Abstract: An example memory sub-system comprises: a memory device; and a processing device, operatively coupled with the memory device. The processing device is configured to: receive a first host data item; store the first host data item in a first page of a first logical unit of a memory device, wherein the first page is associated with a fault tolerant stripe; receive a second host data item; store the second host data item in a second page of the first logical unit of the memory device, wherein the second page is associated with the fault tolerant stripe, and wherein the second page is separated from the first page by one or more wordlines including a dummy wordline storing no host data; and store, in a third page of a second logical unit of the memory device, redundancy metadata associated with the fault tolerant stripe.

Abstract: A device includes a memory array and a sense amplifier (SA) coupled with the memory array and with an input/output (I/O) data line. The SA is to receive bits of data over the I/O data line in association with a program operation. A digital-to-analog converter (DAC) is coupled with the SA, the DAC to convert the bits of data to an analog voltage value. An analog memory element is coupled with the DAC, the analog memory element to store the analog voltage value for a period of time until the bits of data are programmed to the memory array.

Abstract: Memory devices and methods for operating the same are described. The memory devices may include non-volatile memory having a plurality of memory cells, and a controller. The controller may be configured to begin a first programming operation configured to program a first one of the plurality of memory cells with more than one bit of information, terminate the first programming operation in response to detecting a power loss event, and program, with a second programming operation, second and third ones of the plurality of memory cells with the more than one bit of information.

Abstract: A system includes a memory array with sub-blocks, each sub-block having groups of memory cells. A processing device, operatively coupled with the memory array, is to perform operations including performing, after a wordline is programmed through the sub-blocks, scanning of the wordline. The scanning includes selecting, to sample first data of the wordline, a first group of the groups of memory cells of a first sub-block of the sub-blocks; selecting, to sample second data of the wordline, a second group of the groups of memory cells of a second sub-block of the sub-blocks; concurrently reading the first data from the first group and the second data from the second group of the groups of memory cells; and performing an error check of the wordline using the first data and the second data.

Abstract: A device includes a memory array and a sense amplifier (SA) coupled with the memory array and with an input/output (I/O) data line. The SA is to receive bits of data over the I/O data line in association with a program operation. A digital-to-analog converter (DAC) is coupled with the SA, the DAC to convert the bits of data to an analog voltage value. An analog memory element is coupled with the DAC, the analog memory element to store the analog voltage value for a period of time until the bits of data are programmed to the memory array.

Abstract: A page buffer circuit in a memory device includes a logic element configured to perform a series of calculations pertaining to one or more memory access operations and generate a plurality of calculation results associated with the series of calculations and a dynamic memory element coupled with the logic element and configured to store the plurality of calculation results. The page buffer circuit further includes an isolation element coupled between the logic element and the dynamic memory element, the isolation element to permit a calculation result from the logic element to pass to the dynamic memory element when activated and a circuit coupled to the dynamic memory element and configured to perform pre-charging operations associated with the one or more memory access operations and based at least in part on the plurality of calculation results stored in the dynamic memory element.

Abstract: A first programming pulse is caused to be applied to a wordline associated with a memory cell of the memory sub-system. In response to first programming pulse, causing a program verify operation to be performed to determine a measured threshold voltage associated with the memory cell. The measured threshold voltage associated with the memory cell is stored in a sensing node. A determination is made that the measured threshold voltage of the memory cell satisfies a condition and the measured threshold voltage stored in the sensing node is identified. A bitline voltage matching the measured threshold voltage is caused to be applied to a bitline associated with the memory cell.

Abstract: Memory might include a controller configured to determine, for each sense circuit of a plurality of sense circuits, a respective plurality of first logic levels for that sense circuit while capacitively coupling a respective plurality of voltage levels to its respective sense node, to determine a particular voltage level in response to each respective plurality of first logic levels for the plurality of sense circuits and their respective plurality of voltage levels, and to determine, for each sense circuit of the plurality of sense circuits, a respective second logic level for that sense circuit while capacitively coupling the particular voltage level to its respective sense node.

Abstract: A memory device to calibrate voltages used to read a group of memory cells. For example, the memory device measures first signal and noise characteristics of a group of memory cells by reading the group of memory cells at first test voltages that are separated from each other by a first voltage interval. An estimate of a read level of the group of memory cells is determined based on the first signal and noise characteristics. The memory device then measures second signal and noise characteristics of the group of memory cells by reading the group of memory cells at second test voltages that are separated from each other by a second voltage interval that is smaller than the first voltage interval. An optimized read voltage for the read level is computed from the second signal and noise characteristics.

Abstract: Memories having a controller configured, during a pre-charge portion of a read operation, to apply a sequence of increasing voltage levels concurrently to each access line of a plurality of access lines, wherein each voltage level of the sequence of increasing voltage levels is higher than any previous voltage level of the sequence of increasing voltage levels and lower than any subsequent voltage level of the sequence of increasing voltage levels, and determine a particular voltage level of the sequence of increasing voltage levels corresponding to a point at which all memory cells of the plurality of strings of series-connected memory cells are first deemed to be activated while applying the sequence of increasing voltage levels.

Abstract: A memory sub-system configured to improve performance using signal and noise characteristics of memory cells measured during the execution of a command in a memory component. For example, the memory component is enclosed in an integrated circuit and has a calibration circuit. The signal and noise characteristics are measured by the calibration circuit as a byproduct of executing the command in the memory component. A processing device separate from the memory component transmits the command to the memory component, and receives and processes the signal and noise characteristics to identify an attribute about the memory component. Subsequently, an operation related to data stored in the memory component can be performed based on the attribute.

Abstract: A page buffer circuit in a memory device includes a logic element configured to perform a series of calculations pertaining to one or more memory access operations and generate a plurality of calculation results associated with the series of calculations and a dynamic memory element coupled with the logic element and configured to store the plurality of calculation results. The page buffer circuit further includes an isolation element coupled between the logic element and the dynamic memory element, the isolation element to permit a calculation result from the logic element to pass to the dynamic memory element when activated and one or more bitline driver circuits coupled to the dynamic memory element and configured to perform pre-charging operations associated with the one or more memory access operations and based at least in part on the plurality of calculation results stored in the dynamic memory element.

Abstract: Memory might include controller configured to apply a first predetermined voltage level to a capacitance of a sense circuit during a first sensing stage of a sensing operation, determine a first value of an output of the particular sense circuit while applying the first predetermined voltage level, apply a second predetermined voltage level to the capacitance during a second sensing stage of the sensing operation, determine a second value of the output of the particular sense circuit while applying the second predetermined voltage level, determine a particular voltage level in response to at least the first value and the second value, and apply the particular voltage level to the capacitance during a final sensing stage of the sensing operation.

Abstract: The present disclosure includes apparatuses and methods for determining soft data. A number of embodiments include determining soft data associated with a data state of a memory cell. In a number of embodiments, the soft data may be determined by performing a single stepped sense operation on the memory cell.

Abstract: Memory systems and memory control methods are described.

Abstract: A memory sub-system configured to improve performance using signal and noise characteristics of memory cells measured during the execution of a command in a memory component. For example, the memory component is enclosed in an integrated circuit and has a calibration circuit. The signal and noise characteristics are measured by the calibration circuit as a byproduct of executing the command in the memory component. A processing device separate from the memory component transmits the command to the memory component, and receives and processes the signal and noise characteristics to identify an attribute about the memory component. Subsequently, an operation related to data stored in the memory component can be performed based on the attribute.

Abstract: A page buffer circuit in a memory device includes a logic element configured to perform a series of calculations pertaining to one or more memory access operations and generate a plurality of calculation results associated with the series of calculations and a dynamic memory element coupled with the logic element and configured to store the plurality of calculation results. The page buffer circuit further includes an isolation element coupled between the logic element and the dynamic memory element, the isolation element to permit a calculation result from the logic element to pass to the dynamic memory element when activated and one or more bitline driver circuits coupled to the dynamic memory element and configured to perform pre-charging operations associated with the one or more memory access operations and based at least in part on the plurality of calculation results stored in the dynamic memory element.

Abstract: A memory device to calibrate voltages used to read a group of memory cells. For example, the memory device measures first signal and noise characteristics of a group of memory cells by reading the group of memory cells at first test voltages that are separated from each other by a first voltage interval. An estimate of a read level of the group of memory cells is determined based on the first signal and noise characteristics. The memory device then measures second signal and noise characteristics of the group of memory cells by reading the group of memory cells at second test voltages that are separated from each other by a second voltage interval that is smaller than the first voltage interval. An optimized read voltage for the read level is computed from the second signal and noise characteristics.

Abstract: The present disclosure includes apparatuses and methods for determining soft data. A number of embodiments include determining soft data associated with a data state of a memory cell. In a number of embodiments, the soft data may be determined by performing a single stepped sense operation on the memory cell.

Abstract: Memory systems and memory control methods are described.