Abstract: In a method of manufacturing a porous coke suitable as a charge-storing material in electrochemical capacitors, one manufactures or provides a non-calcined isotropic coke with spherical or onion-shaped morphology and low graphitizability as a starting material. The starting material is comingled with a caustic alkali to obtain a homogenous mixture. The homogenous mixture is heat treated at a temperature in a range between 650 and 950° C. to obtain the porous coke. The porous coke is washed and neutralized.

Abstract: A hermetic MEMS device (100) comprising a carrier (110) having a surface (111) including a device (101) and an attachment stripe (122), the stripe spaced from the device and surrounding the device; a metallic foil (102) having a central bulge portion (103) and a peripheral rim portion (104) meeting the stripe, the bulge cross section parallel to the carrier monotonically decreasing from the rim (104) towards the bulge apex (105); and the foil positioned over the carrier surface so that the bulge arches over the device and the rim forms a seal with the stripe.

Abstract: A semiconductor system (200) of one or more semiconductor interposers (201) with a certain dimension (210), conductive vias (212) extending from the first to the second surface, with terminals and attached non-reflow metal studs (215) at the ends of the vias. A semiconducting interposer surface may include discrete electronic components or an integrated circuit. One or more semiconductor chips (202, 203) have a dimension (220, 230) narrower than the interposer dimension, and an active surface with terminals and non-reflow metal studs (224, 234). One chip is flip-attached to the first interposer surface, and another chip to the second interposer surface, so that the interposer dimension projects over the chip dimension. An insulating substrate (204) has terminals and reflow bodies (242) to connect to the studs of the projecting interposer.

Abstract: A semiconductor system (200) of one or more semiconductor interposers (201) with a certain dimension (210), conductive vias (212) extending from the first to the second surface, with terminals and attached non-reflow metal studs (215) at the ends of the vias. A semiconducting interposer surface may include discrete electronic components or an integrated circuit. One or more semiconductor chips (202, 203) have a dimension (220, 230) narrower than the interposer dimension, and an active surface with terminals and non-reflow metal studs (224, 234). One chip is flip-attached to the first interposer surface, and another chip to the second interposer surface, so that the interposer dimension projects over the chip dimension. An insulating substrate (204) has terminals and reflow bodies (242) to connect to the studs of the projecting interposer.

Abstract: A semiconductor system (300) has one or more packaged active subsystems (310, 330); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on top of each other, assembled on the substrate. The system further has a packaged passive subsystem (320) including a substrate with electrical contacts and passive electrical components, such as resistors, capacitors, and indictors. The passive subsystem is stacked with the active subsystems and connected to them by solder bodies.

Abstract: Disclosed is a method for producing surface-modified materials, such as core-shell materials with the core and the shell(s) being different distinct phases, or materials with a concentration gradient of one or more dopant or substituent element(s) from the surface to the bulk. The method comprises (i) treating the bulk of material with a solution containing a first solvent and at least one flocculant comprising a soluble polymer so that the flocculant adheres to the bulk; (ii) subsequently contacting the flocculant-treated bulk of step (i) with a dispersion containing a second solvent and the particulate solid particles to deposit the particulate solid particles on the flocculant-treated bulk; and (iii) subsequently treating the resultant of step (ii) with heat. This method can in particular be applied to produce surface-modified cathode materials for Li batteries with improved performance.

Abstract: A jaw for the chuck of a turning device such as a lathe generally comprises a base, a tooth adjustable relative to the base in the radial direction and a cam for adjusting the tooth position. The base may be held on the chuck and driven in a conventional manner. The tooth has a face for engaging a workpiece and is attached to the base such that the face is radially movable relative to the base. The cam includes a surface bearing against the base and a surface bearing against the tooth. The cam varies in thickness such that movement of the cam changes the radial distance between the base and the tooth. In exemplary embodiments, the cam is an eccentric cylinder that rotates to adjust the tooth or is wedge shaped and one or both of the bearing surfaces of the tooth and base are ramps.

Abstract: A semiconductor device with a first (101) and a second (111) semiconductor chip assembled on an insulating flexible interposer (120). The interposer, preferably about 25 to 50 ?m thick, has conductive traces (121), a central planar rectangular area and on each side of the rectangle a wing bent at an angle from the central plane. The central area has metal studs (122, 123) on the top and the bottom surface, which match the terminals of the chips, further conductive vias of a pitch center-to-center about 50 ?m or less. The side wings have contact pads (130) with metallic connectors (131) on the bottom surface; the connectors may be solder balls, metal studs, or anisotropic conductive films. The second chip is adhesively attached to a substrate, whereby the interposer faces away from the substrate. The interposer side wings have a convex bending (150) downwardly along the second chip and a concave bending (151) over the substrate; the side wing connectors are attached to the matching substrate sites.

Abstract: The present invention relates methods for patching WWAN (Wireless Wide Area Network) communication devices and corresponding WWAN communication devices, integrated circuit chips and computer-readable media. The WWAN communication device includes a first processor, a second processor and a memory. The first processor is arranged to process patches updating software running on the WWAN communication device. The second processor is arranged to provide a first set of the patches to the first processor. The memory stores a second set of the patches to be processed by the first processor. The second processor is further arranged to send a patch end signal to the first processor, the patch end signal causing the first processor to stop processing of patches provided by the second processor. The first processor is further arranged to process the patches stored in the memory independently of the patch end signal.

Abstract: A semiconductor system (300) has one or more packaged active subsystems (310, 330); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on top of each other, assembled on the substrate. The system further has a packaged passive subsystem (320) including a substrate with electrical contacts and passive electrical components, such as resistors, capacitors, and indictors. The passive subsystem is stacked with the active subsystems and connected to them by solder bodies.

Abstract: A packaged semiconductor device (200) with a substrate (220) having, sandwiched in an insulator (221), a flat sheet-like sieve member (240) made of a non-linear material switching from insulator to conductor mode at a preset voltage. Both member surfaces are free of indentations; the member is perforated by through-holes, which are grouped into a first set (241) and a second set (242). Metal traces (251) over one member surface are positioned across the first set through-holes (241); each trace is connected to a terminal on the substrate top and, through the hole, to a terminal on the substrate bottom. Analogous for metal traces (252) over the opposite member surface and second set through-holes (242). Traces (252) overlap with a portion of traces (252) to form the locations for the conductivity switches, creating local ultra-low resistance bypasses to ground for discharging overstress events.

Abstract: Aqueous formulations having a pH of >10 of 1,2-benzoisothiazolin-3-one (BIT) and/or its alkali metal salts and tetramethylolacetylenediurea (TMAD) are outstandingly suitable for protecting industrial materials and products from infection and destruction by microorganisms.

Abstract: A four-wheeled vehicle includes a steering mechanism having a bar handle, right and left front wheels, and right and left rear wheels. The vehicle includes a front cover and a windshield disposed in front of the bar handle. The vehicle includes a driver's seat, and a rear passenger seat disposed behind the driver's seat and between the rear wheels. The rear passenger seat is directed forwardly. The vehicle includes a power unit part disposed below the rear passenger seat, and a body cover disposed rearwardly of the driver's seat.

Abstract: A package-on-package system (100) has a first subsystem (191) interconnected with a second subsystem (192) by solder connectors (193). The first subsystem has an insulating, trace-laminated, sheet-like carrier (101), which is laminated (102) with an insulating trace-laminated frame (110) exposing a central portion (103) of the carrier. A first chip (160) is disposed in the central portion, with a second chip (170) on top; the height of the assembled chips approximates the frame height (111). Bondable contact pads (104) are in the central portion, and solderable terminals (121; pitch center-to-center 0.65 mm or less) on the frame. The second subsystem has a laminated substrate (194) with at least one chip (196) attached, and terminals (195) in locations matching the terminals (121) on the frame of the first subsystem. The terminals of both subsystems are interconnected with solder (193) of a higher reflow temperature than additional solder balls (190) for connecting to external parts.

Abstract: An insulating sheet-like substrate (601), which has on one surface (601a) a first patterned metal layer (605) with a first (603a) and a second (603b) array of contact pads. The pads of the first array have a first pitch center-to-center, and each pad has a first perimeter. The pads of the second array have a second pitch center-to-center, and each pad has the first perimeter. The substrate has on its other surface (601b) a second patterned metal layer (606) with a third array (607) of contact pads, which has the first pitch center-to-center, and each pad has a third perimeter. Conductive vias (640) between the first and the second metal layers connect contact pads and have a fourth perimeter; the vias are placed in interstitial locations so that the fourth perimeter does not intersect with the first and third perimeters. Vias in interstitial locations can be provided by disposing the first array and the third array so that the first and third perimeters of respective contact pads are concentrically aligned.

Abstract: A semiconductor system (200) of one or more semiconductor interposers (201) with a certain dimension (210), conductive vias (212) extending from the first to the second surface, with terminals and attached non-reflow metal studs (215) at the ends of the vias. A semiconducting interposer surface may include discrete electronic components or an integrated circuit. One or more semiconductor chips (202, 203) have a dimension (220, 230) narrower than the interposer dimension, and an active surface with terminals and non-reflow metal studs (224, 234). One chip is flip-attached to the first interposer surface, and another chip to the second interposer surface, so that the interposer dimension projects over the chip dimension. An insulating substrate (204) has terminals and reflow bodies (242) to connect to the studs of the projecting interposer.

Abstract: The invention relates to novel biocidal active substance mixtures containing o-phenylphenol and amines, methods for the production thereof the use thereof for protecting technical materials and products from being infested and destroyed by microorganisms, and microbicidal agents based on said novel mixtures.

Abstract: Novel phenylcyclohexanes of the formula I in which n is 0 to 7, Q1 and Q2 are H, or one of these radicals is alternatively CH3, r is 0, 1, 2, 3, 4 or 5, A is trans-1,4-cyclohexylene, 1,4-phenylene, 3-fluoro-1,4-phenylene or a single bond, X is F, Cl, —CF3, —CN, —OCF3 or —OCHF2, and Y and Z are each, independently of one another, H or F, with the proviso that, in the case where A is a single bond, Q1=Q2=H and simultaneously X=CN, Y and/or Z are F.

Abstract: A semiconductor system (200) of one or more semiconductor interposers (201) with a certain dimension (210), conductive vias (212) extending from the first to the second surface, with terminals and attached non-reflow metal studs (215) at the ends of the vias. A semiconducting interposer surface may include discrete electronic components or an integrated circuit. One or more semiconductor chips (202, 203) have a dimension (220, 230) narrower than the interposer dimension, and an active surface with terminals and non-reflow metal studs (224, 234). One chip is flip-attached to the first interposer surface, and another chip to the second interposer surface, so that the interposer dimension projects over the chip dimension. An insulating substrate (204) has terminals and reflow bodies (242) to connect to the studs of the projecting interposer.

Abstract: The present invention relates to novel difluoromethylthiazolylcarboxanilides of the formula (I) in which R1, R2, R3, R4 and R5 are as defined in the disclosure, to a plurality of processes for preparing these substances and their use for controlling unwanted microorganisms, and to novel intermediates and their preparation.