Abstract: One aspect of the Invention provides methods for classifying the quality of a repair response after injury to a joint of a subject. In one embodiment, the method includes providing a tissue sample from the injured region of the joint and determining expression levels in the sample of a plurality of genes, including at least those genes listed in Table 1, Table 2 and Table 3. Another aspect of the Invention provides methods of treating a human or veterinary subject having an injury to a joint based on the classification of the quality of the repair response.

Abstract: An audio signal attenuation system and method for detecting an audio emergency warning signal (or alarm) in a vehicle in which an audio signal is being played. Embodiments of the system and method make it easier for a police, fire, or other emergency alarm or siren to be heard in a loud or noisy listening environment when audio signal is being reproduced. This is achieved using selective frequency attenuation, which identifies a frequency of the alarm and then selectively attenuates the alarm frequency in the audio signal. Moreover, direction data that includes information about from which direction the alarm is coming can be used to selectively attenuate the alarm frequency in certain channels (or speakers) of the audio signal. In some embodiments, audio cues are used to alert the listener to the alarm signal and are adjusted based on alarm distance from the vehicle, speed, and the type of alarm.

Abstract: An audio signal attenuation system and method for detecting an audio emergency warning signal (or alarm) in a vehicle in which an audio signal is being played. Embodiments of the system and method make it easier for a police, fire, or other emergency alarm or siren to be heard in a loud or noisy listening environment when audio signal is being reproduced. This is achieved using selective frequency attenuation, which identifies a frequency of the alarm and then selectively attenuates the alarm frequency in the audio signal. Moreover, direction data that includes information about from which direction the alarm is coming can be used to selectively attenuate the alarm frequency in certain channels (or speakers) of the audio signal. In some embodiments, audio cues are used to alert the listener to the alarm signal and are adjusted based on alarm distance from the vehicle, speed, and the type of alarm.

Abstract: The present invention is directed to systems and methods for enhancing link integrity between two wireless cable devices through automatic link acquisition and tracking. Embodiments of the invention utilize inexpensive motors and control components to automatically enhancing signal strength between a first wireless cable device and a second wireless cable device. Either the first wireless cable device, the second wireless cable device, or both may include an omnidirectional wireless antenna. Alternatively, the first wireless cable device, the second wireless cable device, or both may include a directional antenna. In another embodiment, the first wireless cable device, the second wireless cable device, or both may include both an omnidirectional antenna and a directional antenna.

Abstract: The present invention is directed to systems and methods for enhancing link integrity between two wireless cable devices through automatic link acquisition and tracking. Embodiments of the invention utilize inexpensive motors and control components to automatically enhancing signal strength between a first wireless cable device and a second wireless cable device. Either the first wireless cable device, the second wireless cable device, or both may include an omnidirectional wireless antenna. Alternatively, the first wireless cable device, the second wireless cable device, or both may include a directional antenna. In another embodiment, the first wireless cable device, the second wireless cable device, or both may include both an omnidirectional antenna and a directional antenna.

Abstract: There are provided method and apparatus for the forming of three-dimensional objects in a layered fashion, wherein improvements are made to the support structure to improve the quality of the resulting three-dimensional objects. The support structure may include encapsulation along the interface boundary of the support-object interface to prevent or reduce the likelihood of separation of the build material, that forms the three-dimensional object, from the support material, that forms the support structure, or vice versa. The support structure may also or alternatively include both a porous support structure and a solid support structure to prevent or reduce the likelihood of separation of the support structure from the build platform and to improve the quality of the down-facing surfaces of the three-dimensional object. Methods are also provided for selectively depositing the support material and build material and for encapsulating the interface boundary with support material.

Abstract: Provided are semiconductor die flip chip packages and semiconductor die flip chip package components where certain properties of the packages/components are controlled to facilitate management of the package stresses. Also provided are fabrication methods for such packages and package components. For instance, the thickness of a die can be controlled such that the stress generated/experienced by the die is minimized. As such, the package stress is managed to suitable levels for incorporation of a low-K Si die and/or a thin package substrate. Further, a thin die can be attached to a heat spreader to increase the rigidity for easier handling during fabrication of the semiconductor die flip chip package.

Abstract: There is provided methods and apparatus for improving the accuracy of three-dimensional objects formed by additive manufacturing. By depositing or hardening build material within the interior of the layers in certain patterns, the stresses that lead to curl in the object can be isolated and controlled. Similarly, certain patterns for depositing or hardening the build material provide for reduced layer thicknesses to improve the sidewall quality of the object being formed. The patterns within the interior of the layers can include gaps or voids for particular layers being deposited or hardened, and the gaps or voids can be partially filled, fully filled, or not filled at all when subsequent layers are deposited or hardened. Accordingly, the accuracy of three-dimensional objects formed by additive manufacturing is improved.

Abstract: There are provided method and apparatus for the forming of three-dimensional objects in a layered fashion, wherein improvements are made to the support structure to improve the quality of the resulting three-dimensional objects. The support structure may include encapsulation along the interface boundary of the support-object interface to prevent or reduce the likelihood of separation of the build material, that forms the three-dimensional object, from the support material, that forms the support structure, or vice versa. The support structure may also or alternatively include both a porous support structure and a solid support structure to prevent or reduce the likelihood of, separation of the support structure from the build platform and to improve the quality of the down-facing surfaces of the three-dimensional object. Methods are also provided for selectively depositing the support material and build material and for encapsulating the interface boundary with support material.

Abstract: A system and method for packet processing are disclosed. The method may include performing using at least one processor, generating a DVB transport stream packet from a DSS transport stream packet. The generation may include mapping a prefix portion of a DSS transport stream packet into a header portion of the DVB transport stream packet comprising an inserted adaptation field. The inserted adaptation field may increase a size of the header portion of the DVB transport stream packet, and may decrease a size of a payload portion of the of the DVB transport stream. The generation may also include mapping a payload portion of the DSS transport stream packet into the payload portion of the DVB transport stream packet comprising the decreased size. The adaptation field may be at least fifty six (56) bytes in size.

Abstract: Provided are semiconductor die flip chip packages and semiconductor die flip chip package components where certain properties of the packages/components are controlled to facilitate management of the package stresses. Also provided are fabrication methods for such packages and package components. For instance, the thickness of a die can be controlled such that the stress generated/experienced by the die is minimized. As such, the package stress is managed to suitable levels for incorporation of a low-K Si die and/or a thin package substrate. Further, a thin die can be attached to a heat spreader to increase the rigidity for easier handling during fabrication of the semiconductor die flip chip package.

Abstract: Values are calculated which control the manner in which a display streamer directs the movement of display data. The values are stored in the display streamer.

Abstract: Selectively providing LC overdrive by determining a relative noise level between a current video frame and a previous video frame and overdriving the current video frame based upon the determined relative noise level.

Abstract: Provided are semiconductor die flip chip packages and semiconductor die flip chip package components where certain properties of the packages/components are controlled to facilitate management of the package stresses. Also provided are fabrication methods for such packages and package components. For instance, the thickness of a die can be controlled such that the stress generated/experienced by the die is minimized. As such, the package stress is managed to suitable levels for incorporation of a low-K Si die and/or a thin package substrate. Further, a thin die can be attached to a heat spreader to increase the rigidity for easier handling during fabrication of the semiconductor die flip chip package.

Abstract: Aspects of the method and system for converting a DSS transport stream to a DVB transport stream include encapsulating at least a prefix portion and a payload portion of a DSS transport packet into at least a header portion and a payload portion of a DVB transport packet. At least a portion of the prefix portion and the payload portion of the DSS transport packet may be mapped into at least a portion of the header portion and the payload portion of the DVB transport packet. At least a portion of the payload of the DSS transport packet may be aligned with at least a portion of the payload portion of the DVB transport packet.

Abstract: Aspects of the method and system for converting a DSS transport stream to a DVB transport stream include encapsulating at least a prefix portion and a payload portion of a DSS transport packet into at least a header portion and a payload portion of a DVB transport packet. At least a portion of the prefix portion and the payload portion of the DSS transport packet may be mapped into at least a portion of the header portion and the payload portion of the DVB transport packet. At least a portion of the payload of the DSS transport packet may be aligned with at least a portion of the payload portion of the DVB transport packet.

Abstract: Provided are semiconductor low-K Si die wire bonding packages with package stress control and fabrication methods for such packages. The packages include molding interface material applied onto the low-K Si die. In general, the molding interface material is selectively applied onto the low-K Si die surface in order to minimize to safe levels the package stress experienced by the low-K Si die. Selective application includes defining various combinatorial patterns of coated and non-coated regions. In addition, selective application may also include a general application of molding interface material to create a stress buffer zone. The results are packages with less stress experienced by the low-K Si die and so improved reliability (in compliance with industry specifications).

Abstract: The present invention is directed to a new bonding pad structure that includes a copper pad and a pad surface finish comprising multiple layers of solder. The multiple layers of solder include at least a layer of eutectic solder (or a layer of pure-Sn solder) covering the copper pad and a layer of high-Pb solder covering the layer of eutectic solder (or the layer of pure-Sn solder). Since the layer of high-Pb solder is significantly thicker than the eutectic solder layer (or the layer of pure-Sn solder), there is insufficient tin supply in the eutectic solder (or the layer of pure-Sn solder) for forming a thick Cu/Sn intermetallic layer on the copper pad. Instead, a thin Cu/Sn intermetallic layer is formed on the copper pad and there is less likelihood of forming a crack in the thin Cu/Sn intermetallic layer.

Abstract: Provided are a semiconductor low-K Si die flip chip package with warpage control and fabrication methods for such packages. The packages include heat spreaders that are attached to the low-K Si die and packaging substrate. In general, the modulus of the thermal interface material, which is used to attach the heat spreader to the low-K Si die, is selected as high as possible relative to other commercially available thermal interface materials. On the other hand, the modulus of the adhesive, which is used to attach the heat spreader via an optional stiffener to the substrate, is selected as low as possible relative to other commercially available adhesives. The result is a package with less bowing and so improved co-planarity (in compliance with industry specifications) with the surface to which it is ultimately bound. Moreover, the low-K Si die and package reliabilities are thereby enhanced.

Abstract: A bit timing signal is regenerated from an encoded digital signal in a receiver using a predetermined sample rate Fs. An input pulse signal is generated in response to predetermined transitions of the encoded digital signal. A clock count signal is generated having a variable clock period according to cyclical counting of the clock count signal up to a count value S at the predetermined sample rate, the count value alternating between an upper value Su and a lower value Sl so that the variable clock period has an average length substantially equal to a data bit period of the encoded digital signal. The clock count signal is synchronized with the encoded digital signal by 1) counting the input pulse signals to generate a pulse count, 2) counting sampling periods between successive input pulse signals to generate a sample count, and 3) generating a sync signal if the pulse count is greater than a pulse threshold and the sample count is greater than a sample threshold.