing method of the same. The organic light-emitting display device of the present invention includes a first substrate comprising a pixel region including an organic light-emitting diode and a non-pixel region formed in an outside of the pixel region; a second substrate coalesced onto at least a pixel region of the first substrate; a frit provided between the non-pixel region of the first substrate and the second substrate to attach the substrate and the encapsulation substrate to each other; and a supplement material composed of resin formed in at least one region of each outer surface of the first substrate, the second substrate and the frit.

Abstract: A self-aligned gated field emission device and an associated method of fabrication are described. The device includes a substrate and a porous layer disposed adjacent to the surface of the substrate, wherein the porous layer defines a plurality of substantially cylindrical channels, each of the plurality of substantially cylindrical channels aligned substantially parallel to one another and substantially perpendicular to the surface of the substrate. The device also includes a plurality of substantially rod-shaped structures disposed within at least a portion of the plurality of substantially cylindrical channels defined by the porous layer and adjacent to the surface of the substrate, wherein a portion of each of the plurality of substantially rod-shaped structures protrudes above the surface of the porous layer.

Abstract: A semiconductor package comprises a chip having a top surface for chip pads and a bottom surface opposite the top surface. The top and bottom surfaces define side surfaces. The package further includes an adhesive layer provided within a chip-attaching area substantially defined by side surfaces of the chip and attaches a chip to, for example, a substrate having substrate pads. This prevents the contamination of the substrate pads by the adhesive layer. In one embodiment, the adhesive layer has at least one hole formed therethrough to expose a portion of the bottom surface of the chip. The adhesive layer may include at least one passage laterally connecting the hole to the outside. Alternatively, the adhesive layer has a plurality of adhesive parts separately disposed on the semiconductor chip.

Abstract: The present invention is directed toward field effect transistors (FETs) and thin film transistors (TFTs) comprising carbon nanotubes (CNTs) and to methods of making such devices using solution-based processing techniques, wherein the CNTs within such devices have been fractionated so as to be concentrated in semiconducting CNTs. Additionally, the relatively low-temperature solution-based processing achievable with the methods of the present invention permit the use of plastics in the fabricated devices.

Abstract: Storage capacitor design for a solid state imager. The imager includes several pixels disposed on a substrate in an imaging array pattern. Each pixel includes a photosensor coupled to a thin film switching transistor. Several scan lines are disposed at a first level with respect to the substrate along a first axis and several data lines are disposed at a second level along a second axis of the imaging array. Several data lines disposed at a second level with respect to the substrate along a second axis of the imaging array pattern. Each pixel comprises a storage capacitor coupled parallel to the photosensor, the storage capacitor comprising a storage capacitor electrode and a capacitor common electrode.

Abstract: The present invention is directed to photovoltaic devices comprising nanostructured materials, wherein such photovoltaic devices are comprised exclusively of inorganic components. Depending on the embodiment, such nanostructured materials are either 1-dimensional nanostructures or branched nanostructures, wherein such nanostructures are used to enhance the efficiency of the photovoltaic device, particularly for solar cell applications. Additionally, the present invention is also directed at methods of making and using such devices.

Abstract: An apparatus and method of managing resources in a multi protocol label switching (MPLS) network. A separate database is provided that manages resources of network elements that make up the network. Upon receipt of an external call service request, a determination is made as to whether resources for a call service is available on the network by reference to the database. Thus, the process of checking with the network elements to determine the availability of resources is omitted.

Abstract: A centralized control apparatus and a method thereof manages an Multi Protocol Label Switching (MPLS) network, in which the centralized control apparatus performs Label Switched Path (LSP) setting of the MPLS network and management for set LSP, to reduce a load of the MPLS network generated upon setting LSP and to reduce a time for setting the LSP, and to improve management efficiency for the set LSP.

Abstract: A backlight assembly of a liquid crystal display is provided. The backlight assembly of a liquid crystal display include a lamp for generating light; a light guide plate disposed at a side of the lamp to guide the light; a diffusion sheet disposed on the light guide plate to scatter the light that is incident from the light guide plate, thereby making brightness distribution of light uniform; and a prism sheet including a body part into which a light diffused from the diffusion sheet is introduced and a plurality of protrusion parts arranged in a specific direction, in which each protrusion part is shaped in a scalene triangle prism form and has both base angles different from each other.

Abstract: The present invention is directed toward field effect transistors (FETs) and thin film transistors (TFTs) comprising carbon nanotubes (CNTs) and to methods of making such devices using solution-based processing techniques, wherein the CNTs within such devices have been fractionated so as to be concentrated in semiconducting CNTs. Additionally, the relatively low-temperature solution-based processing achievable with the methods of the present invention permit the use of plastics in the fabricated devices.

Abstract: A prism sheet of an LCD includes a body part made of a transparent resin material and a plurality of polypyramid-shaped optical unit structures formed in a intaglio type on the body part. The plurality of optical unit structures have intaglio-type polypyramid shapes in an inside of their polygonal structure. A center of the intaglio portion corresponds to a vertex of the polypyramid, thereby forming a point.

Abstract: An apparatus and method for ejecting a thin IC chip from a UV-sensitive tape attached to a bottom face of a semiconductor wafer, includes a vacuum holder that partly supports the UV-sensitive tape by applying vacuum force. The apparatus further includes an ejecting block inserted in the vacuum holder and configured to move vertically relative to the vacuum holder, and a plurality of ejecting pins inserted in the ejecting block and configured to move vertically and elastically. The ejecting pins move upward from the ejecting block driven by a pin-driving plate, detaching the IC chip from the UV-sensitive tape. Then the ejecting block moves upward from the vacuum holder driven by a block-driving shaft, applying a pressure to the bottom face of the IC chip.

Abstract: Organic light emitting devices are disclosed that use a micro electromechanical system (MEMS) structure to enable a pixel and pixel array wherein each pixel contains a MEMS and an OLED element. A MEMS structure is used for switching the OLED element. These OLED/MEMS pixels can be fabricated on flex circuit, silicon, as well as other inorganic materials. They can be fabricated in a large array for developing a 2-dimensional display application and each pixel can be addressed through conventional matrix scanning addressing scheme. The ability of fabricating these OLED/MEMS pixels on flexible organic substrates as well as other rigid substrates enables wider selection of substrate materials for use with different applications.

Abstract: In a method of making an elongated carbide nanostructure, a plurality of spatially-separated catalyst particles is applied to a substrate. The spatially-separated catalyst particles and at least a portion of the substrate are exposed to a metal-containing vapor at a preselected temperature and for a period sufficient to cause an inorganic nano-structure to form between the substrate and at least one of the catalyst particles. The inorganic nano-structure is exposed to a carbon-containing vapor source at a preselected temperature and for a period sufficient to carburize the inorganic nano-structure.

Abstract: A backlight assembly of a liquid crystal display is provided. The backlight assembly of a liquid crystal display include a lamp for generating light; a light guide plate disposed at a side of the lamp to guide the light; a diffusion sheet disposed on the light guide plate to scatter the light that is incident from the light guide plate, thereby making brightness distribution of light uniform; and a prism sheet including a body part into which a light diffused from the diffusion sheet is introduced and a plurality of protrusion parts arranged in a specific direction, in which each protrusion part is shaped in a scalene triangle prism form and has both base angles different from each other.

Abstract: A backlight assembly of an LCD is provided. The backlight assembly includes a lamp for generating a light, a light guide plate disposed at a side of the lamp, for guiding the light, and a diffusion sheet and a prism sheet disposed on the light guide plate, for enhancing efficiency of the light outputted from the light guide plate, wherein the prism sheet comprises a body part and a plurality of protrusion parts each having a concavely inclined surface formed on the body part.

Abstract: The present invention provides a method and associated structure for forming an electrostatically-doped carbon nanotube device. The method includes providing a carbon nanotube having a first end and a second end. The method also includes disposing a first metal contact directly adjacent to the first end of the carbon nanotube, wherein the first metal contact is electrically coupled to the first end of the carbon nanotube, and disposing a second metal contact directly adjacent to the second end of the carbon nanotube, wherein the second metal contact is electrically coupled to the second end of the carbon nanotube.

Abstract: Storage capacitor design for a solid state imager. The imager includes several pixels disposed on a substrate in an imaging array pattern. Each pixel includes a photosensor coupled to a thin film switching transistor. Several scan lines are disposed at a first level with respect to the substrate along a first axis and several data lines are disposed at a second level along a second axis of the imaging array. Several data lines disposed at a second level with respect to the substrate along a second axis of the imaging array pattern. Each pixel comprises a storage capacitor coupled parallel to the photosensor, the storage capacitor comprising a storage capacitor electrode and a capacitor common electrode.