Abstract: In some embodiments, an array of sleep transistors is provided, wherein a combination of said transistors may be enabled during an active mode to reduce leakage depending on the leakage characteristics of a chip or associated chip.

Abstract: Methods and associated structures of forming a microelectronic device are described. Those methods may comprise forming a channel region on a substrate, wherein the channel region comprises at least one CNT, forming at least one source/drain region adjacent the channel region, and then forming a gate electrode on the channel region, wherein a width of the gate electrode comprises about 50 percent to about 90 percent of a width of the contact region.

Abstract: In one embodiment of the invention, a fuse element for a one time programmable memory may include carbon nanotubes coupled to a first transistor node and to a second transistor node. The carbon nanotubes may have a first resistance which may be changed upon programming the memory cell with low current levels.

Abstract: Methods and apparatuses to increase a surface area of a memory cell capacitor are described. An opening in a second insulating layer deposited over a first insulating layer on a substrate is formed. The substrate has a fin. A first insulating layer is deposited over the substrate adjacent to the fin. The opening in the second insulating layer is formed over the fin. A first conducting layer is deposited over the second insulating layer and the fin. A third insulating layer is deposited on the first conducting layer. A second conducting layer is deposited on the third insulating layer. The second conducting layer fills the opening. The second conducting layer is to provide an interconnect to an upper metal layer. Portions of the second conducting layer, third insulating layer, and the first conducting layer are removed from a top surface of the second insulating layer.

Abstract: Methods and apparatuses to increase a surface area of a memory cell capacitor are described. An opening in a second insulating layer deposited over a first insulating layer on a substrate is formed. The substrate has a fin. A first insulating layer is deposited over the substrate adjacent to the fin. The opening in the second insulating layer is formed over the fin. A first conducting layer is deposited over the second insulating layer and the fin. A third insulating layer is deposited on the first conducting layer. A second conducting layer is deposited on the third insulating layer. The second conducting layer fills the opening. The second conducting layer is to provide an interconnect to an upper metal layer. Portions of the second conducting layer, third insulating layer, and the first conducting layer are removed from a top surface of the second insulating layer.

Abstract: A register file employing a shared supply structure to improve the minimum supply voltage.

Abstract: Sequential circuits with error-detection are provided. They may, for example, be used to replace traditional master-slave flip-flops, e.g., in critical path circuits to detect and initiate correction of late transitions at the input of the sequential. In some embodiments, such sequentials may comprise a transition detector with a time borrowing latch.

Abstract: Methods and apparatus relating to disabling one or more cache portions during low voltage operations are described. In some embodiments, one or more extra bits may be used for a portion of a cache that indicate whether the portion of the cache is capable at operating at or below Vccmin levels. Other embodiments are also described and claimed.

Abstract: For one embodiment, an apparatus may include a memory cell to store a bit value, wherein the memory cell may lose the bit value in response to a memory access operation. The apparatus may also include first circuitry to detect whether the memory cell loses the bit value in response to the memory access operation and second circuitry to restore the bit value in the memory cell in response to detection that the memory cell loses the bit value. Other embodiments include other apparatuses, methods, and systems.

Abstract: A multiphase DC-DC converter is provided that includes a multiphase transformer, the multiphase transformer including a plurality of input voltage terminals and an transformer output voltage terminal, each input voltage terminal associated with a corresponding phase. Each phase is assigned to an input voltage terminal of the plurality of input voltage terminals to minimize a ripple current at the input voltage terminals of the multiphase transformer.

Abstract: For one disclosed embodiment, an integrated circuit may comprise a memory array on the integrated circuit and access control circuitry on the integrated circuit. The memory array may have a bit line with one or more resistors along the bit line and may have a plurality of memory cells coupled to the bit line at a plurality of locations along the bit line. At least one resistor along the bit line may be between two locations at which memory cells are coupled to the bit line. The access control circuitry may be to select a memory cell coupled to the bit line and to sense a signal on the bit line from the selected memory cell. Other embodiments are also disclosed.

Abstract: Methods and apparatus to reduce minimum operating voltage through a hybrid cache design are described. In one embodiment, a cache with different size bit cells may be used, e.g., to reduce minimum operating voltage of an integrated circuit device that includes the cache and possibly other logic (such as a processor). Other embodiments are also described.

Abstract: A multiphase DC-DC converter is provided that includes a multiphase transformer, the multiphase transformer including a plurality of input voltage terminals and an transformer output voltage terminal, each input voltage terminal associated with a corresponding phase. Each phase is assigned to an input voltage terminal of the plurality of input voltage terminals to minimize a ripple current at the input voltage terminals of the multiphase transformer.

Abstract: In one embodiment of the invention, a fuse element for a one time programmable memory may include carbon nanotubes coupled to a first transistor node and to a second transistor node. The carbon nanotubes may have a first resistance which may be changed upon programming the memory cell with low current levels.

Abstract: Methods and apparatuses to increase a surface area of a memory cell capacitor are described. An opening in a second insulating layer deposited over a first insulating layer on a substrate is formed. The substrate has a fin. A first insulating layer is deposited over the substrate adjacent to the fin. The opening in the second insulating layer is formed over the fin. A first conducting layer is deposited over the second insulating layer and the fin. A third insulating layer is deposited on the first conducting layer. A second conducting layer is deposited on the third insulating layer. The second conducting layer fills the opening. The second conducting layer is to provide an interconnect to an upper metal layer. Portions of the second conducting layer, third insulating layer, and the first conducting layer are removed from a top surface of the second insulating layer.

Abstract: A capacitor includes a substrate (110, 210), a first electrically insulating layer (120, 220) over the substrate, and a fin (130, 231) including a semiconducting material (135) over the first electrically insulating layer. A first electrically conducting layer (140, 810) is located over the first electrically insulating layer and adjacent to the fin. A second electrically insulating layer (150, 910) is located adjacent to the first electrically conducting layer, and a second electrically conducting layer (160, 1010) is located adjacent to the second electrically insulating layer. The first and second electrically conducting layers together with the second electrically insulating layer form a metal-insulator-metal stack that greatly increases the capacitance area of the capacitor. In one embodiment the capacitor is formed using what may be referred to as a removable metal gate (RMG) approach.

Abstract: An error-detection flip-flop is disclosed for identifying timing errors in digital circuits. The error-detection flip-flop is a master-slave flip-flop including logic to determine whether an input signal is received during a predetermined clock period, signifying a timing error. The error-detection flip-flop produces a variable-length error pulse, which may be combined with other error pulses and converted to a stable signal for sampling by error-correction circuitry. The error-detection flip-flop does not increase the clocking power of the digital circuit and consumes little additional circuit area.

Abstract: For one disclosed embodiment, an apparatus may comprise cache memory circuitry including multiple portions of destructive read memory cells and access control circuitry to access portions of destructive read memory cells. The apparatus may also comprise address hash logic to receive an address and to generate a hashed address based at least in part on at least a portion of the received address using a hashing technique to help distribute accesses by the access control circuitry across different portions of destructive read memory cells. Other embodiments are also disclosed.

Abstract: For one disclosed embodiment, an apparatus may comprise a memory cell to store a bit value, wherein the memory cell may lose the bit value in response to a memory access operation. The apparatus may also comprise first circuitry to detect whether the memory cell loses the bit value in response to the memory access operation and second circuitry to restore the bit value in the memory cell in response to detection that the memory cell loses the bit value. Other embodiments are also disclosed.

Abstract: For one disclosed embodiment, an integrated circuit may comprise a memory array on the integrated circuit and access control circuitry on the integrated circuit. The memory array may have a bit line with one or more resistors along the bit line and may have a plurality of memory cells coupled to the bit line at a plurality of locations along the bit line. At least one resistor along the bit line may be between two locations at which memory cells are coupled to the bit line. The access control circuitry may be to select a memory cell coupled to the bit line and to sense a signal on the bit line from the selected memory cell. Other embodiments are also disclosed.