Abstract: A rolling bearing cage includes axially spaced side rings, cage webs connecting the side rings, cage pockets, and first and second cage ends. The cage webs have rolling element guides projecting radially inwards and the cage pockets are formed between the rolling element guides. The first cage end has a closing element formed by an axial groove at a radial web surface of a cage web that is reinforced relative to the other cage webs and delimits a penultimate cage pocket. The second cage end has a closing element formed by a partial cage web connecting the end portions at the second cage end to one another. The partial cage web is arranged to hook into the axial groove to form a cage lock that secures the second cage end to the first cage end against unintentional loosening in a peripheral direction and in both radial directions.

Abstract: A plastic cage consists of two side rings that have a common axis of rotation and are axially spaced apart from one another, and a plurality of cage webs that connect the side rings to one another and between which pockets are formed for receiving rolling elements, wherein the plastic cage is axially slotted at at least one peripheral location by a parting line which defines a first cage end and a second cage end and at the boundary surfaces of which mutually corresponding closure elements are located, by means of which the first and second cage ends can be fixed relative to one another both in the axial and radial direction and in the peripheral direction.

Abstract: A rolling bearing cage includes axially spaced side rings, cage webs connecting the side rings, cage pockets, and first and second cage ends. The cage webs have rolling element guides projecting radially inwards and the cage pockets are formed between the rolling element guides. The first cage end has a closing element formed by an axial groove at a radial web surface of a cage web that is reinforced relative to the other cage webs and delimits a penultimate cage pocket. The second cage end has a closing element formed by a partial cage web connecting the end portions at the second cage end to one another. The partial cage web is arranged to hook into the axial groove to form a cage lock that secures the second cage end to the first cage end against unintentional loosening in a peripheral direction and in both radial directions.

Abstract: The invention relates to an inner-ring-fastened roller sleeve (1), comprising: —an inner ring (2), which is fastened on a shaft or axle; and—a roller-and-cage assembly (3), which is disposed on said inner ring (2) and is formed by a bearing cage (4), which consists of two side rings (5, 6) and a plurality of connecting webs (7), and by a plurality of roller-type rolling elements (8) inserted into said bearing cage (4), which roller-type rolling elements are retained by the bearing cage (4) at regular spacings in the circumferential direction and roll on an inner raceway (9) formed by the outer lateral surface of the inner ring (2), wherein the roller-and-cage assembly (3) is axially guided by means of two flanges (10, 11), which are provided on the axial sides of the inner ring (2) and extend radially outward.

Abstract: The present disclosure relates to a method for producing a carbon-silicon composite material powder, comprising: providing a carbon-containing precursor, which is lignin; providing at least one silicon-containing active material; melt-mixing at least said carbon-containing precursor and said silicon-containing active material(s) to a melt-mixture; providing said melt-mixture in a non-fibrous form and cooling the melt- mixture to provide an isotropic intermediate composite material; subjecting said isotropic intermediate composite material to a thermal treatment, wherein said thermal treatment comprises a carbonization step to provide a carbon-silicon composite material, and subjecting said carbon-silicon composite material to pulverization to provide said carbon-silicon composite material powder.

Abstract: A mixture comprising a) biodiesel, and b) 10% to 60% by weight, in particular 15% to 40% by weight, of benzyl hemiformal.

Abstract: An integrated circuit includes a lead frame, a first die, and a second die. The first die is bonded to and electrically connected to the lead frame. The second die is electrically connected to and spaced apart from the first die.

Abstract: Electronic packages and related methods are disclosed. An example electronic package apparatus includes a substrate and an electronic component. A protective material is positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component. An enclosure is coupled to the substrate to cover the protective material and the electronic component.

Abstract: The invention refers to a fungicide mixture comprising the biocides thiabendazole (TBZ), pyrimethanil (PYM) and fludioxonil (FDL), wherein the total amount of FDL based on the entire amount of biocidal actives is greater than 2 wt. %.

Abstract: The invention refers to a fungicide mixture comprising the biocides TBZ and PYM in the weight ratio of 20:1 to 1.1:1, in particular 10:1 to 1.1:1, preferably 5:1 to 1.1:1, wherein the total amount of TBZ and PYM based on the entire amount of biocidal actives is greater than 99 wt. % and its use for protecting wallboards.

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

Abstract: A wallboard comprising a gypsum core and a facing layer, containing a fungicidally effective amount of thiabendazole (TBZ) and 2-butyl-1,2-benzisothiazolin-3-one (BBIT).

Abstract: A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.

Abstract: A mixture comprising a) biodiesel, and b) 10% to 60% by weight, in particular 15% to 40% by weight, of benzyl hemiformal.

Abstract: Rechargeable, non-aqueous lithium batteries which contain, as active anode material, either lithium metal or a lithium alloy, an active cathode material with a redox potential in the range of between 1.5 and 3.4 V vs Li/Li+ and lithium rhodanide (LiSCN) as electrolyte component. One or more related methods for providing overcharge protection are also described herein.

Abstract: A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.

Abstract: Electronic packages and related methods are disclosed. An example electronic package apparatus includes a substrate and an electronic component. A protective material is positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component. An enclosure is coupled to the substrate to cover the protective material and the electronic component.

Abstract: A floating die package including a cavity formed through sublimation of a sacrificial die encapsulant and sublimation or separation of die attach materials after molding assembly. A pinhole vent in the molding structure is provided as a sublimation path to allow gases to escape, whereby the die or die stack is released from the substrate and suspended in the cavity by the bond wires only.

Abstract: A control device for mechanically actuating a component may include a housing surrounding a housing interior, at least one fastening sleeve integrally disposed on the housing, and at least one connection opening disposed at the at least one fastening sleeve. The at least one fastening sleeve may surround a fastening opening into which a pin-shaped fastening element may be insertable. One end of the at least one connection opening may lead to a sleeve inner side. The at least one fastening sleeve may be arranged at a housing outer side. The fastening opening may extend outside of the housing interior. Another end of the at least one connection opening may lead to a housing inner side. The at least one connection opening may be covered on the housing inner side via a membrane penetrable by gas and impenetrable by liquid.

Abstract: A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.