Patents by Inventor Volume Chien

Volume Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for reducing cu surface defects following cu ECP
    Publication number: 20040004004
    Abstract: A method for cleaning an electrodeposition surface following an electroplating process including providing a process surface including electro-chemically deposited metal following an electrodeposition process; and, cleaning the process surface with a sulfuric acidic cleaning solution to remove electrodeposited metal particles according to at least one of an immersion and spraying process the spraying process including simultaneously rotating the process surface.
    Type: Application
    Filed: July 2, 2002
    Publication date: January 8, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Liang Chueh, Volume Chien, Shih-Ming Wang